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EP-4738398-A2 - LAMINATE NON-PLANAR RADIO-FREQUENCY CHOKE DEVICE

EP4738398A2EP 4738398 A2EP4738398 A2EP 4738398A2EP-4738398-A2

Abstract

A laminate non-planar radio-frequency, RF, choke device includes a first RF choke (200). The first RF choke (200) has a first winding structure including a plurality of first conductive traces (202, 204) and a plurality of first vias (206, 208). The first conductive traces (202, 204) are formed on a first layer (L1) and a second layer (L3) of a laminate. The first vias (206, 208) are formed between the first layer (L1) and the second layer (L3) of the laminate. The first vias (206, 208) are stitched in a winding direction through the first conductive traces (202, 204).

Inventors

  • IBRAHIM, MAHMOUD AYMAN AHMED
  • SHABRA, AYMAN

Assignees

  • MEDIATEK INC.

Dates

Publication Date
20260506
Application Date
20251030

Claims (13)

  1. A laminate non-planar radio-frequency, RF, choke device (100) characterized by : a first RF choke (102_1, 102_2, 104_1, 104_2, 106_1, 106_2, 108_1, 108_2, 200), comprising: a first winding structure, comprising: a plurality of first conductive traces (202, 204), formed on a first layer (L1) and a second layer (L3) of a laminate (10); and a plurality of first vias (206, 208), formed between the first layer (L1) and the second layer (L3) of the laminate (10), wherein the plurality of first vias (206, 208) are stitched in a winding direction through the plurality of first conductive traces (202, 204).
  2. The laminate non-planar RF choke device (100) of claim 1, characterized in that a direction of a magnetic field induced by a current flowing through the first winding structure is parallel to a surface of the laminate (10).
  3. The laminate non-planar RF choke device (100) of any one of claims 1 or 2, characterized in that the first winding structure comprises a plurality of loops, each comprising two of the plurality of first vias (206, 208).
  4. The laminate non-planar RF choke device (100) of any one of claims 1 to 3, characterized in that the laminate non-planar RF choke device (100) further comprises: a decoupling capacitor (C 11 , C 12 , C 21 , C 22 , C 31 , C 32 , C 41 , C 42 ), coupled to a first end of the first winding structure, wherein the decoupling capacitor (C 11 , C 12 , C 21 , C 22 , C 31 , C 32 , C 41 , C 42 ) is formed in the laminate (10), and has a metal-insulator-metal structure.
  5. The laminate non-planar RF choke device (100) of claim 4, characterized in that the first end of the first winding structure is coupled to a supply voltage through the decoupling capacitor (C 11 , C 12 , C 21 , C 22 , C 31 , C 32 , C 41 , C 42 ).
  6. The laminate non-planar RF choke device (100) of any one of claims 4 or 5, characterized in that the first end of the first winding structure is coupled to a ground voltage through the decoupling capacitor (C 11 , C 12 , C 21 , C 22 , C 31 , C 32 , C 41 , C 42 ).
  7. The laminate non-planar RF choke device (100) of any one of claims 1 to 6, characterized in that the laminate (10) is a substrate of a semiconductor package.
  8. The laminate non-planar RF choke device (100) of any one of claims 1 to 7, characterized in that the laminate (10) is an interposer of a semiconductor package.
  9. The laminate non-planar RF choke device (100) of any one of claims 1 to 8, characterized in that the laminate (10) is a substrate of an integrated passive device.
  10. The laminate non-planar RF choke device (100) of any one of claims 1 to 9, characterized in that the laminate non-planar RF choke device (100) further comprises: a second RF choke (102_1, 102_2, 104_1, 104_2, 106_1, 106_2, 108_1, 108_2, 200), comprising: a second winding structure, comprising: a plurality of second conductive traces (202, 204), formed on the first layer (L1) and the second layer (L3) of the laminate (10); and a plurality of second vias (206, 208), formed between the first layer (L1) and the second layer (L3) of the laminate (10), wherein the plurality of second vias (206, 208) are stitched in a winding direction through the plurality of second conductive traces (202, 204).
  11. The laminate non-planar RF choke device (100) of claim 10, characterized in that one end of the second winding structure is adjacent to one end of the first winding structure, and a direction of a magnetic field induced by a current flowing through the second winding structure is identical to a direction of a magnetic field induced by a current flowing through the first winding structure.
  12. The laminate non-planar RF choke device (100) of any one of claims 10 or 11, characterized in that one end of the second winding structure is adjacent to one end of the first winding structure, and a direction of a magnetic field induced by a current flowing through the second winding structure is opposite to a direction of a magnetic field induced by a current flowing through the first winding structure.
  13. The laminate non-planar RF choke device (100) of any one of claims 10 to 12, characterized in that the laminate non-planar RF choke device (100) further comprises: an isolation trench (122, 124, 126), between the first RF choke (102_1, 102_2, 104_1, 104_2, 106_1, 106_2, 108_1, 108_2) and the second RF choke (102_1, 102_2, 104_1, 104_2, 106_1, 106_2, 108_1, 108_2), wherein the isolation trench (122, 124, 126) comprises vias that are formed in the laminate (10) and connected to a ground voltage.

Description

Field of the Invention The present invention relates to a radio-frequency (RF) choke design, and more particularly, to a laminate non-planar RF choke device having at least one RF choke created by stitching vias formed between different layers of a laminate. Background of the Invention An RF choke is a type of inductor used in electronic circuits to block or filter RF signal (i.e., high-frequency signals) while allowing low-frequency or direct current (DC) signals to pass through. One conventional RF choke may be implemented using an on-die inductor. However, an on-die RF choke consumes a large die area in new semiconductor technologies, and has very limited performance due to its low quality factor. Another conventional RF choke may be implemented using a laminate planar inductor (i.e., a spiral inductor formed on a laminate). However, the laminate planar RF choke consumes a large area and has a low self-resonance frequency. In addition, the laminate planar RF choke causes interference because of the nature of its geometry. As a result, a direction of a magnetic field induced by a current flowing through the laminate planar RF choke is perpendicular to a surface of the laminate. Since the magnetic field is not contained, other circuit components are interfered with the magnetic field induced by the laminate planar RF choke. Furthermore, it is hard to pitch-match since the laminate planar RF choke occupies large x and y directions, leading to long routing traces with uncontrolled impedance and reflections. Summary of the Invention This in mind, the present invention aims at providing a laminate non-planar RF choke device having at least one RF choke created by stitching vias formed between different layers of a laminate. This is achieved by a laminate non-planar RF choke device according to the independent claim. The dependent claims pertain to corresponding further developments and improvements. As will be seen more clearly from the detailed description following below, the claimed laminate non-planar RF choke device includes a first RF choke. The first RF choke has a first winding structure including a plurality of first conductive traces and a plurality of first vias. The first conductive traces are formed on a first layer and a second layer of a laminate. The first vias are formed between the first layer and the second layer of the laminate. The first vias are stitched in a winding direction through the first conductive traces. Brief Description of the Drawings In the following, the invention is further illustrated by way of example, taking reference to the accompanying drawings. Thereof FIG. 1 is a diagram illustrating a laminate non-planar RF choke device according to an embodiment of the present invention,FIG. 2 is a diagram illustrating a laminate non-planar RF choke with the proposed RF choke topology according to an embodiment of the present invention,FIG. 3 is a diagram illustrating a single-ended implementation with the use of two adjacent laminate non-planar RF chokes according to an embodiment of the present invention,FIG. 4 is a diagram illustrating a differential implementation with the use of two adjacent laminate non-planar RF chokes according to an embodiment of the present invention, andFIG. 5 is a diagram illustrating laminate non-planar RF chokes that are pitch-matched to circuit blocks in a die according to an embodiment of the present inventions. Detailed Description Certain terms are used throughout the following description and claims, which refer to particular components. As one skilled in the art will appreciate, electronic equipment manufacturers may refer to a component by different names. This document does not intend to distinguish between components that differ in name but not in function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to ...". Also, the term "couple" is intended to mean either an indirect or direct electrical connection. Accordingly, if one device is coupled to another device, that connection may be through a direct electrical connection, or through an indirect electrical connection via other devices and connections. FIG. 1 is a diagram illustrating a laminate non-planar RF choke device according to an embodiment of the present invention. The laminate non-planar RF choke device 100 may include one or more laminate non-planar RF chokes formed in a laminate 10, where the laminate 10 has multiple layers, including metal layers and insulation layers. For better comprehension of technical features of the present invention, only eight laminate non-planar RF chokes 102_1, 102_2, 104_1, 104_2, 106_1, 106_2, 108_1, 108_2 are illustrated in FIG. 1. In practice, the present invention has no limitations on the number of non-planar RF chokes implemented in the same laminate. Consider a case where the laminate non-planar RF choke device