EP-4739010-A1 - ELECTRONIC DEVICE COMPRISING METAL HOUSING, AND METHOD FOR MANUFACTURING SAME

EP4739010A1EP 4739010 A1EP4739010 A1EP 4739010A1EP-4739010-A1

Abstract

An electronic device according to one embodiment of the present disclosure may comprise: a display; and a housing in which the display is seated. The housing may include a first metal part at least partially exposed to the outside of the electronic device, a second metal part surrounded by the first metal part, and a molded portion. The first metal part includes an opening formed to pass through a part of the first metal part, and the opening can be formed so that the space expands toward a first direction. The second metal part includes a coupling portion for coupling with the opening of the first metal part, and a melted portion may be formed in a portion of the coupling portion. The molded portion may cover the opening and at least a portion of the coupling portion.

Inventors

LEE, JONGHUN
SON, Yunho
CHOI, HYUNSUK

Assignees

Samsung Electronics Co., Ltd.

Dates

Publication Date: 20260506
Application Date: 20240610

Claims (15)

An electronic device (101) comprising a housing (201), wherein the housing (201) comprises: a first metal part (310) at least partially exposed to an outside of the electronic device, and including an opening (315) formed to pass through a part of the first metal part, wherein the opening is formed to expand a space toward a first direction; a second metal part (320) surrounded by the first metal part, and including a coupling portion (321, 323) for coupling to the opening of the first metal part, wherein a portion of the coupling portion is formed as a melted portion.
The electronic device of claim 1, wherein a portion, adjacent to the opening of the first metal part (310), of the coupling portion of the second metal part (320) is formed as a melted portion, and wherein a portion, inserted into the opening of the first metal part (310), of the coupling portion of the second metal part (320) is formed as a non-melted portion.
The electronic device of claim 1 or 2, wherein the first metal part (310) forming a periphery around an upper space, facing a second direction opposite to the first direction, of the opening is formed as the melted portion, and wherein a portion, forming the opening, of an inner surface of the first metal part (310) is formed as a non-melted portion.
The electronic device of any one of claims 1 to 3, wherein the coupling portion of the second metal part (320) includes a support portion (321) disposed adjacent to an edge of the opening of the first metal part (310) and a protruding portion (323) extending from the support portion and inserted into the opening.
The electronic device of claim 4, wherein a portion, disposed in contact with the first metal part, of the supporting portion of the second metal part and a portion of the protruding portion adjacent to the supporting portion are formed as a melted portion.
The electronic device of any one of claim 4 or 5, wherein the first direction in which a diameter of the opening expands is the same as a direction in which the protruding portion protruding from the supporting portion of the second metal part points.
The electronic device of any one of claims 4 to 5, wherein a diameter of the opening of the first metal part gradually expands along the first direction, and wherein the protruding portion of the second metal part is formed to correspond to a shape of the opening and is coupled to the opening.
The electronic device of any one of claims 4 to 6, wherein a height of the opening of the first metal part is greater than a height of a protruding portion of the second metal part.
The electronic device of any one of claims 4 to 6, wherein, in the opening of the first metal part, a diameter of a lower space facing a direction opposite to the supporting portion of the second metal part is larger than a diameter of an upper space facing the supporting portion of the second metal part.
The electronic device of any one of claims 4 to 6, wherein an inner surface of the first metal part forming the opening has a specified slope with respect to a surface where the first metal part faces the support portion.
The electronic device of any one of claims 4 to 10, wherein the support portion of the second metal part and an adjacent edge of the opening of the first metal part melted together with the support portion provide a chemical bonding, and wherein the protruding portion of the second metal part inserted into the opening of the first metal part is fitted into the opening to provide a physical bonding.
The electronic device of any one of claims 4 to 10, further comprising a molded portion 330 covering the opening and at least a portion of the coupling portion, wherein the molded portion (330) comprises: a first molded portion (331) disposed to surround an upper surface, facing an opposite direction of the first direction, of the support portion of the second metal part, and the first metal part adjacent thereto; and a second molded portion (332) disposed to surround an end portion, facing the first direction, of the protruding portion of the second metal part and the first metal part adjacent thereto.
The electronic device of any one of claims 4 to 10, wherein an inner surface of the first metal part forming the opening includes grooves formed at specified intervals or a spiral groove.
The electronic device of claim 13, wherein the opening of the first metal part is configured such that an upper portion is open and a lower portion is closed to allow a portion of the second metal part to be inserted into the opening.
The electronic device of any one of claims 4 to 10, wherein the coupling portion of the second metal part further includes a hook portion (327) extending from the protruding portion and adjacent to an edge of a lower space of the opening of the first metal part, and wherein, when viewed from below the first metal part, a portion of the hook portion of the second metal base material overlaps the first metal part.

Description

[Technical Field] An embodiment set forth herein relates to an electronic device including a metal housing and a method for manufacturing the same. [Background Art] With remarkable advancements in information and communication technology and semiconductor technology, the adoption and use of various electronic devices have been increasing rapidly. In particular, recent electronic devices are being developed to be portable and capable of communication. An electronic device may refer to any device that performs specific functions according to programs installed therein, ranging from home appliances to electronic organizers, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, and vehicle navigation systems. For example, such electronic devices can output stored information as audio or video. As the integration density of electronic devices has increased and ultra-high-speed, large-capacity wireless communication has become widespread, a wide variety of functions can now be incorporated into a single electronic device, such as a mobile communication terminal. For example, a communication function, an entertainment function such as gaming, a multimedia function such as music/video playback, a communication and security function for mobile banking, a function for schedule management or electronic wallet are integrated into a single electronic device. These electronic devices are being miniaturized to allow users to carry the electronic devices conveniently. In recent electronic devices, the exterior housings are made of metal to meet consumers' demands for aesthetic appeal. [Detailed Description of the Invention] [Technical Solution] An electronic device according to an embodiment of the disclosure may include a display and a housing in which the display is seated. The housing may include a first metal part at least partially exposed outside the electronic device, a second metal part surrounded by the first metal part, and a molded portion. The first metal part may include an opening formed through a portion of the first metal part, and the opening may be formed to have a space expanding in a first direction. The second metal part may include a coupling portion for coupling with the opening of the first metal part, and a portion of the coupling portion may form a melted portion. The molded portion may cover the opening and at least a portion of the coupling portion. A housing of an electronic device according to an embodiment of the disclosure may include a first metal part at least partially exposed outside the electronic device, and a second metal part surrounded by the first metal part. The first metal part may include an opening formed through a portion of the first metal part and formed to have a space expanding in a first direction. The second metal part may include a coupling portion for coupling with the opening of the first metal part, and a portion of the coupling portion may form a melted portion. A method for manufacturing a housing of an electronic device, according to an embodiment of the disclosure, may include a process of processing a first metal base material that includes an opening formed to have a space expanding in a first direction, a process of processing a second metal base material including a coupling portion that is coupled to the opening of the first metal base material, an alignment process for coupling the first metal base material and the second metal base material, wherein a support portion of the coupling portion is disposed in contact with an edge of the opening of the first metal base material, and a protruding portion extending from the support portion is disposed to be inserted into the opening of the first metal base material, a bonding process of applying heat to a surface of the support portion of the second metal base material which has been aligned with the first metal based material, the surface facing a second facing a second direction opposite to the first direction, and an injection-molding process of forming a molded base material portion in an area adjacent to the first metal base material and the second metal base material. [Brief Description of Drawings] FIG. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.FIG. 2 is a perspective view illustrating the front surface of an electronic device according to an embodiment disclosed herein.FIG. 3 is a perspective view illustrating the rear surface of the electronic device illustrated in FIG. 2 according to an embodiment disclosed herein.FIG. 4A is an exploded perspective view of the electronic device illustrated in FIG. 2 according to an embodiment disclosed herein, and illustrates the front surface thereof.FIG. 4B is an exploded perspective view of the electronic device illustrated in FIG. 2 according to an embodiment disclosed herein, and illustrates the rear surface thereof.FIG. 5