EP-4737082-A1 - BREAKING DEVICE AND BREAKING METHOD

Abstract

To break a substrate with high quality, which is difficult to break, a breaking device (100) includes a table (3) and a breaking member (1). A substrate (S) having a scribe line (SL) formed is placed on the table (3). The breaking member (1) presses the substrate (S) placed on the table (3) at the part where the scribe line (SL) is formed, so as to break the substrate (S) along the scribe line (SL). The table (3) has a Young's modulus of 1 to 10 GPa.

Inventors

• TAKEDA, MASAKAZU
• TAMURA, KENTA
• NAKAGUCHI, Yuki
• YAMANAKA, Ryota

Assignees

• Mitsuboshi Diamond Industrial Co., Ltd.

Dates

Publication Date

20260506

Application Date

20240628

Claims (6)

1. A breaking device comprising: a table on which a substrate on which a scribe line is formed is placed; and a breaking member configured to press the substrate placed on the table at the part where the scribe line is formed, so as to break the substrate along the scribe line, wherein the table has a Young's modulus of 1 to 10 GPa.
2. The breaking device according to claim 1, wherein the table is made of a resin material.
3. The breaking device according to claim 1, wherein the table includes a first table made of a glass member and a second table disposed on the first table, and the second table has a Young's modulus of 1 to 10 GPa.
4. The breaking device according to claim 1, wherein the substrate includes a plate-like substrate made of a brittle material and a metal layer formed on a first surface of the plate-like substrate.
5. The breaking device according to claim 4, wherein the scribe line is formed on a second surface opposite to the first surface of the plate-like substrate, and the breaking member presses the plate-like substrate on the first surface so as to break the substrate.
6. A method for breaking a substrate comprising: forming a scribe line on the substrate; placing on a table the substrate after forming the scribe line; and pressing the substrate placed on the table at the part where the scribe line is formed, so as to break the substrate along the scribe line, wherein the table has a Young's modulus of 1 to 10 GPa.

Description

TECHNICAL FIELD The present invention relates to a breaking device and a breaking method for breaking a brittle substrate. BACKGROUND ART Conventionally, there is known a method of breaking (cutting) a brittle substrate, by forming a scribe line on the brittle substrate, and pressing the brittle substrate by a breaking member or the like at the part where the scribe line is formed. This breaking method is used for breaking a semiconductor substrate having a surface on which a metal film is formed (see, for example, Patent Citation 1). PRIOR ART CITATIONS PATENT CITATION Patent Citation 1: WO2019/082736 SUMMARY OF INVENTION TECHNICAL PROBLEM When breaking the semiconductor substrate having a surface on which a metal film is formed, conventionally, the semiconductor substrate on which the scribe line is formed on a surface where the metal film is not formed is placed on a table made of an elastic material such as rubber, and the semiconductor substrate placed on the table is pressed by a breaking member, so as to break. Alternatively, a so-called "three point bending breaking" method is used for breaking a substrate. However, in the conventional breaking method, the metal film cannot be cut by one breaking step, and it is necessary to perform the breaking step twice. As a result, quality of the substrate after cutting is not high due to occurrence of a large chipping in the cut part of the substrate, or other reason. It is an object of the present invention to break a substrate such as a semiconductor substrate with high quality, the substrate having a metal film formed and being difficult to break. TECHNICAL SOLUTION Hereinafter, a plurality of embodiments are described as means for solving the problem. These embodiments can be arbitrarily combined as necessary. A breaking device according to one aspect of the present invention includes a table and a breaking member. A substrate on which a scribe line is formed is placed on the table. The breaking member presses the substrate placed on the table at the part where the scribe line is formed, so as to break the substrate along the scribe line. In this breaking device, the table has a Young's modulus of 1 to 10 GPa. In the breaking device described above, the table on which the substrate to be broken is placed has a Young's modulus of 1 to 10 GPa. By using the table having the appropriate Young's modulus, when the breaking member presses the substrate, the substrate is applied with an appropriate level of force and a displacement in the substrate plane direction, and hence even a substrate that is difficult to break can be broken by one breaking step. If the breaking steps can be reduced, damage to the substrate due to the breaking step can be reduced, and it is possible to suppress occurrence of a large chipping or the like, so that high quality breaking can be realized. In the breaking device described above, the table may be made of a resin material. The table made of a resin material has a Young's modulus suitable for breaking a substrate, and hence even a substrate that is difficult to break can be broken by one breaking step, and high quality breaking can be realized. In the breaking device described above, the table may include a first table made of a glass member and a second table disposed on the first table. In this case, the second table may have a Young's modulus of 1 to 10 GPa. In this way, the table having an appropriate hardness can be realized. In the breaking device described above, the substrate may include a plate-like substrate made of a brittle material, and a metal layer formed on a first surface of the plate-like substrate. The breaking device can break even the brittle substrate having the metal layer formed on the first surface, by one breaking step. In the breaking device described above, the scribe line may be formed on a second surface opposite to the first surface of the plate-like substrate. In addition, the breaking member may press the plate-like substrate on the first surface so as to break the substrate. In this way, it is possible to reduce damage to the substrate when breaking. A breaking method according to another aspect of the present invention is a method for breaking a substrate. The breaking method includes: forming a scribe line on a substrate;placing on a table the substrate after forming the scribe line; andpressing the substrate placed on the table at the part where the scribe line is formed, so as to break the substrate along the scribe line. In the breaking method described above, the table has a Young's modulus of 1 to 10 GPa. In the breaking method described above, the table on which the substrate to be broken is placed has a Young's modulus of 1 to 10 GPa. By using the table having the appropriate Young's modulus, when pressing the substrate for breaking, the substrate is applied with an appropriate level of force and a displacement in the substrate plane direction, and hence even a substrate that is difficult t