EP-4739017-A1 - PHOTOVOLTAIC OPTIMIZER

EP4739017A1EP 4739017 A1EP4739017 A1EP 4739017A1EP-4739017-A1

Abstract

This application relates to the field of electronic technologies, and in particular, to a photovoltaic optimizer. The photovoltaic optimizer includes a housing and a circuit board, a power component, a magnetic component, and a metal cover that are accommodated in the housing. A heat exchange layer and a first conductive layer that are spaced apart are embedded in the circuit board. The power component is fastened to a side of the circuit board, is fastened to the heat exchange layer, and is electrically connected to the first conductive layer. The magnetic component and the metal cover are both fastened to a side of the circuit board. The magnetic component is electrically connected to the first conductive layer. The metal cover covers the magnetic component and is fastened and electrically connected to the heat exchange layer. The housing and the metal cover are both filled with a potting adhesive. The potting adhesive covers the circuit board, the power component, the magnetic component, and the metal cover. Heat generated by the power component during operation may be transferred to the metal cover through the heat exchange layer, and then transferred to an external environment through the potting adhesive, to implement heat dissipation of the power component. This helps improve heat dissipation efficiency of the power component.

Inventors

LIN, Yuxuan
ZHAI, Yinhua
CHENG, Jiebin
GU, Guilei
CHEN, LINGLIN
CAO, Yufan

Assignees

Huawei Digital Power Technologies Co., Ltd.

Dates

Publication Date: 20260506
Application Date: 20251028

Claims (15)

A photovoltaic optimizer, wherein the photovoltaic optimizer comprises a housing, a circuit board, a power component, a magnetic component, and a metal cover, and the circuit board, the power component, the magnetic component, and the metal cover are all accommodated in the housing; a heat exchange layer and a first conductive layer are embedded in the circuit board, and the heat exchange layer and the first conductive layer are spaced apart; in a first direction, the power component is fastened to a side of the circuit board, is fastened to the heat exchange layer, and is electrically connected to the first conductive layer, and the first direction is a thickness direction of the circuit board; in the first direction, the magnetic component and the metal cover are both fastened to a side of the circuit board, the magnetic component is electrically connected to the first conductive layer, and the metal cover covers the magnetic component and is fastened and electrically connected to the heat exchange layer; and the housing and the metal cover are both filled with a potting adhesive, and the potting adhesive covers the circuit board, the power component, the magnetic component, and the metal cover.
The photovoltaic optimizer according to claim 1, wherein the circuit board is further provided with a heat exchange hole, the heat exchange hole penetrates the circuit board and the heat exchange layer in the first direction, the metal cover comprises a mounting portion, the mounting portion surrounds an opening of the metal cover, and the mounting portion is in contact with the circuit board and covers the heat exchange hole; and the metal cover is further provided with a connection hole, the connection hole penetrates the mounting portion in the first direction and directly communicates with the heat exchange hole, the photovoltaic optimizer further comprises a fastener, the fastener connects the connection hole to the heat exchange hole and is configured to fasten the metal cover to the circuit board, and the fastener is in contact with the heat exchange layer.
The photovoltaic optimizer according to claim 1, wherein the circuit board is further provided with a heat exchange hole, the heat exchange hole penetrates the circuit board and the heat exchange layer in the first direction, and the metal cover is partially inserted into the heat exchange hole and is in contact with and fastened to the heat exchange layer.
The photovoltaic optimizer according to claim 1, wherein the circuit board is further provided with a heat exchange hole, the heat exchange hole penetrates the circuit board and the heat exchange layer in the first direction, the metal cover comprises a fastening portion, the fastening portion surrounds an opening of the metal cover, and the fastening portion is in contact with and fastened to the circuit board and covers the heat exchange hole; and a heat exchange material is disposed in the heat exchange hole, the heat exchange material is in contact with and fastened to the fastening portion and the heat exchange layer, and a thermal conductivity coefficient of the heat exchange material is greater than a thermal conductivity coefficient of the potting adhesive.
The photovoltaic optimizer according to claim 3 or 4, wherein a projection of the heat exchange hole in the first direction surrounds a projection of the magnetic component in the first direction.
The photovoltaic optimizer according to any one of claims 1 to 4, wherein the power component is fastened to a side that is of the circuit board and that faces the magnetic component, and the metal cover further covers the power component.
The photovoltaic optimizer according to claim 6, wherein in the first direction, a first thermally conductive material is further disposed between the power component and the metal cover, the first thermally conductive material is in contact with and fastened to the power component and the metal cover separately, and a thermal conductivity coefficient of the first thermally conductive material is greater than the thermal conductivity coefficient of the potting adhesive.
The photovoltaic optimizer according to claim 6, wherein in the first direction, a maximum spacing between the magnetic component and the circuit board is greater than a maximum spacing between the power component and the circuit board, and a portion that is of the metal cover and that is opposite to the power component is recessed toward the circuit board.
The photovoltaic optimizer according to any one of claims 1 to 4, wherein in the first direction, the power component is fastened to a side that is of the circuit board and that faces away from the magnetic component, and a projection of the power component in the first direction overlaps a projection of the metal cover in the first direction.
The photovoltaic optimizer according to any one of claims 1 to 4, wherein the metal cover is further provided with heat dissipation fins, and the heat dissipation fins are located on an outer side surface of the metal cover.
The photovoltaic optimizer according to any one of claims 1 to 4, wherein the circuit board is further provided with a first through hole, the first through hole penetrates the circuit board and the heat exchange layer in the first direction, the power component comprises a first pin, and the first pin is inserted into the first through hole and is in contact with and fastened to the heat exchange layer.
The photovoltaic optimizer according to any one of claims 1 to 4, wherein the circuit board is further provided with a first through hole, the first through hole penetrates the circuit board and the heat exchange layer in the first direction, the power component is in contact with and fastened to a surface of the circuit board in the first direction, a second thermally conductive material is disposed in the first through hole, the second thermally conductive material is fastened to the power component and the heat exchange layer, and a thermal conductivity coefficient of the second thermally conductive material is greater than the thermal conductivity coefficient of the potting adhesive.
The photovoltaic optimizer according to claim 1, wherein a second conductive layer is further embedded in the circuit board, the second conductive layer is spaced apart from both the heat exchange layer and the first conductive layer, and the metal cover is electrically connected to the second conductive layer; and the photovoltaic optimizer further comprises a capacitor, in the first direction, the capacitor is fastened to a side of the circuit board, the circuit board is further provided with a mounting hole, the mounting hole penetrates the circuit board and the second conductive layer in the first direction, the capacitor comprises a first capacitor pin, and the first capacitor pin is inserted into the mounting hole and is fastened and electrically connected to the second conductive layer.
The photovoltaic optimizer according to claim 1, wherein a second conductive layer is further embedded in the circuit board, the second conductive layer and the first conductive layer are spaced apart, and the metal cover is electrically connected to the second conductive layer; and the photovoltaic optimizer further comprises a capacitor, in the first direction, the capacitor is fastened to a side of the circuit board, the circuit board is further provided with a mounting hole, the mounting hole penetrates the circuit board and the second conductive layer in the first direction, the capacitor is in contact with and fastened to a surface of the circuit board in the first direction, a conductive material is disposed in the mounting hole, and the conductive material is separately fastened and electrically connected to the capacitor and the second conductive layer.
The photovoltaic optimizer according to claim 13 or 14, wherein the circuit board is further provided with a fastening hole, the fastening hole penetrates the circuit board and the second conductive layer in the first direction, the metal cover is further provided with an insertion protrusion, the insertion protrusion is located on an outer side surface of the metal cover, and the insertion protrusion is partially inserted into the fastening hole and is fastened and electrically connected to the second conductive layer.

Description

TECHNICAL FIELD This application relates to the field of electronic technologies, and in particular, to a photovoltaic optimizer. BACKGROUND In an existing photovoltaic optimizer, a power component is mounted on a circuit board, and a temperature equalization plate is in contact with and mounted on a side that is of the power component and that faces away from the circuit board. Heat generated by the power component during operation is transferred to an external environment through the temperature equalization plate, to implement heat dissipation for the temperature equalization plate. However, with an increase in power density of the photovoltaic optimizer, an increasing amount of heat is generated by the power component during operation, and there is a problem of low heat dissipation efficiency of the power component. As a result, a temperature of the power component increases excessively rapidly, and the power component is prone to burnout. SUMMARY This application provides a photovoltaic optimizer, to resolve a problem of low heat dissipation efficiency of a power component. Embodiments of this application provide a photovoltaic optimizer. The photovoltaic optimizer includes a housing, a circuit board, a power component, a magnetic component, and a metal cover. The circuit board, the power component, the magnetic component, and the metal cover are all accommodated in the housing. A heat exchange layer and a first conductive layer are embedded in the circuit board. The heat exchange layer and the first conductive layer are spaced apart. In a first direction, the power component is fastened to a side of the circuit board, is fastened to the heat exchange layer, and is electrically connected to the first conductive layer. The first direction is a thickness direction of the circuit board. In the first direction, the magnetic component and the metal cover are both fastened to a side of the circuit board. The magnetic component is electrically connected to the first conductive layer. The metal cover covers the magnetic component, is fastened to the heat exchange layer, and is electrically connected to the first conductive layer. The housing and the metal cover are both filled with a potting adhesive. The potting adhesive covers the circuit board, the power component, the magnetic component, and the metal cover. In the photovoltaic optimizer provided in this embodiment of this application, because the metal cover is fastened to the heat exchange layer and the power component is fastened to the heat exchange layer, heat generated by the power component during operation may be transferred to the metal cover through the heat exchange layer, and then transferred to an external environment through the potting adhesive and the housing, to implement heat dissipation for the power component. As a result, because a contact area between the metal cover and the potting adhesive is large, efficiency of heat exchange between the metal cover and the potting adhesive is high. This helps improve heat dissipation efficiency of the power component. In addition, because the power component is fastened to the heat exchange layer, the power component exchanges heat with the heat exchange layer, and the power component has a capability of double-sided heat dissipation. Specifically, when the photovoltaic optimizer operates, the heat generated by the power component is transferred through the following two paths: The heat is directly dissipated from a surface of the power component to the potting adhesive; and in addition, the heat may also be dissipated from the power component to the heat exchange layer. In this way, the heat of the power component can be quickly dissipated. This helps improve the heat dissipation efficiency of the power component, enhance performance and use safety of the power component, and prolong a service life of the power component. In addition, because the metal cover covers the magnetic component and is electrically connected to the heat exchange layer, the metal cover may shield a magnetic field generated by the magnetic component during operation, to implement electromagnetic shielding for the magnetic component. The metal cover may implement both electromagnetic shielding for the magnetic component and heat dissipation for the power component. This helps improve utilization of the metal cover, and using different structural members to implement heat dissipation for the power component and electromagnetic shielding for the magnetic component can be avoided. This helps reduce processing costs of the photovoltaic optimizer and reduce a size of the photovoltaic optimizer, and contributes to a miniaturized design of the photovoltaic optimizer. Moreover, in a design in which the metal cover implements heat dissipation for the power component through the heat exchange layer, while high heat dissipation efficiency of the power component is ensured, the power component may not be in contact with the metal cover