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EP-4739007-A1 - CLEANING AGENT COMPOSITION FOR REMOVING FLUX RESIDUE

EP4739007A1EP 4739007 A1EP4739007 A1EP 4739007A1EP-4739007-A1

Abstract

In one aspect, provided is a cleaning agent composition for removing flux residue that has excellent flux residue removal performance while suppressing metal corrosion and suppressing damage to an organic coating film. In one aspect, the present disclosure relates to a cleaning agent composition for removing flux residue that contains a compound (a component A) represented by a formula (I) below, a benzotriazole derivative (a component B), and an imidazole derivative or a pyrazole derivative (a component C). R 1 -O-(AO) n -R 2 (I) In the above formula (I), R 1 represents a phenyl group or an alkyl group having 1 to 8 carbon atoms, R 2 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO represents an ethylene oxide group (EO) or a propylene oxide group (PO), and n is the number of moles of AO added and is an integer of 1 to 3.

Inventors

  • SEIKE, TAKANAO

Assignees

  • Kao Corporation

Dates

Publication Date
20260506
Application Date
20240626

Claims (14)

  1. A cleaning agent composition for removing flux residue, comprising: a compound (a component A) represented by a formula (I) below; a benzotriazole derivative (a component B); and an imidazole derivative or a pyrazole derivative (a component C), R 1 -O-(AO) n -R 2 (I) in the above formula (I), R 1 represents a phenyl group or an alkyl group having 1 to 8 carbon atoms, R 2 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO represents an ethylene oxide group (EO) or a propylene oxide group (PO), and n is the number of moles of AO added and is an integer of 1 to 3.
  2. The cleaning agent composition according to claim 1, wherein a content of the component A is 35% by mass or more and 99.5% by mass or less.
  3. The cleaning agent composition according to claim 1 or 2, wherein a content of the component B is 0.05% by mass or more and 5% by mass or less.
  4. The cleaning agent composition according to any one of claims 1 to 3, wherein a mass ratio B/C of the component B to the component Cis 0.01 or more and 100 or less.
  5. The cleaning agent composition according to any one of claims 1 to 4, wherein a mass ratio B/C of the component B to the component Cis 0.01 or more and 10 or less.
  6. The cleaning agent composition according to any one of claims 1 to 5, further comprising water (a component D).
  7. The cleaning agent composition according to claim 6, wherein a content of the component D is 15% by mass or less.
  8. A cleaning method comprising a cleaning step of cleaning an object to be cleaned having flux residue, using the cleaning agent composition according to any one of claims 1 to 7.
  9. The cleaning method according to claim 8, wherein the object to be cleaned having flux residue is a substrate having flux residue that has undergone a process of applying a slurry containing a flux between the substrate and a metal member or between two metal members present on the substrate, and then heating to 200°C or higher.
  10. The cleaning method according to claim 8 or 9, wherein a substrate surface and/or a metal member of the object to be cleaned includes an organic coating film containing an imidazole derivative.
  11. The cleaning method according to any one of claims 8 to 10, wherein a substrate surface and/or a metal member of the object to be cleaned includes an organic coating film that has come into contact with an agent containing an imidazole derivative.
  12. The cleaning method according to any one of claims 8 to 11, wherein the cleaning step is a step of immersing the object to be cleaned in the cleaning agent composition for removing flux residue at 80°C or lower.
  13. The cleaning method according to any one of claims 8 to 12, wherein a substrate surface and/or a metal member of the object to be cleaned contains copper.
  14. A method for manufacturing an electronic component using the cleaning method according to any one of claims 8 to 13.

Description

Technical Field The present disclosure relates to a cleaning agent composition for removing flux residue, a cleaning method using the cleaning agent composition, and a method for manufacturing an electronic component. Background Art In order to reduce manufacturing costs, metals such as copper and copper alloys are used for electrodes forming circuits on electronic substrates of semiconductor packages or the like. Surface mounting with improved packing density is widely used as a mounting method for printed wiring boards. In order to improve the packing density, a technique is known in which a nanometal paste is applied between the wiring on a substrate and the terminals of an electronic element, and the nanometal is melted and solidified through heating to bond the wiring on the substrate and the terminals of the electronic element. For example, JP 2020-35721A (Patent Document 1) discloses a semiconductor element that adheres to and is fixed on a substrate via a die attach material made of a paste composition containing specific silver minute particles, specific silver powder, and a silicon-containing triazine compound, and further contains, as a sintering aid, a carboxylic acid compound, which is an acid anhydride having a boiling point of 100°C to 300°C. Paragraph 0051 of the same document discloses that it is not preferable that the boiling point of the carboxylic acid compound exceeds 300°C because the compound will not volatilize during sintering and flux components (organic substances such as organic acids) will remain in the film. Meanwhile, a technique for cleaning off solder flux from electronic components after soldering is known. For example, WO 2020/116534 (Patent Document 2) proposes a cleaning method for cleaning an object to be cleaned having flux residue, using a cleaning agent composition containing an organic solvent and a compound having an alkyl group having 1 to 4 carbon atoms on the nitrogen atom of an imidazole ring or a piperazine ring. WO 2019/044463 (Patent Document 3) proposes a treatment liquid for a semiconductor device that contains water, an organic solvent, and two or more nitrogen-containing aromatic heterocyclic compounds. JP 2005-41989A (Patent Document 4) proposes a cleaning agent composition for a tin-containing alloy component that contains, as active ingredients, an organic carboxylate, a nitrogen-based heterocyclic compound, and an organic solvent. Disclosure of Invention In one aspect, the present disclosure relates to a cleaning agent composition for removing flux residue, containing: a compound (a component A) represented by a formula (I) below; a benzotriazole derivative (a component B); and an imidazole derivative or a pyrazole derivative (a component C),         R1-O-(AO)n-R2     (I) in the above formula (I), R1 represents a phenyl group or an alkyl group having 1 to 8 carbon atoms, R2 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO represents an ethylene oxide group (EO) or a propylene oxide group (PO), and n is the number of moles of AO added and is an integer of 1 to 3. In one aspect, the present disclosure relates to a cleaning method including a cleaning step of cleaning an object to be cleaned having flux residue, using the cleaning agent composition according to the present disclosure. Description of the Invention When applying a nonmetal paste containing an acid (flux component), melting and solidifying the nanometal through heating to connect the wiring present on a substrate to the terminals of electronic elements, a process of keeping the substrate at a high temperature of 200°C or higher to melt the metal (sintering process) is required. If flux residue containing the acid as a main component remains on the substrate that has undergone the sintering process, the substrate needs to be cleaned. Thus, there is demand for a cleaning agent composition having high cleaning performance against the flux residue (flux residue removal performance). Further, in some cases, an organic coating film (surface protecting film) is formed on a substrate surface or a surface of a metal member using a water-soluble preflux. When sintering and flux removal are performed on a portion of the same substrate surface, or when metal members are present on both sides of the same substrate, the cleaning agent composition may come into contact with the organic coating film. In order to suppress removal of the organic coating film while the flux residue is cleaned off, there is demand for a cleaning agent composition with little damage to an organic coating film. Furthermore, because corrosion of a metal used in the substrate surface or a metal component reduces the quality and value of package substrates, there is demand for a cleaning agent composition having a high metal corrosion prevention ability (anti-corrosion property). In view of this, the present disclosure provides a cleaning agent composition for removing flux residue that has excellent