EP-4738403-A1 - MULTILAYER CERAMIC ELECTRONIC COMPONENT

EP4738403A1EP 4738403 A1EP4738403 A1EP 4738403A1EP-4738403-A1

Abstract

Provided are multilayer ceramic electronic components that are each able to reduce or prevent excessive flow of a bonding material appropriately to reduce or prevent the occurrence of solder splash. A multilayer ceramic capacitor (1) includes a multilayer ceramic capacitor main body (2), metal terminals (100A, 100B) connected to external electrodes (40A, 40B) via a bonding material (5), and an exterior material (3) that covers the multilayer ceramic capacitor main body 2, etc. The metal terminals (100A, 100B) include bonding surfaces (110A1, 110B1) that bond the bonding material (5) and contact surfaces (CS1, CS2) in contact with the exterior material (3). The contact surfaces (CS1, CS2) include a surface of an outermost surface plating film (100Ab2, 100Bb2) and a surface of an intermetallic compound (100Ab3, 100Bb3) having a wettability lower than that of the surface of the outermost surface plating film (100Ab2, 100Bb2).

Inventors

MIYAUCHI, SATOSHI

Assignees

Murata Manufacturing Co., Ltd.

Dates

Publication Date: 20260506
Application Date: 20230627

Claims (12)

A multilayer ceramic electronic component comprising: a multilayer ceramic electronic component main body including a multilayer body including a plurality of ceramic layers and a plurality of internal conductive layers that are laminated, a first main surface and a second main surface opposed to each other in a height direction, a first lateral surface and a second lateral surface opposed to each other in a width direction orthogonal or substantially orthogonal to the height direction, and a first end surface and a second end surface opposed to each other in a length direction orthogonal or substantially orthogonal to the height direction and the width direction, a first external electrode on the first end surface, and a second external electrode on the second end surface; a first metal terminal connected to the first external electrode via a bonding material; a second metal terminal connected to the second external electrode via a bonding material; an exterior material that covers the multilayer ceramic electronic component main body, a portion of the first metal terminal, and a portion of the second metal terminal, wherein the first metal terminal includes a first bonding surface bonded to the bonding material and a first contact surface in contact with the exterior material, the second metal terminal includes a second bonding surface bonded to the bonding material and a second contact surface in contact with the exterior material, the first contact surface in contact with the exterior material includes a surface of a first outermost surface metal film and a surface of a first intermetallic compound having a wettability lower than the surface of the first outermost surface metal film, and the second contact surface in contact with the exterior material includes a surface of a second outermost surface metal film and a surface of a second intermetallic compound having a wettability lower than the surface of the second outermost surface metal film.
The multilayer ceramic electronic component according to claim 1, wherein the first metal terminal includes a first base material and a first plating film provided on a surface of the first base material, the second metal terminal includes a second base material and a second plating film provided on a surface of the second base material, the first plating film includes a first outermost surface plating film of the first outermost surface metal film and a first lower layer plating film provided below the first outermost surface plating film, the second plating film includes a second outermost surface plating film of the second outermost surface metal film and a second lower layer plating film provided below the second outermost surface plating film, the first intermetallic compound includes an intermetallic compound of a metal of the first outermost surface plating film and a metal of the first lower layer plating film, and the second intermetallic compound includes an intermetallic compound of a metal of the second outermost surface plating film and a metal of the second lower layer plating film.
The multilayer ceramic electronic component according to claim 2, wherein each of the first outermost surface plating film and the second outermost surface plating film is a Sn plated film, each of the first lower layer plating film and the second lower layer plating film is a Ni plated film, and each of the first intermetallic compound and the second intermetallic compound includes an intermetallic compound of Ni and Sn.
The multilayer ceramic electronic component according to claim 2 or 3, wherein each of the first metal terminal and the second metal terminal is a metal terminal mounted on a mounting surface of a mounting substrate on which the multilayer ceramic electronic component is mounted, the first main surface of the multilayer body is a surface facing the mounting surface, the first external electrode is provided at least on a portion of the first main surface adjacent to the first end surface, the second external electrode is provided at least on a portion of the first main surface adjacent to the second end surface, the first metal terminal includes a first bonding portion that is opposed to the first main surface and connected to the first external electrode, a first rising portion that is connected to the first bonding portion and extends away from the mounting surface, and a first extension portion that is connected to the first rising portion and extends away from the multilayer ceramic electronic component, and the second metal terminal includes a second bonding portion that is opposed to the first main surface and connected to the second external electrode, a second rising portion that is connected to the second bonding portion and extends away from the mounting surface, and a second extension portion that is connected to the second rising portion and extends away from the multilayer ceramic electronic component.
The multilayer ceramic electronic component according to claim 4, wherein the first metal terminal is a plate-shaped member including a first front surface on the first bonding surface to which the first external electrode is bonded, a first opposite surface which is a surface opposite to the first front surface, and a first terminal lateral surface connecting the first front surface and the first opposite surface, and the second metal terminal is a plate-shaped member including a second front surface on the second bonding surface to which the second external electrode is bonded, a second opposite surface which is a surface opposite to the second front surface, and a second terminal lateral surface connecting the second front surface and the second opposite surface.
The multilayer ceramic electronic component according to claim 5, wherein surfaces of the first intermetallic compound provided on the first contact surface are spaced apart from each other on the first front surface, and provided on at least a portion of a surface between the first bonding portion and a middle of the first rising portion, and on the first extension portion, and surfaces of the second intermetallic compound provided on the second contact surface are spaced apart from each other on the second front surface, and provided on at least a portion of a surface between the second bonding portion and a middle of the second rising portion, and on the second extension portion.
The multilayer ceramic electronic component according to claim 5, wherein a surface of the first intermetallic compound provided on the first contact surface is provided on the first front surface and the first opposite surface of the first extension portion, and a surface of the second intermetallic compound provided on the second contact surface is provided on the second front surface and the second opposite surface of the second extension portion.
The multilayer ceramic electronic component according to claim 5, wherein a surface of the first intermetallic compound provided on the first contact surface is provided on the first opposite surface of the first bonding portion, and a surface of the second intermetallic compound provided on the second contact surface is provided on the second opposite surface of the second bonding portion.
The multilayer ceramic electronic component according to claim 5, wherein the first contact surface includes, as a surface in contact with the exterior material, a surface of the first outermost surface metal film, a surface of the first intermetallic compound, and a surface of the first base material, and the second contact surface includes, as a surface in contact with the exterior material, a surface of the second outermost surface metal film, a surface of the second intermetallic compound, and a surface of the second base material.
The multilayer ceramic electronic component according to claim 9, wherein the first contact surface includes, at the first bonding portion, a surface of the first outermost surface metal film located on the first front surface, a surface of the first intermetallic compound located on the first opposite surface, and a surface of the first base material located on a lateral surface, and the second contact surface includes, at the second bonding portion, a surface of the second outermost surface metal film located on the second front surface, a surface of the second intermetallic compound located on the second opposite surface, and a surface of the second base material located on a lateral surface.
The multilayer ceramic electronic component according to claim 10, wherein the first contact surface includes, on at least a portion of a surface between a middle of the first rising portion and the first bonding portion, a surface of the first intermetallic compound located on the first front surface, a surface of the first outermost surface metal film located on the first opposite surface, and a surface of the first base material located on a lateral surface, and the second contact surface includes, on at least a portion of a surface between a middle of the second rising portion and the second bonding portion, a surface of the second intermetallic compound located on the second front surface, a surface of the second outermost surface metal film located on the second opposite surface, and a surface of the second base material located on a lateral surface.
The multilayer ceramic electronic component according to claim 1 or 2, wherein surfaces of the first intermetallic compound provided on the first contact surface are separated in the width direction by a hole or a notch provided in the first metal terminal, and surfaces of the second intermetallic compound provided on the second contact surface are separated in the width direction by a hole or a notch provided in the second metal terminal.

Description

TECHNICAL FIELD The present invention relates to a multilayer ceramic electronic component. BACKGROUND ART Conventionally, multilayer ceramic electronic components each covered with a resin functioning as an exterior material are known. In each of such multilayer ceramic electronic components, metal terminals each extending to the outside of the exterior material and external electrodes each provided on the surface of the multilayer ceramic electronic component main body are bonded to each other by a bonding material containing a metal such as solder inside the exterior material. Citation List Patent Document Patent Document 1: Japanese Unexamined Patent Application, Publication No. 2019-145767 DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention Japanese Unexamined Patent Application Publication No. 2019-145767 discloses a multilayer ceramic electronic component including a plating film on a surface of a frame functioning as a metal terminal. Since the plating film is provided on the metal terminal, the bonding property by the bonding material can be enhanced. However, when the plating film having high wettability is provided on the entire surface of the metal terminal, the bonding material may excessively flow out along the metal terminal. In this case, the bonding material is likely to approach the surface of the exterior material, and when the bonding material is remelted and the volume of the bonding material expands during reflow at the time of mounting the substrate, a phenomenon of solder splash may occur in which a solder component is ejected from the interface between the exterior material and the metal terminal. Embodiments of the present invention provide multilayer ceramic electronic components that are each able to reduce or prevent excessive flow of a bonding material appropriately to reduce or prevent the occurrence of solder splash. Means for Solving the Problems Embodiments of the present invention provide multilayer ceramic electronic components that each include: a multilayer ceramic electronic component main body including a multilayer body including a plurality of ceramic layers and a plurality of internal conductive layers that are laminated, a first main surface and a second main surface opposed to each other in a height direction, a first lateral surface and a second lateral surface opposed to each other in a width direction orthogonal or substantially orthogonal to the height direction, and a first end surface and a second end surface opposed to each other in a length direction orthogonal orsubstantially orthogonal to the height direction and the width direction, a first external electrode on the first end surface, and a second external electrode on the second end surface; a first metal terminal connected to the first external electrode via a bonding material; a second metal terminal connected to the second external electrode via a bonding material; an exterior material that covers the multilayer ceramic electronic component main body, a portion of the first metal terminal, and a portion of the second metal terminal,in which the first metal terminal includes a first bonding surface bonded to the bonding material and a first contact surface in contact with the exterior material, the second metal terminal includes a second bonding surface bonded to the bonding material and a second contact surface in contact with the exterior material, the first contact surface in contact with the exterior material includes a surface of a first outermost surface metal film and a surface of a first intermetallic compound having a wettability lower than the surface of the first outermost surface metal film, and the second contact surface in contact with the exterior material includes a surface of a second outermost surface metal film and a surface of a second intermetallic compound having a wettability lower than the surface of the second outermost surface metal film. Effects of the Invention According to embodiments of the present invention, it is possible to provide multilayer ceramic electronic components that are each able to reduce or prevent excessive flow of a bonding material appropriately to reduce or prevent the occurrence of solder splash. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an external perspective view of a multilayer ceramic capacitor of an embodiment of the present invention. FIG. 2 is an arrow view when the multilayer ceramic capacitor of FIG. 1 is viewed in the direction of the arrow II. FIG. 3 is an arrow view when the multilayer ceramic capacitor of FIG. 2 is viewed in the direction of the arrow III. FIG. 4 is an arrow view when the multilayer ceramic capacitor of FIG. 2 is viewed in the direction of the arrow IV. FIG. 5 is a diagram corresponding to FIG. 1, and is an imaginary perspective view for explaining an internal structure of the multilayer ceramic capacitor. FIG. 6 is an imaginary arrow view when the multilayer ceramic capacitor of FIG. 5 is viewed in th