EP-4739062-A2 - PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE

EP4739062A2EP 4739062 A2EP4739062 A2EP 4739062A2EP-4739062-A2

Abstract

A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.

Inventors

MARINOV, Val
KLIGER, RONN
SEMLER, Matthew R.

Assignees

Kulicke & Soffa Netherlands B.V.

Dates

Publication Date: 20260506
Application Date: 20180425

Claims (15)

A method comprising: transferring discrete components (12, 112, 550, 550a, 550b, 550', 580, 604, 608, 612, 760) from a carrier substrate (16, 116, 552, 758) to each of multiple target substrates (556, 606, 610, 614, 768, 768'), the discrete components being adhered to the carrier substrate by a dynamic release layer (22, 122, 322, 422), the transferring including transferring a first set of the discrete components to a first target substrate using a laser-assisted transfer process, the discrete components in the first set sharing a first characteristic; and using the laser-assisted transfer process, transferring a second set of the discrete components to a second target substrate, the discrete components in the second set sharing a second characteristic different from the first characteristic.
The method of claim 1, wherein the first and second characteristics include one or more of an optical characteristic and an electrical characteristic.
The method of claims 1 or 2 wherein the transferring of the first set of the discrete components includes transferring the discrete components that do not satisfy a quality criterion.
The method of any of claims 1-3 wherein the transferring of the second set of the discrete components includes transferring the discrete components that do satisfy a quality criterion.
The method of any of claims 1-4 wherein transferring each set of the discrete components to a corresponding target substrate includes transferring each of the discrete components individually to the target substrate.
The method of any of claims 1-5 wherein transferring the first set of the discrete components to the first target substrate includes transferring each of the discrete components in the first set individually to the first target substrate.
The method of any of claims 1-6 wherein transferring the second set of the discrete components to the second target substrate includes transferring each of the discrete components in the second set individually to the second target substrate.
The method of any of claims 1-7 wherein transferring each set of discrete components to the corresponding target substrate includes concurrently transferring some or all of the discrete components in the set to the target substrate.
The method of any of claims 1-8 wherein transferring the first set of the discrete components to the first target substrate includes concurrently transferring some or all of the discrete components in the first set to the first target substrate.
The method of any of claims 1-9 wherein transferring the second set of discrete components to the second target substrate includes concurrently transferring some or all of the discrete components in the second set to the second target substrate.
The method of any of claims 1-10 wherein transferring a set of discrete components to a corresponding target substrate includes transferring the discrete components in the set onto a layer of die catching material disposed on a top surface of the corresponding target substrate.
An apparatus for carrying out the method of claim 1 comprising: a source of laser energy; a substrate holder configured to receive a substrate; and an optical system including an optical element configured to separate a laser beam from the source of laser energy into multiple beamlets.
The apparatus of claim 12 further comprising a substrate assembly, including another substrate, a dynamic release layer disposed on a surface of the another substrate, and multiple discrete components adhered to the another substrate by the dynamic release layer.
The apparatus of either of claims 12 or 13 further comprising a controller configured to control alignment of the laser beam with a location of one of the multiple discrete components.
The apparatus of any of claims 12-14 wherein the controller is configured to control alignment of the laser beam based on information indicative of one or more of a characteristic and a quality of each of one or more of the discrete components.

Description

CLAIM OF PRIORITY This application claims priority to U.S. Patent Application Serial No. 62/518,270, filed on June 12, 2017, the contents of which are incorporated here by reference in their entirety. Background This description relates generally to assembling discrete components onto a substrate. Summary In an aspect, a method includes transferring multiple discrete components from a first substrate to a second substrate, including concurrently irradiating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The irradiating induces an ablation of at least a portion of the dynamic release layer in each of the irradiated regions. The ablation causes at least some of the discrete components to be concurrently released from the first substrate. Embodiments can include one or more of the following features. Irradiating the multiple regions includes irradiating the multiple regions with laser energy. The method includes separating the laser energy into multiple beamlets, and irradiating each of the multiple regions with one of the beamlets of laser energy. The method includes separating the laser energy with a diffractive optical element. The irradiating induces ablation of a partial thickness of the dynamic release layer in each of the irradiated regions. The ablation of the partial thickness of the dynamic release layer induces a deformation of a remaining thickness of the dynamic release layer in each of the irradiated regions. The deformation includes a blister in each of the irradiated regions of the dynamic release layer, the blisters each exerting a force on the corresponding discrete component. The force exerted by the blisters causes the discrete components to be released from the first substrate. The ablation of the partial thickness induces a plastic deformation in each of the irradiated regions. The ablation of the partial thickness induces an elastic deformation in each of the irradiated regions. The irradiating induces ablation of an entire thickness of the dynamic release layer in each of the irradiated regions. The method includes reducing an adhesion of the dynamic release layer prior to irradiating the multiple regions. Reducing an adhesion of the dynamic release layer includes exposing the dynamic release layer to a stimulus. Exposing the dynamic release layer to a stimulus includes exposing the dynamic release layer to one or more of heat and ultraviolet light. Transferring the multiple discrete components includes transferring a first set of one or more discrete components to a first target substrate, the discrete components in the first set sharing a first common characteristic; and transferring a second set of one or more discrete components to a second target substrate, the discrete components in the second set sharing a second common characteristic. The discrete components include light emitting diodes (LEDs), and in which the characteristic includes one or more of an optical characteristic and an electrical characteristic. Transferring the multiple discrete components to the second substrate includes transferring fewer than all of the discrete components from the first substrate to the second substrate. The method includes, before transferring the multiple discrete components, transferring each of one or more of the discrete components individually from the first substrate to a destination. Transferring each of one or more of the discrete components individually includes transferring the discrete components that do not satisfy a quality criterion. The method includes, after transferring the multiple discrete components to the second substrate, transferring each of one or more discrete components that remain on the first substrate individually to the second substrate. The method includes, after transferring the multiple discrete components to the second substrate, transferring each of one or more discrete components from a third substrate individually to the second substrate. The multiple discrete components form an array of discrete components on the second substrate, and in which transferring each of one or more discrete components that remain on the first substrate includes transferring a discrete component to an empty position in the array on the second substrate. Irradiating multiple regions includes scanning the irradiation to multiple subsets of discrete components. The multiple discrete components in each subset are released concurrently, and the multiple subsets are released successively. Irradiating multiple regions includes irradiating each region with an irradiation pattern. The method includes separating laser energy into the irradiation pattern. The method includes separating the laser energy into the irradiation pattern with a first diffractive optical element. The method inclu