EP-4738404-A1 - MULTILAYER CERAMIC ELECTRONIC COMPONENT

EP4738404A1EP 4738404 A1EP4738404 A1EP 4738404A1EP-4738404-A1

Abstract

An object of the present invention is to provide multilayer ceramic electronic components each including a plurality of multilayer ceramic electronic component bodies and metal terminals and each being excellent in degrees of freedom of design of lands. In a multilayer ceramic capacitor 1, a first metal terminal 50A includes a first bonding portion 51A that is opposed to each of first end surfaces CA and is connected to each of the first external electrodes 30A and extends more in the direction toward a third direction outer side Z2 than the multilayer ceramic capacitor body 10, a first mounting portion 61A that extends in the direction toward the second direction middle side Y1 from an end portion of the first bonding portion 51A in the direction toward the third direction outer side Z2 and is connected to a land, and a first rising portion 63A that extends in the direction toward the third direction middle side Z1 from an end portion of the first mounting portion 61A in the direction toward the second direction middle side Y1, and a first holding portion 65A that extends in the direction toward the second direction outer side Y2 from an end portion of the first rising portion 63A in the direction toward the third direction middle side Z1 and is opposed to each of the multilayer ceramic capacitor main bodies 10 in the third direction Z. The first metal terminal 50A is provided so as to straddle the first external electrode 30A of each of the multilayer ceramic capacitor bodies 10.

Inventors

HASEGAWA, NAOTAKA
Ikeda, Moeko
FUJIWARA, Keita
YORIMOTO, JUNPEI

Assignees

MURATA MANUFACTURING CO., LTD.

Dates

Publication Date: 20260506
Application Date: 20240807

Claims (9)

A multilayer ceramic electronic component to be connected to a land provided on a mounting substrate, the multilayer ceramic electronic component comprising: a plurality of multilayer ceramic electronic component bodies each including a multilayer body including an inner layer portion including a plurality of ceramic layers and a plurality of internal electrodes alternately laminated, a pair of outer layer portions that sandwich the inner layer portion in a lamination direction, a first main surface and a second main surface opposed to each other in the lamination direction, a first lateral surface and a second lateral surface opposed to each other in a width direction orthogonal to the lamination direction, and a first end surface and a second end surface opposed to each other in a length direction orthogonal to the lamination direction and the width direction, a first external electrode on the first end surface, and a second external electrode on the second end surface; a first metal terminal connected to the first external electrode; and a second metal terminal connected to the second external electrode, wherein each of the multilayer ceramic electronic component bodies is oriented so that the length direction of each of the multilayer ceramic electronic component bodies is parallel to each other, and each of the multilayer ceramic electronic component bodies is arranged in a direction orthogonal to the length direction of the multilayer ceramic electronic component bodies, when a direction in which the multilayer ceramic electronic component bodies are arranged is defined as a first direction, a direction parallel to the length direction of each of the multilayer ceramic electronic component bodies among directions orthogonal to the first direction is defined as a second direction, a direction orthogonal to the first direction and the second direction is defined as a third direction, a direction approaching a middle portion of the multilayer body in the second direction is defined as a direction toward a second direction middle side, a direction away from the middle portion of the multilayer body in the second direction is defined as a direction toward a second direction outer side, a direction approaching a middle portion of the multilayer body in the third direction is defined as a direction toward a third direction middle side, and a direction away from the middle portion of the multilayer body in the third direction is defined as a direction toward a third direction outer side, the first metal terminal includes a first bonding portion that is opposed to each of the first end surfaces, is connected to each of the first external electrodes, and extends more in a direction toward the third direction outer side than each of the multilayer ceramic electronic component bodies, a first mounting portion that extends in a direction toward the second direction middle side from an end portion of the first bonding portion in a direction toward the third direction outer side and is connected to the land, a first rising portion that extends in a direction toward the third direction middle side from an end portion of the first mounting portion in a direction toward the second direction middle side, and a first holding portion that extends in a direction toward the second direction outer side from an end portion of the first rising portion in a direction toward the third direction middle side and is opposed to each of the multilayer ceramic electronic component bodies in the third direction, wherein the first metal terminal is provided so as to straddle the first external electrode of each of the multilayer ceramic electronic component bodies, and the second metal terminal includes a second bonding portion that is opposed to each of the second end surfaces, is connected to each of the second external electrodes, and extends more in a direction toward the third direction outer side than each of the multilayer ceramic electronic component bodies, a second mounting portion that extends in a direction toward the second direction middle side from an end portion of the second bonding portion in a direction toward the third direction outer side and is connected to the land, a second rising portion that extends in a direction toward the third direction middle side from an end portion of the second mounting portion in a direction toward the second direction middle side, and a second holding portion that extends in a direction toward the second direction outer side from an end portion of the second rising portion in a direction toward the third direction middle side and is opposed to each of the multilayer ceramic electronic component bodies in the third direction, wherein the second metal terminal is provided so as to straddle the second external electrode of each of the multilayer ceramic electronic component bodies.
The multilayer ceramic electronic component according to claim 1, wherein the first bonding portion includes a plurality of first slit portions extending in the third direction, the plurality of first slit portions are provided at positions overlapping in the second direction with portions between adjacent first external electrodes, the second bonding portion includes a plurality of second slit portions extending in the third direction, and the plurality of second slit portions are provided at positions overlapping in the second direction with portions between adjacent second external electrodes.
The multilayer ceramic electronic component according to claim 1, wherein the first bonding portion includes a plurality of first slit portions extending in the third direction, the plurality of first slit portions are provided at positions overlapping the first external electrode in the second direction, the second bonding portion includes a plurality of second slit portions extending in the third direction, and the plurality of second slit portions are provided at positions overlapping the second external electrode in the second direction.
The multilayer ceramic electronic component according to claim 2 or 3, wherein a maximum dimension in the first direction between the first slit portions which are adjacent is larger than a minimum dimension in the first direction of the first slit portions, and a maximum dimension in the first direction between the second slit portions which are adjacent is larger than a minimum dimension in the first direction of the second slit portions.
The multilayer ceramic electronic component according to claim 2 or 3, wherein a dimension of the first slit portion in the third direction is longer than a half of a dimension of the first external electrode in the third direction and shorter than a dimension of the first external electrode in the third direction, and a dimension of the second slit portion in the third direction is longer than a half of a dimension of the second external electrode in the third direction and shorter than a dimension of the second external electrode in the third direction.
The multilayer ceramic electronic component according to claim 2 or 3, wherein a dimension in the first direction of an end portion on a side closer to the first mounting portion among end portions in the third direction of the first slit portion is smaller than a dimension in the first direction of an end portion on a side farther from the first mounting portion among the end portions in the third direction of the first slit portion, and a dimension in the first direction of an end portion on a side closer to the second mounting portion among end portions in the third direction of the second slit portion is smaller than a dimension in the first direction of an end portion on a side farther from the second mounting portion among the end portions in the third direction of the second slit portion.
The multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the first bonding portion includes a plurality of first protrusions protruding toward each of the first external electrodes, and the second bonding portion includes a plurality of second protrusions protruding toward each of the second external electrodes.
The multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the first bonding portion has a first through-hole portion and a first notch that each penetrate the first bonding portion in the second direction at a position overlapping the first external electrode in the second direction, and the second bonding portion has a second through-hole portion and a second notch that each penetrate the second bonding portion in the second direction at a position overlapping the second external electrode in the second direction.
The multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the plurality of internal electrodes include first internal electrodes each extending toward the first end surface, second internal electrodes each extending toward the second end surface, and intermediate electrodes each extending toward neither the first end surface nor the second end surface, the first rising portion is provided more in a direction toward the second direction outer side than an end portion of each of the first internal electrodes in a direction toward the second direction middle side, and the second rising portion is provided more in a direction toward the second direction outer side than an end portion of each of the second internal electrodes in a direction toward the second direction middle side.

Description

TECHNICAL FIELD The present invention relates to a multilayer ceramic electronic component. BACKGROUND ART In the prior art, there are ceramic electronic components that each include a pair of chips and a pair of metal terminal portions provided corresponding to the end surfaces of the pair of chips (for example, Patent Document 1). According to the ceramic electronic component of Patent Document 1, it is possible to prevent the vibration generated in the chip component from being transmitted to the mounting substrate via the metal terminal, protect the chip component from deformation stress, impact, and the like received from the substrate after mounting, and prevent an increase in the mounting area. Citation List Patent Document Patent Document 1: Japanese Unexamined Patent Application, Publication No. 2021-093542 DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention In the ceramic electronic component of Patent Document 1, the solder connecting the ceramic electronic component to the mounting substrate spreads on the surface of the metal terminal opposite to the chip component. In order to cause the solder to spread on the surface of the metal terminal opposite to the chip component, in principle, the land needs to extend to the side opposite to the chip component across the metal terminal. It is believed to be advantageous if the configuration of the lands can be changed in accordance with the arrangement of components and the like around the lands. However, the ceramic electronic component of Patent Document 1 has room for improvement in terms of the degrees of freedom in design of lands. An object of the present invention is to provide multilayer ceramic electronic components each including a plurality of multilayer ceramic electronic component bodies and metal terminals and each being excellent in freedom of design of lands. Means for Solving the Problems In order to solve the abovementioned issue, an embodiment of the present invention provides a multilayer ceramic electronic component to be connected to a land provided on a mounting substrate. The multilayer ceramic electronic component includes: a plurality of multilayer ceramic electronic component bodies each including a multilayer body including an inner layer portion including a plurality of ceramic layers and a plurality of internal electrodes alternately laminated, a pair of outer layer portions that sandwich the inner layer portion in a lamination direction, a first main surface and a second main surface opposed to each other in the lamination direction, a first lateral surface and a second lateral surface opposed to each other in a width direction orthogonal to the lamination direction, and a first end surface and a second end surface opposed to each other in a length direction orthogonal to the lamination direction and the width direction, a first external electrode on the first end surface, and a second external electrode on the second end surface; a first metal terminal connected to the first external electrode; and a second metal terminal connected to the second external electrode. Each of the multilayer ceramic electronic component bodies is oriented so that the length direction of each of the multilayer ceramic electronic component bodies is parallel to each other, and each of the multilayer ceramic electronic component bodies is arranged in a direction orthogonal to the length direction of the multilayer ceramic electronic component bodies. When a direction in which the multilayer ceramic electronic component bodies are arranged is defined as a first direction, a direction parallel to the length direction of each of the multilayer ceramic electronic component bodies among directions orthogonal to the first direction is defined as a second direction, a direction orthogonal to the first direction and the second direction is defined as a third direction, a direction approaching a middle portion of the multilayer body in the second direction is defined as a direction toward a second direction middle side, a direction away from the middle portion of the multilayer body in the second direction is defined as a direction toward a second direction outer side, a direction approaching a middle portion of the multilayer body in the third direction is defined as a direction toward a third direction middle side, and a direction away from the middle portion of the multilayer body in the third direction is defined as a direction toward a third direction outer side, the first metal terminal includes a first bonding portion that is opposed to each of the first end surfaces, is connected to each of the first external electrodes, and extends more in a direction toward the third direction outer side than each of the multilayer ceramic electronic component bodies, a first mounting portion that extends in a direction toward the second direction middle side from an end portion of the first bonding portion in a direction toward the third direct