EP-4738435-A1 - ELECTRONIC ASSEMBLY, ELECTRONIC DEVICE AND CHIP STRUCTURE

EP4738435A1EP 4738435 A1EP4738435 A1EP 4738435A1EP-4738435-A1

Abstract

This application provides an electronic assembly, an electronic device, and a chip structure, and relates to the field of packaging technologies, to improve a heat dissipation capability of the electronic assembly. The electronic assembly includes a circuit board, a first chip, a second chip, and a heat transfer plate. The heat transfer plate is located on a side of the circuit board. The first chip is located between the heat transfer plate and the circuit board, the first chip is connected to the circuit board, and the first chip is connected to the heat transfer plate. The second chip is located on a side that is of the heat transfer plate and that faces away from the circuit board, and the second chip is connected to the heat transfer plate. The chip structure may be used in the electronic assembly, and the electronic assembly may be used in the electronic device.

Inventors

WANG, SHAOLEI
ZHANG, WEI
YUAN, Lingcheng
WANG, Liangmeng

Assignees

Huawei Technologies Co., Ltd.

Dates

Publication Date: 20260506
Application Date: 20241031

Claims (20)

An electronic assembly, comprising: a circuit board, a first chip, a second chip, and a heat transfer plate, wherein the heat transfer plate is located on a side of the circuit board; and the first chip is located between the heat transfer plate and the circuit board, the first chip is connected to the circuit board, the first chip is connected to the heat transfer plate, the second chip is located on a side that is of the heat transfer plate and that faces away from the circuit board, and the second chip is connected to the heat transfer plate.
The electronic assembly according to claim 1, wherein a surface of a side that is of the first chip and that is close to the heat transfer plate comprises a plurality of first contacts; and the electronic assembly further comprises a plurality of first solder balls located between the heat transfer plate and the first chip, the heat transfer plate is connected to the plurality of first contacts through the plurality of first solder balls, and at least one of the plurality of first solder balls is not configured to transmit an electrical signal.
The electronic assembly according to claim 1 or 2, wherein a surface of a side that is of the second chip and that is close to the heat transfer plate comprises a plurality of second contacts; and the electronic assembly further comprises a plurality of second solder balls located between the heat transfer plate and the second chip, the heat transfer plate is connected to the plurality of second contacts through the plurality of second solder balls, and at least one of the plurality of second solder balls is not configured to transmit an electrical signal.
The electronic assembly according to any one of claims 1 to 3, wherein the electronic assembly further comprises underfill filled between the heat transfer plate and the first chip and/or between the heat transfer plate and the second chip.
The electronic assembly according to claim 1, wherein the first chip comprises a first die and a first protection portion, the heat transfer plate is disposed on a side that is of the first die and that faces away from the circuit board, a surface that is of the heat transfer plate and that faces away from the circuit board comprises a heat dissipation surface and a plurality of third contacts, the heat dissipation surface is electrically insulated from the plurality of third contacts, the first protection portion surrounds the first die and the heat transfer plate, the first protection portion exposes the heat dissipation surface and the third contacts, and the plurality of third contacts are connected to the second chip.
The electronic assembly according to claim 5, wherein the first protection portion comprises a first packaging substrate and a first plastic packaging portion, a surface that is of the first die and that faces away from the heat transfer plate is connected to the first packaging substrate, and the first plastic packaging portion is connected to the first packaging substrate and at least surrounds a side surface of the first die and all or a part of a surface that is of the heat transfer plate and that is close to the first die; and the first chip further comprises a heat-conducting portion, the heat-conducting portion is located in the first plastic packaging portion, and the heat-conducting portion is connected to the first packaging substrate and the heat transfer plate.
The electronic assembly according to claim 6, wherein there is one or more heat-conducting portions, and at least one of the heat-conducting portions is configured to be capable of conducting an electrical signal.
The electronic assembly according to any one of claims 5 to 7, wherein the first die is connected to the heat transfer plate; or the first chip further comprises a connection plate, the connection plate is stacked between the first die and the heat transfer plate, and the connection plate is connected to both the first die and the heat transfer plate.
The electronic assembly according to any one of claims 1 to 4, wherein a surface that is of the heat transfer plate and that faces away from the circuit board comprises a heat dissipation surface and a plurality of third contacts, the heat dissipation surface is electrically insulated from the plurality of third contacts, and the plurality of third contacts are connected to the second chip.
The electronic assembly according to any one of claims 5 to 9, wherein the plurality of third contacts form at least one third contact group, the heat dissipation surface comprises a first heat dissipation surface, and the first heat dissipation surface is disposed around at least one side of the third contact group.
The electronic assembly according to any one of claims 5 to 10, wherein the heat dissipation surface further comprises a second heat dissipation surface; and the heat transfer plate comprises a via, the heat transfer plate comprises a heat transfer portion located in the via, and the heat transfer portion comprises the second heat dissipation surface.
The electronic assembly according to any one of claims 5 to 11, further comprising a first heat-dissipation heat sink and a first heat-conducting structure, wherein the first heat-dissipation heat sink is located on a side that is of the second chip and that faces away from the heat transfer plate; and the first heat-conducting structure is connected to the heat dissipation surface of the heat transfer plate and the first heat-dissipation heat sink.
The electronic assembly according to claim 12, wherein the first heat-conducting structure is connected to the heat dissipation surface of the heat transfer plate through soldering or a thermal interface material; or the first heat-conducting structure and the heat transfer plate are of an integrated structure.
The electronic assembly according to claim 12 or 13, wherein a thermal interface material is filled between the first heat-dissipation heat sink and the first heat-conducting structure, or the first heat-dissipation heat sink and the first heat-conducting structure are of an integrated structure; and/or a thermal interface material is filled between the first heat-dissipation heat sink and the second chip.
The electronic assembly according to any one of claims 12 to 14, wherein the first heat-conducting structure is located between the heat transfer plate and the first heat-dissipation heat sink, and the first heat-conducting structure is located on at least one side of the second chip.
The electronic assembly according to claim 15, wherein the first heat-conducting structure comprises a first heat-conducting portion, the first heat-conducting portion extends in a first direction, and the first direction is parallel to a plane on which the heat transfer plate is located; and there are a plurality of second chips, the plurality of second chips are arranged in the first direction, and the plurality of second chips are located on a same side of the first heat-conducting portion.
The electronic assembly according to claim 16, wherein the first heat-conducting structure further comprises a second heat-conducting portion, and the second heat-conducting portion extends in the first direction; and in a second direction, the plurality of second chips are located between the first heat-conducting portion and the second heat-conducting portion, and the second direction intersects with the first direction.
The electronic assembly according to claim 17, wherein there are a plurality of second chips, and the first heat-conducting structure is located between at least two of the second chips.
The electronic assembly according to claim 18, wherein the heat transfer plate comprises an opening; and the first heat-conducting structure passes through the opening and is connected to the first chip.
The electronic assembly according to claim 19, wherein a thermal interface material is filled between the first heat-conducting structure and the first chip.

Description

This application claims priority to Chinese Patent Application No. 202410099181.1, filed with the China National Intellectual Property Administration on January 23, 2024 and entitled "ELECTRONIC ASSEMBLY, ELECTRONIC DEVICE, AND CHIP STRUCTURE", which is incorporated herein by reference in its entirety. TECHNICAL FIELD Embodiments of this application relate to the field of packaging technologies, and in particular, to an electronic assembly, an electronic device, and a chip structure. BACKGROUND Package on package (Package on package, POP) is an integrated circuit packaging method usually used to combine a system on chip (system on chip, SOC) and a memory chip that are vertically discrete. For example, two or more chips are mounted atop each other, that is, stacked, to form a POP packaged component. In this case, signal interconnection may be provided between chips through a standard interface (standard interface), which has advantages of high bandwidth and a short signal transmission path. The POP packaged component is usually used in electronic devices such as a mobile phone, a personal digital assistant (personal digital assistant, PDA), and a digital camera, to achieve a higher-density component layout. However, as performance of the electronic devices improves generation by generation, thermal power consumption of chips also increases. Therefore, a challenge brought by heat dissipation of the POP packaged component becomes increasingly prominent. SUMMARY This application provides an electronic assembly, an electronic device, and a chip structure, to enhance a heat dissipation capability of the electronic assembly. According to one aspect, an electronic assembly is provided, including: a circuit board, a first chip, a second chip, and a heat transfer plate. The heat transfer plate is located on a side of the circuit board. The first chip is located between the heat transfer plate and the circuit board, the first chip is connected to the circuit board, and the first chip is connected to the heat transfer plate. The second chip is located on a side that is of the heat transfer plate and that faces away from the circuit board, and the second chip is connected to the heat transfer plate. In the electronic assembly provided in this embodiment of this application, because the heat transfer plate is disposed between the first chip and the second chip, heat of the first chip and heat of the second chip may be separately conducted outward through the heat transfer plate, for example, may be conducted outward to an external heat dissipation structure. The external heat dissipation structure herein may be, for example, an air-cooled heat dissipator, a liquid cooling plate, or a vapor chamber (Vapor Chamber, VC). In this way, a problem of large thermal resistance in a heat dissipation path of the first chip that is caused because heat of the first chip needs to pass the second chip upward before dissipation is resolved, and/or a problem of large thermal resistance in a heat dissipation path of the second chip that is caused because heat of the second chip needs to pass the first chip downward before dissipation is resolved. Therefore, the electronic assembly provided in this embodiment of this application has an advantage of high heat dissipation efficiency of the first chip and the second chip, and is applicable to a use scenario with higher thermal power consumption, so that performance of an electronic device using the electronic assembly is improved. In some embodiments, a surface of a side that is of the first chip and that is close to the heat transfer plate includes a plurality of first contacts. The electronic assembly further includes a plurality of first solder balls located between the heat transfer plate and the first chip. The heat transfer plate is connected to the plurality of first contacts through the plurality of first solder balls. For example, the plurality of first solder balls between the heat transfer plate and the first chip may all be configured to transmit an electrical signal (for example, configured to transmit a data signal, a control signal, or the like required in a working process of the first chip). For example, at least one first solder ball may not be configured to transmit an electrical signal (for example, not be configured to transmit the data signal, the control signal, or the like required in the working process of the first chip), but is configured to increase heat transfer and reliability, so as to improve heat transfer efficiency between the first chip and the heat transfer plate. In this case, gaps between the plurality of first solder balls may be further filled with underfill, to further improve heat transfer efficiency between the first chip and the heat transfer plate. For example, for a first contact connected to the first solder ball not configured to transmit an electrical signal, a signal line connected to the first contact may not be disposed in the first chip. Fo