EP-4738050-A1 - WEARABLE DEVICE COMPRISING INSULATION STRUCTURE
Abstract
A wearable device according to one embodiment may comprise a housing comprising: a first surface facing a part of the body of a user when the wearable device is worn on the user; and a second surface opposite to the first surface. The wearable device may comprise an electronic component between the first surface and the second surface. The wearable device may comprise a heat insulation structure inside the housing, that is at least partially disposed between the electronic component and the first surface and comprising at least one air gap.
Inventors
- LEE, HOSOON
- BAE, Yosep
- SONG, KYUNGHWAN
- CHOI, HYUNSUK
Assignees
- Samsung Electronics Co., Ltd.
Dates
- Publication Date
- 20260506
- Application Date
- 20240605
Claims (15)
- A wearable device (101) comprising: a housing (200) comprising a first surface (210a) facing a part of a body of a user while the wearable device (101) is worn by the user, and a second surface (210b) opposite to the first surface (210a); an electronic component (301) disposed between the first surface (210a) and the second surface (210b); and a heat insulation structure (310) in the housing (200), disposed at least partially between the electronic component (301) and the first surface (210a), and including at least one air gap (320) for reducing heat transfer from the electronic component (301) to the first surface (210a).
- The wearable device (101) of claim 1, wherein the housing (200) comprises: a first frame (210) defining the first surface (210a), a second frame (220) defining the second surface (210b), and a third frame (230) interposed between the first frame (210) and the second frame (220), on which the heat insulation structure (310) is formed,
- The wearable device (101) of claim 1 or 2, wherein the second frame (220) includes at least one of metal and titanium, and wherein the third frame (230) includes at least one of silicon, epoxy, and acryl.
- The wearable device (101) of any one of claims 1 to 3, wherein the third frame (230) comprises a third surface (230a) facing toward the first frame (210), and wherein the heat insulation structure (310) further comprises at least one groove (410) recessed from the third surface (230a) toward the electronic component (301) and forming the at least one air gap (320).
- The wearable device (101) of any one of claims 1 to 4, wherein the at least one air gap (320) comprises a plurality of air gaps (321, 322, 323, 324) spaced apart from each other, and wherein the plurality of air gaps (321, 322, 323, 324) each have a curvature at a position adjacent to the electronic component (301).
- The wearable device (101) of any one of claims 1 to 5, wherein the heat insulation structure (310) further comprises a film layer (420) in the housing (200) sealing the at least one air gap (320).
- The wearable device (101) of any one of claims 1 to 6, wherein the at least one air gap (320) comprises an end (320a) having a flat shape at a position adjacent to the electronic component (301).
- The wearable device (101) of any one of claims 1 to 7 wherein the electronic component (301) comprises: a first region (301a) including a periphery of the electronic component (301), and a second region (301b) surrounded by the first region (301a), and wherein the at least one air gap (320) comprises: a first air gap (321) disposed between the second region (301b) and the first surface (210a), and a second air gap (322), disposed between the first region (301a) and the first surface (210a), having a volume larger than a volume of the first air gap (321).
- The wearable device (101) of any one of claims 1 to 8, wherein the at least one air gap (320) comprises a plurality of air gaps (321, 322, 323, 324) arranged along the first surface (210a) and spaced apart by designated intervals.
- The wearable device (101) of any one of claims 1 to 9, wherein the heat insulation structure (310) has a curvature by extending along the first surface (210a).
- The wearable device (101) of any one of claims 1 to 10, wherein the heat insulation structure (310) further comprises an air layer (430) disposed between the first surface (210a) and the electronic component (301) and formed by the at least one air gap (320) continuously extending along the first surface (210a).
- The wearable device (101) of any one of claims 1 to 11, further comprising: a flexible printed circuit board (FPCB) (330), disposed between the first surface (210a) and the second surface (210b), connected to the electronic component (301), and disposed in the housing (200); and another electronic component (302) disposed on the FPCB (330) and disposed above the heat insulation structure (310).
- The wearable device (101) of any one of claims 1 to 12, wherein the at least one air gap (320) overlaps the electronic component (301) when the second surface (210b) is viewed from above.
- The wearable device (101) of any one of claims 1 to 13, wherein the housing (200) further comprises: a first frame (210) forming the first surface (210a), a second frame (220) forming the second surface (210b), and a third frame (230) disposed between the first frame (210) and the second frame (220), in which the electronic component (301) is disposed, the third frame (230) including a third surface (230a) attached to the first frame (210) and a fourth surface attached to the second frame (220), wherein the heat insulation structure (310) further comprises at least one groove (410) recessed from the third surface (230a) attached to the first frame (210) toward the electronic component (301) and forming the at least one air gap (320), and wherein the first frame (210) seals the at least one air gap (320).
- The wearable device (101) of any one of claims 1 to 14, further comprising: a sensor module (350), disposed between the first surface (210a) and the second surface (210b), including a light-emitting part (351) and a light-receiving part (352) spaced apart from the light-emitting part (351), wherein the sensor module (350) is configured to: emit light toward the part of the body of the user, and obtain biometric information about the user based on receiving at least a portion of the light reflected by the part of the body of the user through the light-receiving part (352).
Description
[Technical Field] Various embodiments to be described later relate to a wearable device including a heat insulation structure. [Background Art] A wearable device may be used while being worn on a part of a body of a user. The wearable device may be provided as various types of products. For example, the wearable device may include a ring-shaped device for the user to be worn on the part of the body of the user. The wearable device may include various electronic components to meet a demand of the user. As electronic components disposed in the wearable device perform an operation for responding to a request of the user, heat may be generated in the miniaturized wearable device. The above-described information may be provided as a related art for the purpose of helping understanding of the present disclosure. No argument or decision is made as to whether any of the above description may be applied as a prior art related to the present disclosure. [Disclosure] [Technical Solution] According to an embodiment, a wearable device may comprise a housing including a first surface facing a part of a body of a user while the wearable device is worn by the user, and a second surface opposite to the first surface. The wearable device may comprise an electronic component disposed between the first surface and the second surface. The wearable device may comprise a heat insulation structure in the housing, disposed at least partially between the electronic component and the first surface, and including at least one air gap for reducing heat transfer from the electronic component to the first surface. According to an embodiment, a wearable device may comprise a housing including a first frame including a first surface facing a part of a body of a user while the wearable device is worn by the user, a second frame including a second surface opposite to the first surface , and a third frame disposed between the first frame and the second frame. The wearable device may comprise an electronic component disposed in the third frame. The third frame may include a third surface facing toward the first frame. The third frame may include a heat insulation structure, disposed at least partially between the electronic component and the first frame, and including at least one groove recessed from the third surface toward the electronic component, and at least one air gap formed by the at least one groove for reducing heat transfer from the electronic component to the first surface. [Description of the Drawings] FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment.FIG. 2 illustrates an exemplary electronic device.FIG. 3A is a cross-sectional view of an exemplary electronic device.FIG. 3B illustrates a part of an exemplary electronic device.FIGS. 4A, 4B, and 4C are partial cross-sectional views of an exemplary electronic device.FIGS. 5A, 5B, 5C, and 5D are partial cross-sectional views of an exemplary electronic device.FIGS. 6A and 6B are partial cross-sectional views of an exemplary electronic device.FIG. 7 illustrates a portion of a manufacturing process of an exemplary electronic device.FIG. 8 illustrates a portion of a manufacturing process of an exemplary electronic device. [Mode for Invention] FIG. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1, the electronic device 101 in the network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or at least one of an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connecting terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module(SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the connecting terminal 178) may be omitted from the electronic device 101, or one or more other components may be added in the electronic device 101. In some embodiments, some of the components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be implemented as a single component (e.g., the display module 160). The processor 120 may execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and may perform various data processing or computation. According to an emb