EP-4739081-A2 - METHOD FOR MANUFACTURING A SYSTEM IN PACKAGE (SIP) USING AN INTEGRATED PACKLET ON LEADFRAME

EP4739081A2EP 4739081 A2EP4739081 A2EP 4739081A2EP-4739081-A2

Abstract

A system in package (SiP) includes two or more integrated circuit (IC) packlets performing different functionalities. Each packlet includes a bare functional IC die encapsulated within a first body and including etched individual leads. The packlets are mounted to a leadframe and encapsulated within a second body. A metal heatsink is attached to the leadframe, on a side opposite the two or more IC packlets, using a non-electrically conductive adhesive material.

Inventors

RENARD, LOIC PIERRE LOUIS

Assignees

STMicroelectronics International N.V.

Dates

Publication Date: 20260506
Application Date: 20251022

Claims (15)

A method, comprising: mounting a plurality of bare integrated circuit (IC) dies rear face down to a metal plate; connecting electrical interconnections between connection pads at front faces of the plurality of bare IC dies and connection regions of the metal plate; placing the metal plate with the plurality of bare IC dies and electrical interconnections in a first mold cavity; injecting an encapsulation material into the first mold cavity to encapsulate the plurality of bare IC dies and electrical interconnections within a first encapsulating body and form a panel; etching the metal plate to form individual metal leads at the connection regions; and cutting through the first encapsulating body at locations between adjacent IC dies to singulate the panel into a plurality of packlets.
The method of claim 1, wherein etching the metal plate further forms individual die pads at the locations of the plurality of bare IC dies.
The method of claim 1 or 2, further comprising, before cutting, performing electrical testing of the plurality of bare IC dies, the electrical interconnections and the individual metal leads by contacting test probes to the individual metal leads.
The method of any one of claims 1 to 3, further comprising, after etching, forming an insulating layer at a backside of the first encapsulating body between the individual metal leads.
The method of any one of claims 1 to 4, wherein the plurality of bare IC dies are configured to perform a same functionality, and steps of the method of claim 1 are repeated with bare IC dies having different functionalities to produce packlets having different functionalities.
The method of claim 5, further comprising: mounting a group of packlets to a carrier tape, wherein said group of packlets includes a first packlet having a first functionality and a second packlet having a second functionality; placing the carrier tape with the group of packlets in a second mold cavity; injecting an encapsulation material into the second mold cavity to encapsulate the group of packlets within a second encapsulating body to form an encapsulated packlet group; removing the carrier tape; attaching the encapsulated packlet group to a leadframe, wherein the individual metal leads of the first and second packlets having the first and second functionalities, respectively, of the encapsulated packlet group are mounted to corresponding leadframe leads of the leadframe; and mounting a heatsink using a non-electrically conductive adhesive material to the leadframe opposite the group of packlets to form a system in package (SiP).
The method of claim 6, further comprising cutting through the second encapsulating body to define sides of the encapsulated packlet group.
The method of claim 6 or 7, further comprising encapsulating the heatsink and non-electrically conductive adhesive material within a third encapsulating body.
The method of claim 8, wherein distal ends of the leadframe leads extend out from the sides of the third encapsulating body.
The method of claim 5, further comprising: mounting a group of packlets to a leadframe, wherein the group of packlets includes a first packlet having a first functionality and a second packlet having a second functionality connected to a plurality of leadframe leads of the leadframe; mounting a heatsink using a non-electrically conductive adhesive material to the leadframe opposite the group of packlets; placing the leadframe with the group of packlets and the adhesively mounted heatsink in a second mold cavity; and injecting an encapsulation material into the second mold cavity to encapsulate the group of packlets and adhesively mounted heatsink within a second encapsulating body to form a system in package (SiP).
The method of any one of claims 6 to 10, wherein a side of each packlet having the individual metal leads is mounted to the carrier tape or to the leadframe and wherein an opposite side of each packlet is in contact with a mold defining the second mold cavity or is offset from a mold defining the second mold cavity.
The method of claim 10 or 11, further comprising cutting through distal ends of the leadframe leads.
The method of any one of claims 10 to 12, wherein the mold defining the second mold cavity defines sides of the SiP.
The method of claim 13, wherein cut ends of the leadframe leads extend out from the sides of the SiP.
The method of any one of claims 6 to 14, wherein the non-electrically conductive adhesive material comprises an adhesive including ceramic-based fillers.

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application claims priority to United States Provisional Application for Patent No. 63/713,336, filed October 29, 2024, the content of which is incorporated herein by reference. TECHNICAL FIELD The present invention generally relates to integrated circuit packaging and, more particularly, to a system in package (SiP) where two or more integrated circuit dies are supported by an electrical interconnection structure and encapsulated within a package body. BACKGROUND A system in package (SiP) is a single package that contains multiple integrated circuits (ICs) interconnected with each other to perform the functions of an entire system. The included electronics within a given SiP may comprise: a power IC, a processing IC, a memory IC, a communication IC, and specific functional ICs. SiPs are used to simplify the design of complex electronic systems by combining all the necessary components of the system within a single package body. SiPs are ideal solutions when the system has an advanced design and the application has space constraints. SiP testing and verification can be a challenge to implement. There is typically a high level of integration and complexity in the design, and with the use of multiple IC dies there can be concerns with yield. The conventional process for making a SiP is to mount the ICs dies on a leadframe, a direct copper bond (DCB) on ceramic substrate or an active metal brazed (AMB) on ceramic substrate. SUMMARY In an embodiment, a method comprises: mounting a plurality of bare integrated circuit (IC) dies rear face down to a metal plate; connecting electrical interconnections between connection pads at front faces of the plurality of bare IC dies and connection regions of the metal plate; placing the metal plate with the plurality of bare IC dies and electrical interconnections in a first mold cavity; injecting an encapsulation material into the first mold cavity to encapsulate the plurality of bare IC dies and electrical interconnections within a first encapsulating body and form a panel; etching the metal plate to form individual metal leads at the connection regions; and cutting through the first encapsulating body at locations between adjacent IC dies to singulate the panel into a plurality of packlets. In an embodiment, the plurality of bare IC dies are configured to perform a same functionality, and the processing described above is repeated with bare IC dies having different functionalities to produce packlets having different functionalities. In an embodiment, a method comprises: mounting a group of packlets to a carrier tape, wherein said group of packlets includes a packlet having a first functionality and a packlet having a second functionality; placing the carrier tape with the group of packlets in a second mold cavity; injecting an encapsulation material into the second mold cavity to encapsulate the group of packlets within a second encapsulating body to form an encapsulated packlet group; removing the carrier tape; attaching the encapsulated packlet group to a leadframe, wherein the individual metal leads of the packlets having the first and second functionalities of the encapsulated packlet group are mounted to corresponding leadframe leads of the leadframe; and mounting a heatsink using a non-electrically conductive adhesive material to the leadframe opposite the group of packlets to form a system in package (SiP). In an embodiment, a method comprises: mounting a group of packlets to a leadframe, wherein the group of packlets includes a packlet having a first functionality and a packlet having a second functionality connected to a plurality of leadframe leads of the leadframe; mounting a heatsink using a non-electrically conductive adhesive material to the leadframe opposite the group of packlets; placing the leadframe with the group of packlets and the adhesively mounted heatsink in a second mold cavity; and injecting an encapsulation material into the second mold cavity to encapsulate the group of packlets and adhesively mounted heatsink within a second encapsulating body to form a system in package (SiP). In an embodiment, a method comprises: mounting a plurality of groups of packlets to a carrier tape; wherein each group of packlets includes a first functionality packlet and a second functionality packet; wherein each first functionality packlet comprises a first bare integrated circuit (IC) die encapsulated within a first encapsulating body and including etched individual metal leads; wherein each second functionality packlet comprises a second bare IC die encapsulated within a second encapsulating body and including etched individual metal leads; placing the carrier tape with the groups of packlets in a mold cavity; injecting an encapsulation material into the mold cavity to encapsulate the groups of packlets within a third encapsulating body; cutting through the third encapsulating body between adjacent groups of packlets