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EP-4738614-A1 - DEVICE WITH WAVEGUIDE STRUCTURES

EP4738614A1EP 4738614 A1EP4738614 A1EP 4738614A1EP-4738614-A1

Abstract

The present disclosure relates to a device, which may be part of an automotive radar system, and which includes a substrate including a first metal layer, at least one dielectric layer, the first metal layer being disposed over the at least one dielectric layer, a second metal layer, the at least one dielectric layer being disposed over the second metal layer, and multiple waveguide structures, each including a portion of the first metal layer and conductive side walls that extend through the at least one dielectric layer from the first metal layer to the second metal layer, the sidewalls defining first openings that extend through the first metal layer, the dielectric layer, and the second metal layer. The first metal layer may include second openings, and each opening of the second openings may laterally surround at least one of the multiple waveguide structures.

Inventors

  • BOSMAN, Sjoerd
  • CARLUCCIO, Giorgio

Assignees

  • NXP B.V.

Dates

Publication Date
20260506
Application Date
20251024

Claims (9)

  1. A device comprising: a substrate comprising: a first metal layer; at least one dielectric layer, wherein the first metal layer is disposed over the at least one dielectric layer; a second metal layer, wherein the at least one dielectric layer is disposed over the second metal layer; and a plurality of waveguide structures, each comprising a portion of the first metal layer and conductive side walls that extend through the at least one dielectric layer from the first metal layer to the second metal layer, the sidewalls defining a first plurality of openings that extend through the first metal layer, the dielectric layer, and the second metal layer, wherein the first metal layer includes a second plurality of openings, and each opening of the second plurality of openings laterally surrounds at least one of the plurality of waveguide structures.
  2. The device of claim 1, further comprising: a first plurality of conductive vias extending between the first metal layer and the second metal layer through the at least one dielectric layer and disposed laterally surrounding the second plurality of openings; and a second plurality of conductive vias disposed at opposite sides of each of the plurality of waveguide structures.
  3. The device of claim 2, wherein the first plurality of conductive vias define a respective perimeter around each of the second plurality of openings.
  4. The device of claim 3, wherein the second plurality of conductive vias define respective perimeters extending along at least two sides of each of the plurality of waveguide structures.
  5. The device of any preceding claim, wherein the second plurality of openings extend through the first metal layer to expose an upper surface of the at least one dielectric layer.
  6. The device of any preceding claim, further comprising: an antenna structure disposed directly on the first metal layer, the antenna structure comprising a plurality of antennas.
  7. The device of claim 6, further comprising: transceiver circuitry attached or coupled to the substrate and configured to generate radio frequency (RF) signals and to provide the RF signals to the antenna structure for transmission via the plurality of waveguide structures of the substrate.
  8. The device of any preceding claim, wherein a distance between the first metal layer and the second metal layer is within 10% of a quarter wavelength of the RF signals generated by the transceiver circuitry.
  9. A radio frequency, RF, device comprising: a printed circuit board substrate being a device according to any previous claim; and an antenna structure disposed on and in contact with the first metal layer of the printed circuit board substrate, wherein the first metal layer includes a second plurality of openings that laterally surround the plurality of waveguide structures.

Description

TECHNICAL FIELD Embodiments of the subject matter described herein relate generally to devices with waveguide structures, such as radio frequency (RF) devices with antenna assemblies having waveguide structures formed in a substrate to which an antenna structure is attached. BACKGROUND The use of millimeter-wave (mm-wave) frequencies in communication devices and radar applications, such as automotive radar applications, is continuously expanding. Antennas are critical components in all these fields, and come with advanced requirements in terms of performance, size, weight, and compliance to environmental standards. At mm-wave frequencies, the radio frequency (RF)-performance of a given communication system or radar system is no longer determined only by the transceiver circuits and the antenna, but also strongly depends on the package and the interconnection between the transceiver and the antenna. Such interconnection can include a combination of one or more conductive traces, waveguides, ball grid arrays, or other coupling structures. BRIEF DESCRIPTION OF DRAWINGS A more complete understanding of the subject matter may be derived by referring to the detailed description and claims when considered in conjunction with the following figures, wherein like reference numbers refer to similar elements throughout the figures. Elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. The figures along with the detailed description are incorporated and form part of the specification and serve to further illustrate examples, embodiments and the like, and explain various principles and advantages, in accordance with the present disclosure, wherein: FIG. 1 shows a cross-sectional side view of an illustrative radio frequency (RF) device that includes an antenna assembly, in accordance with various embodiments;FIG. 2 shows a perspective view of a waveguide arrangement that may be used in an antenna assembly of an RF device, such as the RF device of FIG. 1, in accordance with various embodiments;FIG. 3 shows a cross-sectional view of the waveguide arrangement of FIG. 2, in accordance with various embodiments;FIG. 4 shows a perspective view of the waveguide arrangement of FIG. 2, rotated relative to the perspective view shown in FIG. 2, with the second metal layer omitted and the dielectric layer shown with partial transparency, in accordance with various embodiments;FIG. 5 shows a top-down view of a first metal layer of the waveguide arrangement of FIGS. 2-4, in accordance with various embodiments;FIG. 6 shows a top-down view of a waveguide structure and a surrounding opening in the first metal layer of FIG. 4, which may be included in the waveguide arrangement of FIGS. 2-4, in accordance with various embodiments;FIG. 7 shows a top-down view of a dielectric layer of the waveguide arrangement of FIGS. 2-4, in accordance with various embodiments; andFIG. 8 shows a top-down view of a second metal layer of the waveguide arrangement of FIGS. 2-4, in accordance with various embodiments. DETAILED DESCRIPTION The following detailed description is merely illustrative in nature and is not intended to limit the embodiments described herein and uses of such embodiments. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, or the following detailed description. For simplicity and clarity of illustration, the figures illustrate the general manner of construction. Descriptions and details of well-known features and techniques may be omitted from the following detailed description to avoid unnecessarily obscuring the present disclosure. For example, the dimensions of some of the elements or regions in the figures may be exaggerated relative to other elements or regions to help improve understanding of embodiments described herein. The terms "first," "second," "third," "fourth" and the like in the description and the claims, if any, may be used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise," "include," "have" and any variations thereof, are intended to cover non-exclusive inclusions, such that a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. As used herein the terms "approximate," "approximately," "substantial" and "substantially" mean sufficient to accomplish the stated purpose in a practical manner and that minor imperfections, if any, are not significant for