EP-4737962-A1 - ASSEMBLY COMPRISING OPTO-ELECTRONIC COMPONENTS FOR DATA TRANSFER AND METHOD FOR PRODUCING THE SAME

EP4737962A1EP 4737962 A1EP4737962 A1EP 4737962A1EP-4737962-A1

Abstract

An assembly comprising a a first sub-assembly comprising i. a first layer of a first kind comprising a first plurality of electronic components; ii. a first plurality of waveguides; iii. a first plurality of opto-electronic components that each has a height that is equal to or less than 50 μm and are adapted and arranged to modify electromagnetic waves propagating in a first longitudinal portion of at least one waveguide, of the first plurality of waveguides; iv. a first plurality of connectors, wherein A. at least one connector, of the first plurality of connectors, is adapted and arranged to electrically connect at least one electronic component with at least one opto-electronic component; wherein an average lateral minimum distance F X between the first longitudinal portions and the first plurality of connectors is in the range from 0.75 to 1.7 µm.

Inventors

Huyghebaert,Cedric,Dr.
Schall, Daniel,Dr.

Assignees

Black Semiconductor GmbH

Dates

Publication Date: 20260506
Application Date: 20241104

Claims (14)

An assembly comprising a. a first sub-assembly, wherein the first sub-assembly comprises i. a first layer of a first kind that comprises a first plurality of electronic components; ii. a first plurality of waveguides adapted and arranged for the propagation of electromagnetic waves; iii. a first plurality of opto-electronic components that each A. has a height that is equal to or less than 50 µm, and B. is adapted and arranged to modify electromagnetic waves propagating in a first longitudinal portion of at least one waveguide, of the first plurality of waveguides; wherein at least 95 % of the opto-electronic components, of the first plurality of opto-electronic components, comprise at least one electrically conducting element, wherein said at least one electrically conducting element comprises graphene; iv. a first plurality of connectors, wherein A. at least one connector, of the first plurality of connectors, is adapted and arranged to electrically connect at least one electronic component, of the first plurality of electronic components, with at least one opto-electronic component, of the first plurality of opto-electronic components; wherein an average minimum distance F X between the first longitudinal portions, of the first plurality of waveguides, and the first plurality of connectors is in the range from 0.75 to 1.7 µm, wherein the average minimum distance F X is measured parallel to a further direction ( X ) that is perpendicular to a first direction (Z), wherein the first direction (Z) is perpendicular to the first layer of the first kind, and the average minimum distance F X is determined as described herein.
The assembly according to claim 1, wherein the average minimum distance F X is less than an average minimum distance F Z between the first longitudinal portions, of the first plurality of waveguides, and the first plurality of connectors, wherein the average minimum distance F Z is measured parallel to the first direction (Z).
The assembly according to any of the preceding claims, wherein the average minimum distance F Z between the first longitudinal portions, of the first plurality of waveguides, and the first plurality of connectors is in the range from 2 to 3.5 µm, wherein the average minimum distance F Z is measured parallel to the first direction (Z).
The assembly according to any of the preceding claims, wherein an average minimum distance G X between further longitudinal portions, of the first plurality of waveguides, and the first plurality of connectors is in the range from 2 to 3.5 µm, wherein the average minimum distance G X is measured parallel to the further direction ( X ).
The assembly according to any of the preceding claims, wherein an average minimum distance H Z between the first longitudinal portions, of the first plurality of waveguides, and the first plurality of electronic components is in the range from 8 to 24 µm, wherein the average minimum distance H Z is measured parallel to the first direction (Z).
The assembly according to any of the preceding claims, wherein at least one or all of the following applies: a. an average minimum distance H X between the first layer of the first kind and the first longitudinal portions, of the first plurality of waveguides, is less than 100 nm, and wherein the average minimum distance H X is measured parallel to the further direction (X); b. an average minimum distance H Y between the first layer of the first kind and the first longitudinal portions, of the first plurality of waveguides, is less than 100 nm, wherein the average minimum distance H Y is measured parallel to a second direction ( Y ), wherein the second direction (Y) is perpendicular to the first direction (Z) and the further direction ( X ).
The assembly according to any of the preceding claims, wherein at least one or all of the following applies: a. the first layer of the first kind does not comprise a waveguide; b. the first layer of the first kind does not comprise an optical element adapted and arranged for the coupling of electromagnetic waves between two waveguides.
The assembly according to any of the preceding claims, wherein in a cross-sectional cut of the assembly made perpendicular to the first layer of the first kind, the cross-sectional cut comprises the following layers and components, in this order: i. the first layer of the first kind; and ii. the first plurality of opto-electronic components.
The assembly according to any of the preceding claims, wherein the assembly is adapted and arranged to allow for a flow of an electrical current between at least one electronic component, of the first plurality of electronic components, and at least one opto-electronic component, of the first plurality of opto-electronic components, without requiring that the electrical current flows through at least one of the following: a bonding wire, a solder bump, a microbump, a C2 bump, a C4 bump, a hybrid bond.
The assembly according to any of the preceding claims, wherein the first plurality of connectors does not comprise any of the following: a bonding wire, a solder bump, a microbump, a C2 bump, a C4 bump, a hybrid bond.
A method for producing an assembly, comprising the steps of I. providing a layer of a first kind; II. superimposing a waveguide layer on the layer of the first kind; III. removing at least one section of the waveguide layer to obtain a plurality of waveguides; IV. superimposing at least one electrically conducting element layer on the plurality of waveguides; V. removing at least one section of the at least one electrically conducting element layer to obtain a plurality of electrically conducting elements; VI. forming a first plurality of electrodes that are in electrical connection with the plurality of electrically conducting elements; VII. forming a further plurality of electrodes that are in electrical connection with the layer of the first kind; VIII. bringing at least one electrode, of the first plurality of electrodes, and at least one electrode, of the further plurality of electrodes, into electrical connection with each other.
The method according to the preceding claim 11, wherein the step of forming the first plurality of electrodes comprises the sub-steps of: a. preferably superimposing a dielectric layer A on the plurality of electrically conducing elements; b. forming a first plurality of through-holes wherein said through-holes extend to at least one electrically conducting element; c. superimposing a first electrically conducting material on the plurality of electrically conducing elements, thereby at least partially filling the first plurality of through-holes, and thereby forming the first plurality of electrodes.
The method according to the preceding claim 12, wherein the first plurality of through-holes do not pass through the layer of the first kind.
Use of an assembly according to any of the claims 1 to 10 in a computing device for at least one or all of the following: a. a transfer of data between at least two electronic components; b. a transfer of data between at least two opto-electronic components.

Description

FIELD OF THE INVENTION The invention relates in general to the field of semiconductor assemblies. A particular aspect of the invention pertains to an assembly comprising a first sub-assembly, wherein the first sub-assembly comprises a first plurality of waveguides, a first plurality of opto-electronic components, and a first plurality of connectors, wherein an average minimum distance FX between first longitudinal portions, of the first plurality of waveguides, and the first plurality of connectors is in the range from 0.8 to 1.5 µm. The invention also pertains to a use of the assembly, and a method for producing an assembly. BACKGROUND The transfer of data between semiconductor dies is commonly done using connectors that are made of, e.g., copper. This set-up leads to a limitation on the data transfer rate for a number of reasons. For example, the density of the connectors is limited by the amount of space available. Furthermore, increasing the data transfer rate requires more energy, which leads to the generation of significant amounts of heat. In order to dissipate this heat, the dies may be arranged further apart. However, the distance between dies is also limited, as the signal quality of the data not only reduces with an increase of the length of the connectors, but more energy is also required to transfer the data over a larger distance. The above problems persist even if the dies are arranged on an interposer. OBJECTS An object of the present invention is to at least partially overcome at least one of the disadvantages encountered in the state of the art. It is a further object of the invention to provide an assembly that allows for a reduced energy consumption. It is a further object of the invention to provide an assembly that allows for a higher bitrate. It is a further object of the invention to provide an assembly that allows for a higher bitrate per distance. It is a further object of the invention to provide an assembly that allows for an improved heat dissipation. It is a further object of the invention to provide an assembly that is less complex to manufacture. It is a further object of the invention to provide an assembly that requires less time to produce. It is a further object of the invention to provide an assembly that has a lower footprint. It is a further object of the invention to provide a method for producing an assembly. It is a further object of the invention to provide a method for producing an assembly that allows for a reduced energy consumption. It is a further object of the invention to provide a method for producing an assembly that allows for a higher bitrate. It is a further object of the invention to provide a method for producing an assembly that allows for a higher bitrate per distance. It is a further object of the invention to provide a method for producing an assembly that allows for an improved heat dissipation. It is a further object of the invention to provide a method for producing an assembly that has a lower footprint. It is a further object of the invention to provide a method for producing an assembly, wherein the method has a reduced complexity. It is a further object of the invention to provide a method for producing an assembly, wherein the method allows for a faster production of the assembly. PREFERRED EMBODIMENTS OF THE INVENTION A contribution to at least partially fulfilling at least one of the above-mentioned objects is made by any of the embodiments of the invention. A 1st embodiment of the invention is an assembly comprising a. a first sub-assembly, wherein the first sub-assembly comprises i. a first layer of a first kind that comprises a first plurality of electronic components;ii. a first plurality of waveguides adapted and arranged for the propagation of electromagnetic waves;iii. a first plurality of opto-electronic components that each A. has a height that is equal to or less than 50 µm, preferably equal to or less than 20 µm, and more preferably equal to or less than 10 µm, andB. is adapted and arranged to modify electromagnetic waves propagating in a first longitudinal portion of at least one waveguide, of the first plurality of waveguides;iv. a first plurality of connectors, wherein A. at least one connector, of the first plurality of connectors, is adapted and arranged to electrically connect at least one electronic component, of the first plurality of electronic components, with at least one opto-electronic component, of the first plurality of opto-electronic components,B. preferably, at least one connector, of the first plurality of connectors, is adapted and arranged to electrically connect at least two electronic components, of the first plurality of electronic components, andC. preferably, at least one connector, of the first plurality of connectors, is adapted and arranged to electrically connect at least two opto-electronic components, of the first plurality of opto-electronic components; wherein at least one or all of the follow