EP-4738434-A1 - CHIP HEAT DISSIPATION ASSEMBLY AND VEHICLE

EP4738434A1EP 4738434 A1EP4738434 A1EP 4738434A1EP-4738434-A1

Abstract

Embodiments of this application relate to the field of heat dissipation technologies, and provide a chip heat dissipation assembly and a vehicle, to reduce stress on a chip while improving a heat dissipation capability of the chip heat dissipation assembly. The chip heat dissipation assembly includes a circuit board, a chip, a heat dissipation structure, and a thermally conductive medium. The chip is located on the circuit board. The heat dissipation structure covers a side that is of the chip and that is away from the circuit board, and is connected to the circuit board. The heat dissipation structure includes a heat dissipation panel, an enclosure part, and a boss part, and the enclosure part and the boss part are located on a side that is of the heat dissipation panel and that is close to the chip. Both the enclosure part and the boss part are connected to the heat dissipation panel, and the enclosure part is disposed around the boss part. Closed space is enclosed by the heat dissipation panel, the enclosure part, the boss part, and the chip, and there is a gap between the boss part and the chip. The thermally conductive medium is filled in the closed space. The thermally conductive medium is in a solid state at a first temperature, and is in a liquid state at a second temperature. The second temperature is higher than the first temperature. The chip heat dissipation assembly is used in the vehicle, to improve a heat dissipation capability of a chip in the vehicle.

Inventors

PENG, YAOFENG

Assignees

Shenzhen Yinwang Intelligent Technologies Co., Ltd.

Dates

Publication Date: 20260506
Application Date: 20240516

Claims (10)

A chip heat dissipation assembly, comprising: a circuit board; a chip, located on the circuit board; a heat dissipation structure, covering a side that is of the chip and that is away from the circuit board, and connected to the circuit board, wherein the heat dissipation structure comprises a heat dissipation panel, an enclosure part, and a boss part, the enclosure part and the boss part are located on a side that is of the heat dissipation panel and that is close to the chip; both the enclosure part and the boss part are connected to the heat dissipation panel, and the enclosure part is disposed around the boss part; and closed space is enclosed by the heat dissipation panel, the enclosure part, the boss part, and the chip, and there is a gap between the boss part and the chip; and a thermally conductive medium, filled in the closed space, wherein the thermally conductive medium is in a solid state at a first temperature, and is in a liquid state at a second temperature, and the second temperature is higher than the first temperature.
The chip heat dissipation assembly according to claim 1, wherein the enclosure part comprises a first end face away from the heat dissipation panel, the chip comprises a second end face away from the circuit board, and the first end face is opposite to the second end face.
The chip heat dissipation assembly according to claim 2, wherein the enclosure part is disposed around an edge of the second end face.
The chip heat dissipation assembly according to any one of claims 1 to 3, wherein in a direction perpendicular to the circuit board, a size of the enclosure part is greater than a size of the boss part.
The chip heat dissipation assembly according to any one of claims 1 to 4, wherein the boss part comprises a third end face facing the chip, the third end face comprises a first micro groove, and an extension direction of the first micro groove is parallel to the third end face.
The chip heat dissipation assembly according to any one of claims 1 to 5, wherein the chip comprises the second end face away from the circuit board, the second end face comprises a second micro groove, and an extension direction of the second micro groove is parallel to the second end face.
The chip heat dissipation assembly according to any one of claims 1 to 6, further comprising: a sealing structure, located between the enclosure part and the chip.
The chip heat dissipation assembly according to claim 7, wherein the sealing structure is a porous structure, and diameters of a plurality of holes in the sealing structure are greater than a diameter of an air molecule.
The chip heat dissipation assembly according to any one of claims 1 to 8, wherein the thermally conductive medium is liquid metal.
A vehicle, comprising: a vehicle body, and the chip heat dissipation assembly according to any one of claims 1 to 9, wherein the chip heat dissipation assembly is located inside the vehicle body.

Description

This application claims priority to Chinese Patent Application No. 202311137997.0, filed with the China National Intellectual Property Administration on September 1, 2023 and entitled "CHIP HEAT DISSIPATION ASSEMBLY AND VEHICLE", which is incorporated herein by reference in its entirety. TECHNICAL FIELD This application relates to the field of heat dissipation technologies, and in particular, to a chip heat dissipation assembly and a vehicle. BACKGROUND With continuous improvement of a vehicle automation level, power consumption of a chip used in an internal module of a vehicle increases sharply, and heat dissipation becomes an important challenge to improve computing power of the chip. Whether heat of the chip can be well dissipated directly affects vehicle performance. However, a heat dissipation capability of an existing heat dissipation apparatus for dissipating heat of a chip is poor, and stress on the chip is large. Consequently, working reliability of the chip is low. SUMMARY Embodiments of this application provide a chip heat dissipation assembly and a vehicle, to reduce stress on a chip while improving a heat dissipation capability of the chip heat dissipation assembly. To achieve the foregoing objectives, the following technical solutions are used in embodiments of this application. According to a first aspect, a chip heat dissipation assembly is provided. The chip heat dissipation assembly includes a circuit board, a chip, a heat dissipation structure, and a thermally conductive medium. The chip is located on the circuit board. The heat dissipation structure covers a side that is of the chip and that is away from the circuit board, and is connected to the circuit board. The heat dissipation structure includes a heat dissipation panel, an enclosure part, and a boss part, and the enclosure part and the boss part are located on a side that is of the heat dissipation panel and that is close to the chip. Both the enclosure part and the boss part are connected to the heat dissipation panel, and the enclosure part is disposed around the boss part. Closed space is enclosed by the heat dissipation panel, the enclosure part, the boss part, and the chip, and there is a gap between the boss part and the chip. The thermally conductive medium is filled in the closed space. The thermally conductive medium is in a solid state at a first temperature, and is in a liquid state at a second temperature, and the second temperature is higher than the first temperature. In the chip heat dissipation assembly provided in this embodiment of this application, the chip is located between the heat dissipation structure and the circuit board. The heat dissipation structure includes the heat dissipation panel, the enclosure part, and the boss part. Both the enclosure part and the boss part are located on the side that is of the heat dissipation panel and that is close to the chip, and both the enclosure part and the boss part are connected to the heat dissipation panel. The enclosure part is disposed around the boss part. The closed space is enclosed by the heat dissipation panel, the enclosure part, the boss part, and the chip, to provide accommodating space for the thermally conductive medium. The thermally conductive medium is in the solid state at the first temperature. In a preparation process of the chip heat dissipation assembly provided in this embodiment of this application, the thermally conductive medium may be assembled at the first temperature. In this way, assembling difficulty of the thermally conductive medium may be low, so that preparation difficulty of the chip heat dissipation assembly can be reduced, and preparation efficiency of the chip heat dissipation assembly is improved. The thermally conductive medium is in the liquid state at the second temperature. After the thermally conductive medium in the solid state is placed in the closed space, the assembled chip heat dissipation assembly may be placed in an environment whose temperature is the second temperature, so that the thermally conductive medium changes from the solid state to the liquid state, and the thermally conductive medium in the liquid state is filled in the gap between the boss part and the chip. In this way, the thermally conductive medium in the liquid state does not apply stress to the boss part and the chip, thereby helping improve working stability of the chip and increasing a yield rate of the chip heat dissipation assembly. It may be understood that, even if the chip heat dissipation assembly is taken out from the environment whose temperature is the second temperature, the thermally conductive medium changes from the liquid state to the solid state again. Because a size of a part that is of the thermally conductive medium and that is located in the gap in a direction perpendicular to the circuit board is completely the same as a size of the gap in the direction perpendicular to the circuit board, the thermally conductive medium does