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EP-4738433-A1 - LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

EP4738433A1EP 4738433 A1EP4738433 A1EP 4738433A1EP-4738433-A1

Abstract

To suppress occurrence of mold flash during compression molding. A liquid compression molding material containing an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a vinyl-based polymer (D), an electronic component and a semiconductor device manufactured using the same, and a method for manufacturing the electronic component using the same.

Inventors

  • AOYAMA Kyota
  • SHIGENO Yuto
  • IKEDA YUKIHIRO

Assignees

  • Namics Corporation

Dates

Publication Date
20260506
Application Date
20240301

Claims (14)

  1. A liquid compression molding material comprising: an epoxy resin (A); a curing agent (B); an inorganic filler (C); and a vinyl-based polymer (D).
  2. The liquid compression molding material according to claim 1, wherein a content of the vinyl-based polymer (D) with respect to 100 parts by mass of the epoxy resin (A) is 0.004 parts by mass to 15 parts by mass.
  3. The liquid compression molding material according to claim 1 or 2, wherein a content of the vinyl-based polymer (D) with respect to 100 parts by mass of the epoxy resin (A) is 0.5 parts by mass to 15 parts by mass.
  4. The liquid compression molding material according to any one of claims 1 to 3, wherein a blending ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is 60 mass% to 90 mass%.
  5. The liquid compression molding material according to any one of claims 1 to 4, wherein the vinyl-based polymer (D) contains at least one vinyl ether polymer.
  6. The liquid compression molding material according to any one of claims 1 to 5, wherein the vinyl-based polymer (D) has a number average molecular weight of 1000 to 150000.
  7. The liquid compression molding material according to any one of claims 1 to 6, further comprising a solvent (E).
  8. The liquid compression molding material according to any one of claims 1 to 7, wherein a maximum diameter of a cured product of the liquid compression molding material obtained by a half-shot test performed under conditions of pre-stirring and defoaming for 90 minutes, a clamping force of 10 kN, a supply amount of the liquid compression molding material of 11.2 cm 3 , and static degassing at 200hPa is less than 280 mm.
  9. The liquid compression molding material according to any one of claims 1 to 8, wherein the epoxy resin (A) contains one or more selected from the group consisting of aminophenol type epoxy, bisphenol A type epoxy, bisphenol F type epoxy, glycidylamine type epoxy, and polytetramethylene glycol diglycidyl ether.
  10. The liquid compression molding material according to any one of claims 1 to 9, wherein the curing agent (B) is an imidazole-based curing agent.
  11. The liquid compression molding material according to any one of claims 1 to 10, wherein a viscosity at 120°C is 0.3 Pa·s to 30 Pa·s.
  12. An electronic component comprising a sealing material containing a cured product of the liquid compression molding material according to any one of claims 1 to 11.
  13. A semiconductor device comprising: a substrate; a semiconductor element disposed on the substrate; and a cured product of the liquid compression molding material according to any one of claims 1 to 11, the cured product sealing a gap between the semiconductor element and the substrate.
  14. A method for manufacturing an electronic component, the method comprising at least a compression molding step using the liquid compression molding material according to any one of claims 1 to 11, wherein the electronic component includes a substrate, an element disposed on the substrate, and a sealing material containing a cured product of the liquid compression molding material sealing a gap between the element and the substrate.

Description

TECHNICAL FIELD The present invention relates to a liquid compression molding material, an electronic component, a semiconductor device, and a method for manufacturing the electronic component. BACKGROUND ART Most of semiconductor elements such as integrated circuits constituting the semiconductor device are sealed with a sealing material. There are a plurality of molding methods for sealing the semiconductor element, but in recent years, compression molding which is more suitable for manufacturing a relatively large molded article has been increasingly adopted for sealing the semiconductor element. This is due to spread of wafer-level chip size package technology (technology for sealing a wafer in a state after completion of circuit formation and before separation into individual chips as it is), and the like. As a conventional curable resin composition used for sealing the semiconductor element by compression molding, a solid resin composition such as a granular resin composition has been mainly used. However, recently, with development of a new compression molding technology, a liquid curable resin composition (so-called liquid compression molding material) is also often used. Therefore, various LCM materials have been proposed (for example, PATENT LITERATURE 1). Hereinafter, the liquid compression molding material may be abbreviated as "liquid compression molding (LCM) material". CITATION LIST PATENT LITERATURE PATENT LITERATURE 1: JP-A-2016-108367 SUMMARY OF INVENTION PROBLEMS TO BE SOLVED BY INVENTION On the other hand, when the compression molding is performed using a conventional LCM material, a phenomenon (mold flash) may occur in which the LCM material leaks out to a region (a surface of the lower mold not covered with the substrate) on an outer peripheral side of a substrate such as a wafer disposed on a lower mold of a compression molding apparatus. Then, when the mold flash occurs, since the leaking LCM material enters device details such as vacuum piping, an operation of the compression molding apparatus needs to be stopped for repair or maintenance, resulting in a decrease in productivity and an increase in manufacturing cost. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an LCM material capable of suppressing occurrence of the mold flash during compression molding, an electronic component and a semiconductor device manufactured using the LCM material, and a method for manufacturing the electronic component using the LCM material. SOLUTION TO PROBLEMS The above-described object is achieved by the following present invention. That is, the liquid compression molding material according to the present invention contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a vinyl-based polymer (D). In an embodiment of the liquid compression molding material according to the present invention, a content of the vinyl-based polymer (D) with respect to 100 parts by mass of the epoxy resin (A) is preferably 0.004 parts by mass to 15 parts by mass. In another embodiment of the liquid compression molding material according to the present invention, a content of the vinyl-based polymer (D) with respect to 100 parts by mass of the epoxy resin (A) is preferably 0.5 parts by mass to 15 parts by mass. In another embodiment of the liquid compression molding material according to the present invention, a blending ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is preferably 60 mass% to 90 mass%. In another embodiment of the liquid compression molding material according to the present invention, the vinyl-based polymer (D) preferably contains at least one vinyl ether polymer. In another embodiment of the liquid compression molding material according to the present invention, the vinyl-based polymer (D) preferably has a number average molecular weight of 1000 to 150000. Another embodiment of the liquid compression molding material according to the present invention preferably further contains a solvent (E). In another embodiment of the liquid compression molding material according to the present invention, a maximum diameter of a cured product of the liquid compression molding material obtained by a half-shot test performed under conditions of pre-stirring and defoaming for 90 minutes, a clamping force of 10 kN, a supply amount of the liquid compression molding material of 11.2 cm3, and static degassing at 200hPa is preferably less than 280 mm. In another embodiment of the liquid compression molding material according to the present invention, the epoxy resin (A) preferably contains one or more selected from the group consisting of aminophenol type epoxy, bisphenol A type epoxy, bisphenol F type epoxy, glycidylamine type epoxy, and polytetramethylene glycol diglycidyl ether. In another embodiment of the liquid compression molding material according to the present