EP-4737735-A1 - FAN MODULE AND ELECTRONIC DEVICE

EP4737735A1EP 4737735 A1EP4737735 A1EP 4737735A1EP-4737735-A1

Abstract

Embodiments of this application provide a fan module and an electronic device, to resolve a problem of an excessive thickness of an electronic device in a related technology. The electronic device includes a housing, a fan casing, and a fan body. The housing includes a first structural member and a second structural member. The second structural member is disposed around an edge of the first structural member. The fan casing encloses the exterior of the fan body. A first portion of the fan casing and the first structural member jointly form a flat plate structure. The flat plate structure and the second structural member jointly enclose mounting space. The fan body is located in the mounting space. The first portion of the fan casing includes a first surface. The first structural member includes a second surface. Both the first surface and the second surface are located on a side that is of an appearance plate and that is away from the mounting space. The second surface and the first surface are located on a same plane. This helps reduce an assembly spacing between the fan casing and the first structural member, thereby reducing a thickness of the electronic device.

Inventors

GUO, ZHI
CHEN, YUANYUAN
ZHU, Mingchao
WU, Ruikang

Assignees

Huawei Technologies Co., Ltd.

Dates

Publication Date: 20260506
Application Date: 20240830

Claims (17)

A fan module, comprising: a housing, comprising a first structural member and a second structural member, wherein the second structural member is disposed around an edge of the first structural member; a fan casing and a fan body, wherein the fan casing encloses the exterior of the fan body, the fan casing comprises a first portion and a second portion, the first portion and the first structural member jointly form a flat plate structure, the flat plate structure and the second structural member jointly enclose mounting space, and the fan body and the second portion are located in the mounting space; and the first portion comprises a first surface, the first structural member comprises a second surface, both the first surface and the second surface are located on a side that is of the flat plate structure and that is away from the mounting space, and the second surface and the first surface are located on a same plane.
The fan module according to claim 1, wherein the fan body comprises a shaft base, fan blades, and a stator assembly, the shaft base is connected to the first portion, the stator assembly is connected to the shaft base, the fan blade is rotatably connected to the shaft base, and the fan blade comprises a magnetic element; and the fan casing further comprises a communication hole, the electronic device further comprises a circuit board, the circuit board is located in the mounting space, and the circuit board extends into the fan casing through the communication hole and is electrically connected to the stator assembly.
The fan module according to claim 2, wherein a protrusion structure is provided on a side that is of the first portion and that is close to the mounting space, a first sub-surface is provided on a side that is of the protrusion structure and that is close to the mounting space, the first sub-surface is provided opposite to the first surface, the first sub-surface is recessed toward a side close to the first surface to form a mounting groove, and the shaft base is mounted in the mounting groove.
The fan module according to claim 3, wherein the first sub-surface is parallel to the first surface and is perpendicular to a rotation axis of the fan blade.
The fan module according to claim 3 or 4, wherein the first portion further comprises a second sub-surface adjacent to the protrusion structure, the second sub-surface is provided opposite to the first surface, and the second sub-surface is parallel to the first surface and is perpendicular to the rotation axis of the fan blade.
The fan module according to claim 5, wherein a third sub-surface is provided on a side that is of the first structural member and that is close to the mounting space, the third sub-surface is provided opposite to the second surface, and the third sub-surface and the second sub-surface are located on a same plane.
The fan module according to claim 6, wherein the circuit board comprises a first plate portion, a second plate portion, and a bent portion, the first plate portion is connected to the first sub-surface, the second plate portion is connected to the second sub-surface and passes through the communication hole, and the bent portion is connected between the first plate portion and the second plate portion.
The fan module according to any one of claims 2 to 7, wherein the first portion and the first structural member are of an integrated structure.
The fan module according to claim 8, wherein the second portion comprises a frame and a cover plate, the frame is located between the first portion and the cover plate, the frame is disposed around edges of the first portion and the cover plate, and the frame and the cover plate are of an integrated structure.
The fan module according to claim 9, wherein the frame is detachably connected to the side that is of the first structural member and that is close to the mounting space, the fan module further comprises a sealing structure, and the sealing structure is located between the first portion and the frame.
The fan module according to claim 10, wherein a recessed structure is further provided on the side that is of the first portion and that is close to the mounting space, the recessed structure and the frame jointly enclose the communication hole, a part of the sealing structure is located in the communication hole, and the circuit board is located between the sealing structure and the recessed structure.
The fan module according to any one of claims 2 to 11, wherein the first structural member is provided with a through mounting opening, and at least a part of the first portion is located in the mounting opening.
The fan module according to claim 12, wherein the first structural member comprises a bottom plate and a lapping block, the bottom plate is provided with the through mounting opening, the second surface is provided on a side that is of the bottom plate and that is away from the mounting space, a side surface adjacent to the second surface is further provided on the bottom plate, and the side surface encloses the mounting opening; and the lapping block is connected to a side that is of the bottom plate and that is close to the mounting space, in a direction that is parallel to the second surface and that points from the side surface to the rotation axis of the fan blade, the lapping block extends beyond the side surface, a surface that is of the lapping block and that is adjacent to the side surface is a lapping surface, and the lapping surface is in contact with the side that is of the first portion and that is close to the mounting space.
The fan module according to claim 13, wherein a part of the bottom plate and a part of the first portion jointly form a welding block, a third surface is provided on a side that is of the welding block and that is away from the mounting space, and the third surface, the first surface, and the second surface are located on a same plane.
The fan module according to claim 14, wherein the second portion comprises the frame and the cover plate, the frame is located between the first portion and the cover plate, the frame is disposed around the edge of the cover plate, and there is a preset distance between the frame and the side surface in the direction that is parallel to the second surface and that points from the side surface to the rotation axis of the fan blade.
The fan module according to any one of claims 13 to 15, wherein the electronic device may further comprise a decoration layer, and the decoration layer is located on a side that is of the bottom plate and the first portion and that is away from the mounting space.
An electronic device, comprising a mainboard and the fan module according to any one of claims 1 to 16, wherein the mainboard is connected to a fan body of the fan module.

Description

This application claims priority to Chinese Patent Application No. 202311692885.1, filed with China National Intellectual Property Administration on December 8, 2023 and entitled "FAN MODULE AND ELECTRONIC DEVICE", which is incorporated herein by reference in its entirety. TECHNICAL FIELD Embodiments of this application relate to the field of electronic product technologies, and in particular, to a fan module and an electronic device. BACKGROUND With advancement of science and technology, current electronic devices develop toward multi-functionality, high speeds, and small sizes. Some chips in an electronic device, for example, a system on chip (system on chip, SoC), are increasingly integrated, and an amount of computation in a data processing process is also increasing. This results in a great increase in operating heat generated by a processor in a unit area, and the processor becomes a high-heat-generating element. The operating heat generated by the high-heat-generating element affects performance and service lives of the processor and another component in the electronic device. Currently, a heat dissipation technology employed by the electronic device is mainly an air-cooling apparatus combining a heat dissipation assembly and a fan, to improve a heat dissipation capability of the entire electronic device. However, the electronic device using the air-cooling apparatus is thick. This is not conducive to achieving a light weight and thinning of the electronic device. SUMMARY Embodiments of this application provide a fan module and an electronic device, to resolve a problem in a related technology that an electronic device is thick, which is not conducive to achieving a light weight and thinning of the electronic device. To achieve the foregoing objective, embodiments of this application provide the following solutions. According to one aspect, a fan module is provided, including a housing, a fan casing, and a fan body. The housing includes a first structural member and a second structural member. The second structural member is disposed around an edge of the first structural member. The fan casing encloses the exterior of the fan body. The fan casing includes a first portion and a second portion. The first portion and the first structural member jointly form a flat plate structure. The flat plate structure and the second structural member jointly enclose mounting space. The fan body and the second portion are located in the mounting space. Herein, the "flat plate structure" may be used as a main unit appearance board of an electronic device, or may be used as a part of a middle frame of a main unit. Herein, "the first portion and the first structural member jointly form the flat plate structure" may be understood as follows: The first portion and the first structural member are integrally formed, and an integrally formed structure is the flat plate structure; or the first portion is connected to the first structural member, so that the first portion and the first structural member that are connected together jointly form the flat plate structure, and there may be a specific assembly gap or an assembly step difference between the first portion and the first structural member. The first portion includes a first surface. The first structural member includes a second surface. Both the first surface and the second surface are located on a side that is of an appearance plate and that is away from the mounting space. The second surface and the first surface are located on a same plane. Herein, the "plane" may be understood as an absolutely flat surface or an approximately flat surface, the approximately flat surface may slightly fluctuate, and an acceptable deviation range of the approximately flat surface may be, for example, a deviation within 5%. Through the foregoing arrangement, the first portion and the first structural member form the flat plate structure. This helps reduce an assembly spacing between the fan casing and the first structural member, and reduce space occupied by the fan casing in mounting space, thereby helping reduce a thickness of the electronic device and achieving a light weight and thinning of the electronic device. In some implementations, the fan body includes a shaft base, fan blades, and a stator assembly. The shaft base is connected to the first portion. The stator assembly is connected to the shaft base. The fan blade is rotatably connected to the shaft base. The fan blade includes a magnetic element. The fan casing further includes a communication hole. The electronic device further includes a circuit board. The circuit board is located in the mounting space. The circuit board extends into the fan casing through the communication hole and is electrically connected to the stator assembly. Through the foregoing arrangement, a mainboard may control the circuit board to supply power to a stator coil, and after the stator coil is energized, a rotating electromagnetic field is gener