EP-4739006-A1 - HYBRID PRINTED CIRCUIT BOARD

Abstract

A hybrid printed circuit board includes: an insulating substrate; a printed circuit board disposed on an upper surface of the insulating substrate and including at least one through hole in which a surface mount device is accommodated; and an adhesive member provided between the insulating substrate and the printed circuit board.

Inventors

• KIM, KEONWOO
• KIM, MOONYOUNG
• LEE, JINHYUNG
• KO, JUNYOUNG
• SEO, Kangmoon

Assignees

• Samsung Electronics Co., Ltd.

Dates

Publication Date

20260506

Application Date

20240611

Claims (15)

1. A hybrid printed circuit board comprising: an insulating substrate; a printed circuit board disposed on an upper surface of the insulating substrate and including at least one through hole in which a surface mount device is accommodated; and an adhesive member provided between the insulating substrate and the printed circuit board.
2. The hybrid printed circuit board of claim 1, wherein the adhesive member is formed of no-flow prepreg or bonding sheet.
3. The hybrid printed circuit board of claim 1, wherein the insulating substrate is formed of any one of FR-1, FR-3, FR-4, CEM-1, and CEM-3.
4. The hybrid printed circuit board of claim 1, wherein a thickness of the insulating substrate is at least 0.4 mm.
5. The hybrid printed circuit board of claim 1, wherein the printed circuit board comprises: a base plate; and a copper foil layer formed on at least one of upper and lower surfaces of the base plate.
6. The hybrid printed circuit board of claim 5, wherein the base plate of the printed circuit board is formed of any one of FR-1, FR-3, FR-4, CEM-1, and CEM-3.
7. The hybrid printed circuit board of claim 1, wherein the printed circuit board comprises a base plate and a copper foil layer provided on one surface of the base plate, and wherein the insulating substrate is formed of a same insulating material as the base plate.
8. The hybrid printed circuit board of claim 1, wherein the printed circuit board comprises a base plate and a copper foil layer provided on one surface of the base plate, and wherein the insulating substrate is formed of an insulating material different from the base plate.
9. The hybrid printed circuit board of claim 1, wherein the printed circuit board comprises a base plate and an upper copper foil layer and a lower copper foil layer provided on upper and lower surfaces of the base plate, and wherein the insulating substrate is formed of a same insulating material as the base plate.
10. The hybrid printed circuit board of claim 1, wherein the printed circuit board comprises a base plate and an upper copper foil layer and a lower copper foil layer provided on upper and lower surfaces of the base plate, and wherein the insulating substrate is formed of an insulating material different from the base plate.
11. The hybrid printed circuit board of claim 1, wherein the printed circuit board includes a first printed circuit board and a second printed circuit board that are electrically connected to each other.
12. The hybrid printed circuit board of claim 11, wherein the first printed circuit board includes a first terminal pattern formed on its upper surface, wherein the second printed circuit board includes a second terminal pattern formed on its upper surface to correspond to the first terminal pattern, and wherein the printed circuit board further includes a connection board that is disposed on upper surfaces of the first terminal pattern and the second terminal pattern and electrically connects the first terminal pattern and the second terminal pattern.
13. The hybrid printed circuit board of claim 12, wherein the connection board includes a connection pattern formed to connect the first terminal pattern and the second terminal pattern.
14. The hybrid printed circuit board of claim 11, wherein the first printed circuit board is formed as a double-sided printed circuit board, and the second printed circuit board is formed as a single-sided printed circuit board.
15. The hybrid printed circuit board of claim 1, further comprising: a bending prevention reinforcement member disposed on the upper surface of the printed circuit board.

Description

[Technical Field] The disclosure relates to a printed circuit board, and more particularly to a hybrid printed circuit board. [Background Art] Generally, a display apparatus includes a power board that supplies power to operate the display apparatus. The power board may be configured to convert alternating current power to direct current power. The power board may include various electronic components for converting alternating current power to direct current power and a printed circuit board on which these electronic components are disposed. In general, the power board is disposed in the metal chassis of the display apparatus. At this time, for safety reasons, it is required that the leads of the electronic components, the bodies of the electronic components, etc. of the power board be spaced a predetermined distance apart so as not to make electrical contact with the metal chassis. On the other hand, the trend is to continuously reduce the thickness of the display apparatus. However, the distance between the power board and the metal chassis may be a limiting factor in reducing the thickness of the display apparatus. Therefore, in order to reduce the thickness of the display apparatus, it is desirable to reduce the separation distance between the power board and the metal chassis. [Disclosure of Invention] [Technical Solution] According to one or more embodiments of the disclosure, a hybrid printed circuit board may include: an insulating substrate; a printed circuit board disposed on an upper surface of the insulating substrate and including at least one through hole in which a surface mount device is accommodated; and an adhesive member comprising an adhesive provided between the insulating substrate and the printed circuit board. According to one or more embodiments of the disclosure, the adhesive member may be formed of no-flow prepreg or bonding sheet. According to one or more embodiments of the disclosure, the insulating substrate may be formed of any one of FR-1, FR-3, FR-4, CEM-1, and CEM-3. According to one or more embodiments of the disclosure, a thickness of the insulating substrate may be at least 0.4 mm. According to one or more embodiments of the disclosure, the printed circuit board may include a base plate; and a copper foil layer formed on at least one of both surfaces of the base plate. According to one or more embodiments of the disclosure, the base plate of the printed circuit board may be formed of any one of FR-1, FR-3, FR-4, CEM-1, and CEM-3. According to one or more embodiments of the disclosure, the printed circuit board may include a base plate and a copper foil layer provided on one surface of the base plate. The insulating substrate may be formed of a same insulating material as the base plate. According to one or more embodiments of the disclosure, the printed circuit board may include a base plate and a copper foil layer provided on one surface of the base plate. The insulating substrate may be formed of an insulating material different from the base plate. According to one or more embodiments of the disclosure, the printed circuit board may include a base plate and an upper copper foil layer and a lower copper foil layer provided on both surfaces of the base plate. The insulating substrate may be formed of a same insulating material as the base plate. According to one or more embodiments of the disclosure, the printed circuit board may include a base plate and an upper copper foil layer and a lower copper foil layer provided on both surfaces of the base plate. The insulating substrate may be formed of an insulating material different from the base plate. According to one or more embodiments of the disclosure, the printed circuit board may include a first printed circuit board and a second printed circuit board that are electrically connected to each other. According to one or more embodiments of the disclosure, the first printed circuit board may include a first terminal pattern formed on its upper surface. The second printed circuit board may include a second terminal pattern formed on its upper surface to correspond to the first terminal pattern. The printed circuit board may include a connection board that is disposed on upper surfaces of the first terminal pattern and the second terminal pattern and electrically connects the first terminal pattern and the second terminal pattern. According to one or more embodiments of the disclosure, the connection board may include a connection pattern formed to connect the first terminal pattern and the second terminal pattern. According to one or more embodiments of the disclosure, the first printed circuit board may be formed as a double-sided printed circuit board, and the second printed circuit board may be formed as a single-sided printed circuit board. According to one or more embodiments of the disclosure, the hybrid printed circuit board may include a bending prevention reinforcement member disposed on the upper surface of the