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EP-4738634-A1 - POWER DELIVERY MODULE

EP4738634A1EP 4738634 A1EP4738634 A1EP 4738634A1EP-4738634-A1

Abstract

A heat dissipation structure (18, 18a, 18b) is disposed between two busbars (12, 14) or disposed outside the busbar (12, 14), so as to dissipate heat from the busbar (12, 14). In an embodiment, the heat dissipation structure (18) is disposed between two busbars (12, 14), such that a single heat dissipation structure (18) is used to dissipate heat from two busbars (12, 14) simultaneously, so as to reduce cost of the heat dissipation structure (18). Furthermore, an insulation member (20, 21, 22, 24, 26) is disposed between the two busbars (12, 14) and/or disposed between the busbar (12, 14) and the heat dissipation structure (18, 18a, 18b) to achieve electrical insulation.

Inventors

  • HU, CHIH-YU
  • CHUANG, WEN-CHING
  • HO, YU-HSIEN
  • FANG, YU-CHING
  • Lee, Li-Chuang
  • FAULSTICH, RENE

Assignees

  • CYNTEC CO., LTD.

Dates

Publication Date
20260506
Application Date
20251102

Claims (17)

  1. A power delivery module (1) comprising: a first busbar (12); a second busbar (14) being disposed opposite to the first busbar (12); characterized by the power delivery module (1) further comprising: a heat dissipation structure (18) being disposed between the first busbar (12) and the second busbar (14); a first insulation member (20) being disposed between the first busbar (12) and the heat dissipation structure (18); and a second insulation member (22) being disposed between the first busbar (12) and the second busbar (14); wherein a thickness of the first insulation member (20) is greater than or equal to a thickness of the second insulation member (22).
  2. The power delivery module (1) of claim 1 further characterized in that the first insulation member (20) is formed in a single ring-shaped structure surrounding the heat dissipation structure (18), such that the first insulation member (20) is also disposed between the second busbar (14) and the heat dissipation structure (18).
  3. The power delivery module (1) of claim 1 further characterized in that a thermal conductivity of the first insulation member (20) is greater than a thermal conductivity of the second insulation member (22).
  4. The power delivery module (1) of claim 1 further characterized in that a material of the first insulation member (20) is different from a material of the second insulation member (22).
  5. The power delivery module (1) of claim 1 further characterized in that a resistivity of the second insulation member (22) is greater than a resistivity of the first insulation member (20).
  6. The power delivery module (1) of claim 1 further characterized in that the first insulation member (20) partially overlaps with the second insulation member (22).
  7. The power delivery module (1) of claim 1 further characterized in that the heat dissipation structure (18) comprises a pipe (180) formed with a plurality of fins (1804) therein.
  8. The power delivery module (1) of claim 1 further characterized in that the heat dissipation structure (18) comprises a pipe (180) and a plurality of sub-tubes (186) disposed in the pipe (180).
  9. The power delivery module (1) of claim 1 further characterized in that the heat dissipation structure (18) comprises a pipe (180) and two thermal conductive blocks (182), and the pipe (180) is sandwiched between the two thermal conductive blocks (182).
  10. The power delivery module (1) of claim 9 further characterized in that the pipe (180) is accommodated in a space (188) formed between the two thermal conductive blocks (182), and a thermal interface material (190) is filled in the space (188).
  11. The power delivery module (1) of claim 1 further characterized in that the heat dissipation structure (18) comprises a pipe (180) and a thermal conductive plate (192), and the pipe (180) is embedded into the thermal conductive plate (192) and exposed from a side of the thermal conductive plate (192).
  12. The power delivery module (1) of claim 1 further characterized in that the heat dissipation structure (18) comprises a pipe (180) and at least one corrugated plate (184) disposed in the pipe (180).
  13. The power delivery module (1) of claim 12 further characterized in that the heat dissipation structure (18) comprises a plurality of corrugated plates (184) arranged in the pipe (180) at intervals.
  14. The power delivery module (1) of claim 12 further characterized in that the heat dissipation structure (18) comprises a plurality of corrugated plates (184), and two corrugated structures (1842) of two adjacent corrugated plates (184) are arranged in a staggered manner.
  15. The power delivery module (1) of claim 12 further characterized in that an inner wall (1800) of the pipe (180) is formed with at least one longitudinal groove (1802), and the at least one corrugated plate (184) has at least one engaging portion (1840) engaged with the at least one longitudinal groove (1802).
  16. The power delivery module (1) of claim 1 further characterized in that the first busbar (12) and the second busbar (14) have two recesses (120, 140) opposite to each other, and the heat dissipation structure (18) is accommodated in the two recesses (120, 140).
  17. The power delivery module (1) of claim 1 further characterized in that the power delivery module (1) further comprises: a third insulation member (24) being disposed between the second busbar (14) and the heat dissipation structure (18); and a fourth insulation member (26) being disposed between the first busbar (12) and the second busbar (14), the second insulation member (22) and the fourth insulation member (26) being located at opposite sides of the heat dissipation structure (18).

Description

Field of the Invention The present invention relates to a power delivery module, particularly a power delivery module capable of improving heat dissipation efficiency and reducing heat dissipation cost for a busbar. Background of the Invention With the rise of big data, machine learning, the Internet of Things, and various network platforms, the demand for servers in life is getting higher and higher. In general, the server is connected to a busbar behind a rack for power supply. The busbar will generate a lot of heat during operation. Therefore, how to effectively improve heat dissipation efficiency and reduce heat dissipation cost for the busbar has become a significant design issue. Summary of the Invention The present invention aims at providing a power delivery module capable of improving heat dissipation efficiency and reducing heat dissipation cost for a busbar, thereby resolving the aforesaid problems. This is achieved by a power delivery module according to claim 1. The dependent claims pertain to corresponding further developments and improvements. As will be seen more clearly from the detailed description following below, the claimed power delivery module includes a first busbar, a second busbar, a heat dissipation structure, a first insulation member and a second insulation member. The second busbar is disposed opposite to the first busbar. The heat dissipation structure is disposed between the first busbar and the second busbar. The first insulation member is disposed between the first busbar and the heat dissipation structure. The second insulation member is disposed between the first busbar and the second busbar. A thickness of the first insulation member is greater than or equal to a thickness of the second insulation member. In an embodiment, the first insulation member is formed in a single ring-shaped structure surrounding the heat dissipation structure, such that the first insulation member is also disposed between the second busbar and the heat dissipation structure. In an embodiment, a thermal conductivity of the first insulation member is greater than a thermal conductivity of the second insulation member. In an embodiment, a material of the first insulation member is different from a material of the second insulation member. In an embodiment, a resistivity of the second insulation member is greater than a resistivity of the first insulation member. In an embodiment, the first insulation member partially overlaps with the second insulation member. In an embodiment, the heat dissipation structure includes a pipe formed with a plurality of fins therein. In an embodiment, the heat dissipation structure includes a pipe and a plurality of sub-tubes disposed in the pipe. In an embodiment, the heat dissipation structure includes a pipe and two thermal conductive blocks, and the pipe is sandwiched between the two thermal conductive blocks. In an embodiment, the pipe is accommodated in a space formed between the two thermal conductive blocks, and a thermal interface material is filled in the space. In an embodiment, the heat dissipation structure includes a pipe and a thermal conductive plate, and the pipe is embedded into the thermal conductive plate and exposed from a side of the thermal conductive plate. In an embodiment, the heat dissipation structure includes a pipe and at least one corrugated plate disposed in the pipe. In an embodiment, the heat dissipation structure includes a plurality of corrugated plates arranged in the pipe at intervals. In an embodiment, the heat dissipation structure includes a plurality of corrugated plates, and two corrugated structures of two adjacent corrugated plates are arranged in a staggered manner. In an embodiment, an inner wall of the pipe is formed with at least one longitudinal groove, and the at least one corrugated plate has at least one engaging portion engaged with the at least one longitudinal groove. In an embodiment, the first busbar and the second busbar have two recesses opposite to each other, and the heat dissipation structure is accommodated in the two recesses. In an embodiment, the power delivery module further includes a third insulation member and a fourth insulation member. The third insulation member is disposed between the second busbar and the heat dissipation structure. The fourth insulation member is disposed between the first busbar and the second busbar. The second insulation member and the fourth insulation member are located at opposite sides of the heat dissipation structure. Brief Description of the Drawings In the following, the invention is further illustrated by way of example, taking reference to the accompanying drawings thereof: FIG. 1 is a perspective view illustrating a power delivery module according to an embodiment of the invention,FIG. 2 is a sectional view illustrating the power delivery module shown in FIG. 1,FIG. 3 is a sectional view illustrating the power delivery module according to another embodiment,FIG