EP-4737788-A1 - LIGHTING DEVICE AND LAMP

EP4737788A1EP 4737788 A1EP4737788 A1EP 4737788A1EP-4737788-A1

Abstract

A lighting device disclosed in an embodiment of the invention includes a support plate; a circuit board disposed on the support plate; a plurality of pads disposed on one side of the circuit board; a light source portion disposed on the support plate and having a light emitting device and a plurality of bonding pads; a plurality of connection members respectively connecting the plurality of pads to the plurality of bonding pads; and a plurality of molding portions covering different regions of at least one of the plurality of connection members, wherein an uppermost end of at least one of the plurality of molding portions based on the upper surface of the circuit board may disposed higher than positions of highest points of the plurality of connection members.

Inventors

LEE, JUNG HO
LEE, HEE JUNG
KIM, WON JIN

Assignees

LG INNOTEK CO. LTD

Dates

Publication Date: 20260506
Application Date: 20240628

Claims (15)

A lighting device comprising: a support plate; a circuit board disposed on the support plate; a plurality of pads disposed on one side of the circuit board; a light source portion disposed on the support plate and having a light emitting device and a plurality of bonding pads; a plurality of connection members respectively connecting the plurality of pads to the plurality of bonding pads; and a plurality of molding portions covering different region of at least one of the plurality of connection members, wherein an uppermost end of at least one of the plurality of molding portions is disposed higher than positions of highest points of the plurality of connection members based on the upper surface of the circuit board.
The lighting device of claim 1, wherein the plurality of pads includes a first pad and a second pad adjacent to the light source portion, wherein the plurality of bonding pads includes a first bonding pad and a second bonding pad adjacent to the circuit board, wherein the plurality of connection members includes a first connection member connecting the first pad and the first bonding pad, and a second connection member connecting the second pad and the second bonding pad, and wherein the uppermost end of at least one of the plurality of molding portions is disposed higher than positions of highest points of the first and second connection members based on the upper surface of the circuit board.
The lighting device of claim 2, wherein the plurality of molding portions includes a first molding portion disposed on a first end portion of the first connection member connected to the first pad of the light source portion, and a second molding portion disposed on a first end portion of the second connection member connected to the second pad of the light source portion.
The lighting device of claim 3, wherein the first and second molding portions are connected to each other on a region between the first pad and the second pad.
The lighting device of claim 4, wherein a region of the first and second molding portions connected to each other extends to a region between the light source portion and the circuit board and covers the intermediate wire portion of the first and second connection members.
The lighting device of claim 2 or 3, wherein the plurality of molding portions includes a third molding portion disposed on a second end portion of the first connection member connected to the first bonding pad of the circuit board, and a fourth molding portion disposed on a second end portion of the second connection member connected to the second bonding pad of the circuit board.
The lighting device of claim 6, wherein the third molding portion and the fourth molding portion are connected to each other on a region between the first bonding pad and the second bonding pad of the circuit board.
The lighting device of claim 7, wherein regions of the third and fourth molding portions connected to each other extend to a region between the light source portion and the circuit board and cover the intermediate wire portions of the first and second connection members.
The lighting device of claim 7, wherein the plurality of molding portions includes a central molding portion disposed on an intermediate connection portion between first and second end portions of the first and second connection members.
The lighting device of claim 2, wherein the first and second connection members includes a first end portion connected to the first and second pads of the light source portion, a second end portion connected to the first and second bonding pads of the circuit board, respectively, and an intermediate wire portion between the first and second end portions, wherein the plurality of molding portions includes a first molding portion covering the first end portion of the first connection member, the intermediate wire portion, and the second end portion, and a second molding portion covering the first end portion, the intermediate wire portion, and the second end portion of the second connection member.
The lighting device of claim 10, comprising: a first connection portion connecting the first and second molding portions to each other on the light source portion.
The lighting device of claim 10, comprising: a second connection portion connecting the first and second molding portions to each other on the circuit board.
The lighting device of any one of claims 1 to 5, wherein the support plate includes a concave receiving portion to accommodate the circuit board.
The lighting device of any one of claims 1 to 5, wherein each of the plurality of connection members is a ribbon wire whose width is more than twice its thickness.
A lamp comprising: a lighting device that emits white light; and a light guide module or reflector on the lighting device, wherein the lighting device is a lamp according to any one of claims 1 to 5.

Description

[Technical Field] The embodiment relates to a lighting device and a lamp. [Background Art] Lighting applications include vehicle lights as well as backlights for displays and signs. Light emitting device, such as light emitting diode (LED), have advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. These light emitting diodes are applied to various display devices, various lighting devices such as indoor or outdoor lights. Recently, as a vehicle light source, a lamp employing a light emitting diode has been proposed. Compared with incandescent lamps, light emitting diodes are advantageous in that power consumption is small. However, since an emission angle of light emitted from the light emitting diode is small, when the light emitting diode is used as a vehicle lamp, there is a demand for increasing the light emitting area of the lamp using the light emitting diode. [Disclosure] [Technical Problem] The embodiment of the invention provides a lighting module and a lighting device having a member for fixing at least a portion of a connection member that electrically connects a light source portion and a circuit board. An embodiment of the invention provides a lighting module and lighting device having a member for fixing part or all of a plurality of connection members electrically connecting a light source portion and a circuit board. An embodiment of the invention provides a lighting module and a lighting device having a member for fixing the position of a portion of one or a plurality of wires on at least one region of an upper surface of a circuit board or an upper surface of a support plate. Embodiments of the invention provide a lighting device and a lamp or automobile lamp having the same. [Technical Solution] The lighting device according to an embodiment of the invention includes a support plate; a circuit board disposed on the support plate; a plurality of pads disposed on one side of the circuit board; a light source portion disposed on the support plate and having a light emitting device and a plurality of bonding pads; a plurality of connection members respectively connecting the plurality of pads to the plurality of bonding pads; and a plurality of molding portions covering different regions of at least one of the plurality of connection members, wherein an uppermost end of at least one of the plurality of molding portions based on the upper surface of the circuit board may disposed higher than positions of highest points of the plurality of connection members. According to an embodiment of the invention, the plurality of pads includes a first pad and a second pad adjacent to the light source portion, and the plurality of bonding pads includes a first bonding pad and a second bonding pad adjacent to the circuit board, the plurality of connection members includes a first connection member connecting the first pad and the first bonding pad, and a second connection member connecting the second pad and the second bonding pad, and the uppermost end of at least one of the plurality of molding portions may be positioned higher than positions of the highest points of the first and second connection members. According to an embodiment of the invention, the plurality of molding portions may include a first molding portion disposed on a first end portion of the first connection member connected to the first pad of the light source portion, and the second molding portion disposed on a first end portion of the second connection member connected to the second pad of the light source portion. According to an embodiment of the invention, the first and second molding portions may be connected to each other in a region between the first pad and the second pad. According to an embodiment of the invention, regions of the first and second molding portions connected to each other may extend to a region between the light source portion and the circuit board and cover intermediate wire portions of the first and second connection members. According to an embodiment of the invention, the plurality of molding portions includes a third molding portion disposed on a second end portion of the first connection member connected to the first bonding pad of the circuit board, and a fourth molding portion disposed on the second end portion of the second connection member connected to the second boding pad of the circuit board. According to an embodiment of the invention, the third molding portion and the fourth molding portion may be connected to each other in a region between the first bonding pad and the second bonding pad of the circuit board. The regions of the third and fourth molding portions connected to each other extend to a region between the light source portion and the circuit board and may cover intermediate wire portions of the first and second connection membe