EP-4738995-A1 - CIRCUIT BOARD, TRANSFORMER, MICROWAVE GENERATION DEVICE, AND HOUSEHOLD APPLIANCE

Abstract

Provided are a circuit board (100), a transformer (50), a microwave generation device (1000), and a household appliance. The circuit board (100) is applied to the microwave generation device (1000). The circuit board (100) includes a substrate (10) and a power device (20). The power device (20) includes a rectifier bridge stack and an insulated-gate bipolar transistor that are integrated as one piece. The power device (20) is disposed at the substrate (10).

Inventors

• CHENG, YAN
• LI, QINGHAI
• XU, XIAOPING
• CHEN, FEI
• GAO, WEI
• LIU, XINGHUA
• WANG, FUBAO

Assignees

• Guangdong Midea Kitchen Appliances Manufacturing Co., Ltd.

Dates

Publication Date

20260506

Application Date

20231120

Claims (20)

1. A circuit board for a microwave generation device, wherein the circuit board comprises: a substrate; and a power device disposed at the substrate, wherein the power device comprises a rectifier bridge stack and an insulated-gate bipolar transistor that are integrated as one piece.
2. The circuit board according to claim 1, wherein the power device comprises a package body of a cuboid shape.
3. The circuit board according to claim 2, wherein: the package body has a fixation hole formed at each of two sides of the package body; the circuit board further comprises a radiator disposed at the substrate; and the package body is attached to the radiator via the fixation hole.
4. The circuit board according to claim 2 or 3, wherein the power device comprises a plurality of pins extending downwardly from the package body, wherein: the power device is fixed at the substrate via the plurality of pins; and the plurality of pins comprise a plurality of high-voltage pins and a plurality of low-voltage pins, the plurality of high-voltage pins being adjacently arranged, and the plurality of low-voltage pins being adjacently arranged.
5. The circuit board according to claim 3 or 4, wherein the radiator comprises: a heat-transfer portion disposed at the substrate and being of a plate-like shape, the heat-transfer portion having an attachment surface attached to the package body; a side fin extending outwardly from a surface of the heat-transfer portion opposite to the attachment surface; and a top fin extending upwardly from an end of the heat-transfer portion away from the substrate.
6. The circuit board according to claim 5, comprising a resonant capacitor, wherein a receiving space is formed between the top fin and the substrate, the resonant capacitor being received in the receiving space.
7. The circuit board according to any one of claims 1 to 6, comprising a transformer, wherein the transformer comprises: a bobbin assembly mounted at the substrate, the bobbin assembly having a primary winding slot and a secondary winding slot, and being provided with a first baffle, a second baffle, a third baffle, and a support plate, wherein the first baffle covers an opening of an upper portion of the primary winding slot or an opening of an upper portion of the secondary winding slot in a height direction of the transformer, and wherein the second baffle covers the opening of a lower portion of the primary winding slot or the opening of a lower portion of the secondary winding slot in the height direction of the transformer; and a magnetic core assembly mounted at the bobbin assembly, the magnetic core assembly comprising a first magnetic core, wherein the first magnetic core is disposed at a side where the secondary winding slot is formed, wherein the substrate is provided with capacitor assemblies at a side of the substrate where the first magnetic core is located, wherein the support plate abuts against tops of the capacitor assemblies, wherein the support plate spaces the first magnetic core and the capacitor assemblies apart from each other in the height direction of the transformer, wherein pins are disposed between capacitor assemblies, and wherein the third baffle is connected to the support plate and extends towards a side where the capacitor assemblies are provided, to cover at least part of the pins.
8. The circuit board according to claim 7, wherein the bobbin assembly comprises a first bobbin and a second bobbin, wherein: the primary winding slot and the secondary winding slot are formed at the first bobbin; the first baffle, the second baffle, the third baffle, and the support plate are disposed at the second bobbin; and the first bobbin has a first receiving groove, a through hole, and a second receiving groove, wherein the first receiving groove, the through hole, and the second receiving groove are in communication with each other, wherein the first magnetic core is located in the first receiving groove and the through hole, and wherein the magnetic core assembly further comprises a second magnetic core located in the second receiving groove and the through hole.
9. The circuit board according to claim 7 or 8, wherein: the first magnetic core comprises a first connection portion located in the first receiving groove and a first extension portion located in the through hole; and the second magnetic core comprises a second connection portion located in the second receiving groove and a second extension portion located in the through hole.
10. The circuit board according to claim 8 or 9, wherein: the second bobbin has a first limiting groove and a second limiting groove, the first connection portion being located in the first limiting groove to limit the first magnetic core, and the second connection portion being located in the second limiting groove to limit the second magnetic core; and a gap is formed between the first extension portion and the second extension portion.
11. The circuit board according to any one of claims 8 to 10, wherein the first bobbin is detachably connected to the second bobbin.
12. The circuit board according to claim 8 or 9, wherein the first receiving groove is provided with a plurality of fixation portions protruding from an outer side of a top wall of the first receiving groove, the plurality of fixation portions having a plurality of strip-shaped slots.
13. The circuit board according to any one of claims 8 to 10, wherein: a radiator is disposed at a side where the second magnetic core is located; the bobbin assembly further comprises a third bobbin attached to a top fin; and the power device is disposed between the third bobbin and a heat-transfer portion.
14. The circuit board according to any one of claims 7 to 13, comprising: a bus capacitor; and a differential mode inductor, wherein the bus capacitor is disposed between the differential mode inductor and the transformer, and wherein the differential mode inductor and the bus capacitor are arranged at the substrate in sequence.
15. A transformer, comprising: a circuit board; a bobbin assembly mounted at the circuit board, the bobbin assembly having a primary winding slot and a secondary winding slot, and being provided with a first baffle, a second baffle, a third baffle, and a support plate, wherein the first baffle covers an opening of an upper portion of the primary winding slot or an opening of an upper portion of the secondary winding slot in a height direction of the transformer, and wherein the second baffle covers the opening of a lower portion of the primary winding slot or the opening of a lower portion of the secondary winding slot in the height direction of the transformer; and a magnetic core assembly mounted at the bobbin assembly, the magnetic core assembly comprising a first magnetic core, wherein the first magnetic core is disposed at a side where the secondary winding slot is formed, wherein the circuit board is provided with capacitor assemblies at a side of the circuit board where the first magnetic core is located, wherein the support plate abuts against tops of the capacitor assemblies, wherein the support plate spaces the first magnetic core and the capacitor assemblies apart from each other in the height direction of the transformer, wherein second pins are disposed between capacitor assemblies, and wherein the third baffle is connected to the support plate and extends towards a side where the capacitor assemblies are provided, to cover at least part of the second pins.
16. The transformer according to claim 15, wherein the bobbin assembly comprises a first bobbin and a second bobbin, wherein: the primary winding slot and the secondary winding slot are formed at the first bobbin; the first baffle, the second baffle, the third baffle, and the support plate are disposed at the second bobbin; and the first bobbin has a first receiving groove, a through hole, and a second receiving groove, wherein the first receiving groove, the through hole, and the second receiving groove are in communication with each other, wherein the first magnetic core is located in the first receiving groove and the through hole, and wherein the magnetic core assembly further comprises a second magnetic core located in the second receiving groove and the through hole.
17. The transformer according to claim 16, wherein: the first magnetic core comprises a first connection portion located in the first receiving groove and a first extension portion located in the through hole; and the second magnetic core comprises a second connection portion located in the second receiving groove and a second extension portion located in the through hole.
18. The transformer according to claim 16 or 17, wherein: the second bobbin has a first limiting groove and a second limiting groove, the first connection portion being located in the first limiting groove to limit the first magnetic core, and the second connection portion being located in the second limiting groove to limit the second magnetic core; and a gap is formed between the first extension portion and the second extension portion.
19. The transformer according to any one of claims 16 to 18, wherein the first bobbin is detachably connected to the second bobbin.
20. The transformer according to any one of claims 16 to 19, wherein the first receiving groove is provided with a plurality of fixation portions protruding from an outer side of a top wall of the first receiving groove, the plurality of fixation portions having a plurality of strip-shaped slots.

Description

CROSS-REFERENCE TO RELATED APPLICATION This application claims priority to and the benefit of patent applications Nos. 202310802439.5 and 202321710711.9, both filed with China National Intellectual Property Administration on June 30, 2023, the entire contents of which are incorporated herein by reference. FIELD The present disclosure relates to the field of microwave technologies, and more particularly, to a circuit board, a transformer, a microwave generation device, and a household appliance. BACKGROUND In the related art, the microwave oven is provided with a control board which comprises a substrate, a rectifier bridge stack, and an insulated-gate bipolar transistor. Each of the rectifier bridge stack and the insulated-gate bipolar transistor is disposed at the substrate. This arrangement occupies a large amount of space, resulting in an excessively large volume of the control board. SUMMARY An embodiment of the present disclosure provides a circuit board, a transformer, a microwave generation device, and a household appliance. The circuit board according to the embodiment of the present disclosure is applied to the microwave generation device. The circuit board comprises a substrate and a power device disposed at the substrate. The power device comprises a rectifier bridge stack and an insulated-gate bipolar transistor that are integrated as one piece. By integrating the rectifier bridge stack and the insulated-gate bipolar transistor into the power device, the circuit board can make a combined structure of the rectifier bridge stack and the insulated-gate bipolar transistor more compact. Therefore, an occupied space on the circuit board can be reduced and thus a volume can be minimized, facilitating miniaturization of the circuit board. In some embodiments, the power device comprises a package body of a cuboid shape. In some embodiments, the package body has a fixation hole formed at each of two sides of the package body. The circuit board further comprises a radiator disposed at the substrate. The package body is attached to the radiator via the fixation hole. In some embodiments, the radiator comprises: a heat-transfer portion disposed at the substrate and being of a plate-like shape, the heat-transfer portion having an attachment surface attached to the package body; side fins extending outwardly from a surface of the heat-transfer portion opposite to the attachment surface; and top fins extending upwardly from an end of the heat-transfer portion away from the substrate. In some embodiments, the circuit board comprises a resonant capacitor. A receiving space is formed between the top fins and the substrate, the resonant capacitor being received in the receiving space. In some embodiments, the circuit board comprises a transformer. The transformer comprises: a bobbin assembly mounted at the substrate, the bobbin assembly having a primary winding slot and a secondary winding slot, and being provided with a first baffle, a second baffle, a third baffle, and a support plate, the first baffle covering an opening of an upper portion of the primary winding slot or an opening of an upper portion of the secondary winding slot in a height direction of the transformer, and the second baffle covering the opening of a lower portion of the primary winding slot or the opening of a lower portion of the secondary winding slot in the height direction of the transformer; and a magnetic core assembly mounted at the bobbin assembly, the magnetic core assembly comprising a first magnetic core. The first magnetic core is disposed at a side where the secondary winding slot is formed. The substrate is provided with capacitor assemblies at a side of the substrate where the first magnetic core is located. The support plate abuts against tops of the capacitor assemblies. The support plate spaces the first magnetic core and the capacitor assemblies apart from each other in the height direction of the transformer. pins are disposed between capacitor assemblies. The third baffle is connected to the support plate and extends towards a side where the capacitor assemblies are provided, to cover at least part of the pins. In some embodiments, the bobbin assembly comprises a first bobbin and a second bobbin. The primary winding slot and the secondary winding slot are formed at the first bobbin. The first baffle, the second baffle, the third baffle, and the support plate are disposed at the second bobbin. The first bobbin has a first receiving groove, a through hole, and a second receiving groove. The first receiving groove, the through hole, and the second receiving groove are in communication with each other. The first magnetic core is located in the first receiving groove and the through hole. The magnetic core assembly further comprises a second magnetic core located in the second receiving groove and the through hole. In some embodiments, the first magnetic core comprises a first connection portion located in the first receiving