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EP-4738063-A1 - SERVER

EP4738063A1EP 4738063 A1EP4738063 A1EP 4738063A1EP-4738063-A1

Abstract

The present disclosure relates to the technical field of electronic power, and in particular to a server, which includes a data processing apparatus and a first heatsink, the data processing apparatus includes a load group and a power supply module group, the load group includes at least two loads, and the power supply module group supplies power to the loads; the first heatsink is thermally connected to the power supply module group, at least part of a projection of the first heatsink in a first plane is located outside a load region, the first plane is parallel to an upper surface of the load, the load region is a minimum outer contour projection region of the load group that can cover all loads in the first plane.

Inventors

  • LI, Yingjue
  • ZHAO, JIE
  • LIANG, Le
  • ZHOU, MIN

Assignees

  • Delta Electronics (Shanghai) Co., Ltd.

Dates

Publication Date
20260506
Application Date
20251016

Claims (15)

  1. A server, comprising: a data processing apparatus and a first heatsink (3), wherein the data processing apparatus comprises a load group and a power supply module group, the load group comprises at least two loads (1), and the power supply module group supplies power to the load group; the first heatsink (3) is thermally connected to the power supply module group, at least part of a projection of the first heatsink (3) in a first plane is located outside a load region, wherein the load (1) comprises an upper surface and a lower surface arranged oppositely, the first plane is parallel to the upper surface of the load (1), and the load region is a minimum outer contour projection region of the load group that can cover all the loads (1) in the first plane.
  2. The server according to claim 1, wherein at least 10% of the projection of the first heatsink (3) in the first plane is located outside the load region, or wherein the part of the first heatsink (3) located outside the load region is distributed outside at least two edges of the load region.
  3. The server according to claim 1 or 2, further comprising a housing (5) and a second heatsink (4), wherein the second heatsink (4) is located above the load (1) and is used to dissipate heat from the load (1); the first heatsink (3), the second heatsink (4) and the load group are all located in the housing; in the projection of the first plane, at least part of the first heatsink (3) is located between a side wall of the housing (5) and a side wall of the second heatsink (4) arranged opposite to the side wall of the housing (5), and a width of the part of the first heatsink (3) located between the side wall of the housing (5) and the side wall of the second heatsink (4) is at least 10% of a distance between the side wall of the second heatsink (4) and the side wall of the housing (5).
  4. The server according to claim 3, wherein at least part of the first heatsink (3) is in contact with the housing (5).
  5. The server according to claim 3, wherein the power supply module group comprises at least one power supply submodule group (2), and a third heatsink (6) is provided on both sides of the second heatsink (4), the third heatsink (6) comprises a third heat conduction portion (61) and a third heat dissipation portion (62), the third heat conduction portion (61) is thermally connected to the power supply submodule group (2), the third heat dissipation portion (62) is thermally connected to the third heat conduction portion (61), and at least part of a projection of the third heatsink (6) in the first plane is located in the load region.
  6. The server according to claim 1 or 2, wherein the data processing apparatus further comprises a first carrier board, and the power supply module group supplies power to the load group through the first carrier board; the first carrier board is arranged between the load group and the power supply module group, or the load group and the power supply module group are arranged on a same side of the first carrier board; at least part of the first heatsink (3) is located at a side of the power supply module group away from the first carrier board.
  7. The server according to claim 6, wherein a projection region of the first carrier board in the first plane is larger than the load region, and at least part of the projection of the first heatsink (3) in the first plane is located between the load region and the projection region of the first carrier board in the first plane; or, at least part of the projection of the first heatsink (3) in the first plane is located outside the projection region of the first carrier board in the first plane.
  8. The server according to claim 6, wherein the first carrier board comprises at least two subcarrier boards (7), the at least two subcarrier boards (7) are respectively connected to the at least two loads (1) in the load group, the power supply module group comprises at least two power supply submodule groups (2), the at least two power supply submodule groups (2) are respectively connected to the at least two subcarrier boards (7), and a projection region of the first carrier board in the first plane is a minimum outer contour projection region of the first carrier board that can cover all the subcarrier boards (7) in the first plane.
  9. The server according to claim 6, further comprising a housing (5), wherein at least part of the first heatsink (3) is located between the housing (5) and an edge of the first carrier board, and a width of the part of the first heatsink (3) located between the housing (5) and the edge of the first carrier board is at least 10% of a distance between the edge of the first carrier board and a side wall of the housing (5) arranged opposite to the edge.
  10. The server according to claim 6, further comprising a second carrier board (8), wherein the second carrier board (8) is located below the first carrier board, and at least part of the first heatsink (3) is located above the second carrier board (8), and the server further comprises an additional heat source (10) and a fourth heatsink (9), wherein the additional heat source (10) is arranged on the second carrier board (8), wherein: the second carrier board (8) is provided with a second through hole, the fourth heatsink (9) comprises a second protrusion, and the second protrusion is inserted in the second through hole and is thermally connected to the additional heat source (10); and/or, the second carrier board (8) is provided with a third through hole, a heat conduction column (81) is arranged in the third through hole, and the additional heat source (10) is thermally connected to the fourth heatsink (9) through the heat conduction column (81).
  11. The server according to claim 1 or 2, further comprising a second carrier board (8), wherein the load group and the power supply module group are both arranged on a same side of the second carrier board (8), and the first heatsink (3) is located above the power supply module group.
  12. The server according to claim 1 or 2, wherein the power supply module group comprises at least one power supply submodule group (2), the first heatsink (3) comprises a first heat conduction portion (31) and a first heat dissipation portion (32), at least part of the first heat conduction portion (31) is arranged below the power supply module group, at least part of the first heat dissipation portion (32) is located outside the load region, and the first heat dissipation portion (32) is thermally connected to the first heat conduction portion (31), and the first heat conduction portion (31) comprises one or more of a heat pipe, a vapor chamber, a metal heat conduction plate, and a non-metallic heat conduction structure, or the first heat dissipation portion (32) comprises one or more of a heat dissipation fin, a liquid-cooled plate, a metal plate and a non-metallic heat dissipation structure.
  13. The server according to claim 1 or 2, wherein the first heatsink (3) is an integrated structure, or the first heatsink (3) comprises multiple heat dissipation structures, and the multiple heat dissipation structures are connected, or, wherein the load (1) comprises one or more of a GPU, a CPU, a NPU, a DPU, an ASIC, an FPGA, an APU or a TPU, or the data processing apparatus is an OAM.
  14. The server according to claim 1 or 2, wherein a number of the data processing apparatus is at least two, the at least two data processing apparatuses are arranged along a first direction, the at least two loads (1) in the load group in each of the data processing apparatuses are arranged along a second direction, the first direction is perpendicular to the second direction, and the first direction and the second direction are both parallel to the first plane.
  15. The server according to claim 1 or 2, wherein the power supply module group comprises at least one power supply submodule group (2), and the power supply submodule group (2) comprises at least one power supply module (21).

Description

TECHNICAL FIELD The present disclosure relates to the technical field of electronic power, and in particular, to a server. BACKGROUND With the demand for high computing power in the artificial intelligence and cloud computing industries, the power supply system will be oriented towards kilowatt-class chips. The power supply architectures used in existing servers mainly include horizontal power supply architecture and vertical power supply architecture. In the horizontal power supply scheme, the transmission path of the current through the circuit board is long, the Power Delivery Network (PDN) has large losses, and the system power supply efficiency is low. In the vertical power supply scheme, the heatsink used to dissipate heat from the power supply module group will occupy the heat dissipation space of the load, and the heat dissipation capacity of the load is limited, affecting its computing power. At the same time, the heatsink of the rear power supply module group is affected by the front load heatsink, resulting in poor heat dissipation capacity and being unable to meet the heat dissipation requirement of the power supply module group. SUMMARY The present disclosure provides a server, including a data processing apparatus and a first heatsink, the data processing apparatus includes a load group and a power supply module group, the load group includes at least two loads, and the power supply module group supplies power to the load group; the first heatsink is thermally connected to the power supply module group, and at least part of a projection of the first heatsink in a first plane is located outside a load region, where the load includes an upper surface and a lower surface arranged oppositely, the first plane is parallel to the upper surface of the load, and the load region is a minimum outer contour projection region of the load group that can cover all the loads in the first plane. In one embodiment of the present disclosure, at least 10% of the projection of the first heatsink in the first plane is located outside the load region. In one embodiment of the present disclosure, the part of the first heatsink located outside the load region is distributed outside at least two edges of the load region. In one embodiment of the present disclosure, the server further includes a housing and a second heatsink, the second heatsink is located above the load and is used to dissipate heat from the load; the first heatsink, the second heatsink and the load group are all located in the housing; in the projection in the first plane, at least part of the first heatsink is located between a side wall of the housing and a side wall of the second heatsink arranged opposite to the side wall of the housing, and a width of the part of the first heatsink located between the side wall of the housing and the side wall of the second heatsink is at least 10% of a distance between the side wall of the second heatsink and the side wall of the housing. In one embodiment of the present disclosure, at least part of the first heatsink is in contact with the housing. In one embodiment of the present disclosure, the power supply module group includes at least one power supply submodule group, and a third heatsink is provided on both sides of the second heatsink, the third heatsink includes a third heat conduction portion and a third heat dissipation portion, the third heat conduction portion is thermally connected to the power supply module group, the third heat dissipation portion is thermally connected to the third heat conduction portion, and at least part of a projection of the third heatsink in the first plane is located in the load region. In one embodiment of the present disclosure, the third heatsink is a wind scooper structure, the power supply submodule group is thermally connected to the wind scooper, and the wind scooper is arranged around a circumference of the power supply submodule group. In one embodiment of the present disclosure, the data processing apparatus further includes a first carrier board, and the power supply module group supplies power to the load group through the first carrier board; the first carrier board is arranged between the load group and the power supply module group, or the load group and the power supply module group are arranged on a same side of the first carrier board;at least part of the first heatsink is located at a side of the power supply module group away from the first carrier board. In one embodiment of the present disclosure, a projection region of the first carrier board in the first plane is larger than the load region, and at least part of the projection of the first heatsink in the first plane is located between the load region and the projection region of the first carrier board in the first plane; or, at least part of the projection of the first heatsink in the first plane is located outside the projection region of the first carrier board in the first plane. In one embodi