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EP-4738061-A1 - EDGE MOUNT MEMORY CONNECTOR FOOTPRINT

EP4738061A1EP 4738061 A1EP4738061 A1EP 4738061A1EP-4738061-A1

Abstract

A dual inline memory module (DIMM) connector has pins to connect to pad footprints and signal routing that reduces crosstalk and noise. The shape and placement of ground pads and signal pads can improve grounding of noise signals and improve the signal isolation on the signal pins. The ground pads can have additional ground vias to increase the ground path to the ground plane.

Inventors

  • HANKS, LANDON

Assignees

  • INTEL Corporation

Dates

Publication Date
20260506
Application Date
20250929

Claims (14)

  1. A connector comprising: a housing; multiple ground pins to couple first ground pads on a dual inline memory module (DIMM) board to second grounds pads on a system board; and multiple signal pins to couple first signal pads on the DIMM board to second signal pads on the system board, where the signal pins are separated by ground pins; wherein the signal pins have a pin foot having a circular end tab to connect to respective second signal pads on the system board.
  2. The connector of claim 1, wherein the ground pins have a pin foot with a foot portion and a circular end tab extending from the foot portion.
  3. The connector of claim 2, wherein the ground pin foot is longer than the signal pin foot.
  4. The connector of claim 3, wherein the circular end tab of the pin foot of the signal pin is to connect to a circular signal pad nested between two ground pads.
  5. The connector of any of claims 1 to 4, wherein the second signal pads are to be located under the housing, with the signal pins bent under the housing to contact the second signal pads.
  6. The connector of claim 5, wherein the second ground pads are to be located under the housing, with the ground pins bent under the housing to contact the second ground pads.
  7. A computer system comprising: a system board including a first surface with first ground pads to couple to second ground pads of a dual inline memory module (DIMM) board and first signal pads to couple to second signal pads of the DIMM board, wherein the first signal pads have a circular shape; and a connector in accordance with any of claims 1 to 6.
  8. The computer system of claim 7, wherein the ground pads have a first circular portion, a second circular portion, and a rectangular portion connecting the first circular portion to the first circular portion.
  9. The computer system of claim 8, wherein the first circular portion is electrically connected to two through-hole vias to connect to a ground plane, one through-hole via on each side of the first circular portion, the through-hole vias offset from a center line of first ground pads, and the second circular portion is electrically connected to two through-hole vias to connect to the ground plane, one through-hole via on each side of the second circular portion, the through-hole vias offset from a center line of first ground pads.
  10. The computer system of any of claims 7 to 9, wherein the first ground pads have two physically separated portions on the first surface, a circular portion and a rectangular portion.
  11. The computer system of claim 10, wherein the circular portion is electrically connected to two through-hole vias to connect to a ground plane, one through-hole via on each side of the circular portion, the through-hole vias offset from a center line of first ground pads.
  12. The computer system of claim 10, wherein the rectangular portion is electrically connected to two through-hole vias to connect to a ground plane, one through-hole via on each side of the rectangular portion, the through-hole vias offset from a center line of first ground pads.
  13. The computer system of claim 10, wherein the first signal pads have a capacitive stub extending off the circular pin foot, the capacitive stub to extend between the two physically separated portions of an adjacent first ground pad.
  14. The computer system of any of claims 7 to 13, further comprising one or more of: a host processor device mounted on the motherboard; a display communicatively coupled to a host processor of the motherboard; a network interface communicatively coupled to a host processor of the motherboard; or a battery to power the computer system.

Description

FIELD Descriptions are generally related to memory systems, and more particular descriptions are related to memory module interconnects. BACKGROUND DDR (double data rate) memory is an important element to the compute system to provide data and code for the compute applications. The increasing speed of operation increases the demand for high-speed memory bandwidth and increased memory throughput. DDR memory can be provided to a computing device with memory modules, such as DIMMs (dual inline memory modules). A DIMM represents one type of surface mount memory module, and there can be other types of surface mount memory modules connected to the pads on the system board with a connector. The connectors and the footprint of the pads corresponding to the pins on the connectors provide the memory channel interconnect. The signaling through the connectors, the pins, and the surface mount pads is increasingly burdened with increasingly higher signaling speeds. The signaling can be burdened by routing constraints as pins are moved closer together and more ground vias are used. The signaling can also be burdened by connector pin and surface mount pad impedance that reduce signal integrity. The signaling can also be burdened by increased crosstalk between adjacent signals, especially as pin and pad separation is reduced. BRIEF DESCRIPTION OF THE DRAWINGS The following description includes discussion of figures having illustrations given by way of example of an implementation. The drawings should be understood by way of example, and not by way of limitation. As used herein, references to one or more examples are to be understood as describing a particular feature, structure, or characteristic included in at least one implementation of the invention. Phrases such as "in one example" or "in an alternative example" appearing herein provide examples of implementations of the invention, and do not necessarily all refer to the same implementation. However, they are also not necessarily mutually exclusive. Figure 1 is a block diagram of an example of a system with memory module pads and routing for improved memory signaling.Figure 2A is a block diagram of an example of a ground pad footprint.Figure 2B is a diagram of an example of a ground pin foot for the ground pad footprint of Figure 2A.Figure 3A is a block diagram of an example of a reduced length ground pad footprint and signal footprint.Figure 3B is a diagram of an example of a ground pin foot for the ground pad footprint and signal pin foot for the signal pad footprint of Figure 3A.Figure 3C is a diagram of an example of a DIMM connector with pins turned under the connector housing.Figure 4A is a block diagram of an example of a reduced length ground pad footprint and signal footprint with capacitive stubs.Figure 4B is a diagram of an example of a ground pin foot for the ground pad footprint and signal pin foot for the signal pad footprint of Figure 4A.Figure 4C is a diagram of an example of a cutaway view of Figure 4B.Figure 5 is a block diagram of an example of a memory subsystem in which a DIMM connector can be implemented.Figure 6 is a block diagram of an example of a computing system in which a DIMM connector can be implemented.Figure 7 is a block diagram of an example of a multi-node network in which a DIMM connector can be implemented. Descriptions of certain details and implementations follow, including non-limiting descriptions of the figures, which may depict some or all examples, and well as other potential implementations. DETAILED DESCRIPTION As described herein, a surface mount memory module connector has pins and corresponding surface mount pad footprint that reduces crosstalk and noise. The shape and placement of ground pads and signal pads can improve grounding of noise signals and improve the signal isolation on the signal pins, increasing signal integrity. The connector footprint can also improve signal routing options. The ground pads can have additional ground vias to increase the ground path to the ground plane. Figure 1 is a block diagram of an example of a system with memory module pads and routing for improved memory signaling. System 100 includes host 110 with processor 114 and controller 120. Controller 120 can be a memory controller. In one example, controller 120 is an integrated memory controller (iMC). System 100 includes DIMM (dual inline memory module) 150, which represents a surface mount memory module. A surface mount memory module other than a DIMM can have the pin and pad footprint described. Memory device 130 represents the memory devices mounted on DIMM 150. Memory device 130 includes array 140, which represents the memory array to store data. Memory device 130 includes decoder 136 to decode commands and register 134 to store configuration information. In one example, register 134 is a mode register. The configuration of register 134 controls the mode of operation of memory device 130. Memory device 130 includes column DEC (decoder