Search

EP-4739506-A1 - BOND WIRES FOR FLUID EJECTION DEVICE ASSEMBLIES

EP4739506A1EP 4739506 A1EP4739506 A1EP 4739506A1EP-4739506-A1

Abstract

A fluid ejection device assembly may include a fluid ejection die and a plurality of bond wires, each wire of the plurality of bond wires electrically connected to the fluid ejection die at a first point of connection and electrically connected to an interface circuit at a second point of connection, the plurality of bond wires to transmit signals between the interface circuit and the die, wherein the plurality of bond wires are covered by encapsulant, the plurality of bond wires engaging a wire support separate from the encapsulant, between the first point of connection and the second point of connection.

Inventors

  • WU, FAN
  • GROOM, Michael
  • SMITH, CHRISTOPHER F.
  • CRANE, PHILIP

Assignees

  • Hewlett-Packard Development Company, L.P.

Dates

Publication Date
20260513
Application Date
20230703

Claims (20)

  1. 1. A fluid ejection device assembly comprising: a fluid ejection die; and a plurality of wires, each wire of the plurality of wires electrically connected to the fluid ejection die at a first point of connection and electrically connected to an interface circuit at a second point of connection, the plurality of wires to transmit signals between the interface circuit and the die, wherein the plurality of wires are covered by encapsulant, the plurality of wires engaging a wire support separate from the encapsulant, between the first point of connection and the second point of connection.
  2. 2. The fluid ejection device assembly of claim 1, wherein the wires are bond wires.
  3. 3. The fluid ejection device assembly of claim 1 or claim 2, wherein the plurality of wires engage the wire support near an edge of a fluid ejection device that comprises the die, and adjacent a bend of the wires.
  4. 4. The fluid ejection device assembly of any of claims 1-3, wherein the plurality of wires extend parallel to each other.
  5. 5. The fluid ejection device assembly of any of claims 1 - 4, wherein the wire support is a molded body to support the die, and wherein the plurality of wires engage the molded body at an edge of the molded body.
  6. 6. The fluid ejection device assembly of any of claims 1 - 5, wherein the wire support comprises a support bed comprising at least one of a compound, adhesive, and/or tape.
  7. 7. The fluid ejection device assembly of claim 6, wherein the fluid ejection device assembly further comprises a molded body to support the die, and wherein the support bed is located adjacent an edge of the molded body.
  8. 8. The fluid ejection device assembly of claim 6 or claim 7, wherein the support bed electrically isolates the plurality of bond wires from the molded body.
  9. 9. The fluid ejection device assembly of any of claims 5-8, wherein the edge of the molded body comprises a bevel.
  10. 10. The fluid ejection device assembly of any of claims 6-9 , wherein the support bed has a different modulus of thermal expansion than the molded body.
  11. 11. The fluid ejection device assembly of any of claims 6-10, wherein the support bed has a different dielectric property than the molded body.
  12. 12. The fluid ejection device assembly of any of claims 1-11, wherein the wire support prevents lateral movement of the plurality of wires, lateral with respect to a length direction of the bond wires.
  13. 13. A fluid ejection device assembly comprising: an interface circuit comprising a contact; a first bond pad of, and electrically connected to circuitry in, a first fluid ejection die; a second bond pad of, and electrically connected to circuitry in, a second fluid ejection die; and a single bond wire connected to the first die at the first bond pad, the second die at the second bond pad, and the contact of the interface circuit.
  14. 14. The fluid ejection device assembly of claim 13, wherein the single bond wire contacts the first die only at a first single bond element of the first bond pad and the second die only at a second single bond element of the second bond pad.
  15. 15. The fluid ejection device assembly of claim 13 or claim 14, wherein a first angle between the single bond wire and the first die surface, at a point where the single bond wire touches the single second bond pad, is less than or equal to 60 degrees, and wherein a second angle between the single bond wire and the second die surface, at a point where the single bond wire touches the single second bond pad, is less than or equal to 60 degrees.
  16. 16. The fluid ejection device assembly of any of claims 13-15, wherein the single bond wire is covered in its entirety by an encapsulant.
  17. 17. The fluid ejection device assembly of any of claims 13 - 16, further comprising a molded body supporting the first fluid ejection die and the second ejection die, and a wire support adjacent an edge of the molded body, of any of the claims 1 - 12.
  18. 18. A fluid ejection device assembly comprising: a first single bond wire of a plurality of bond wires; a second single bond wire of the plurality of bond wires; and at least two dies each having a distal bond pad and a proximal bond pad, wherein the first single bond wire connects to a first contact of an interface circuit and the distal bond pad of each of the at least two dies, and wherein the second single bond wire connects to a second contact of the interface circuit and the proximal bond pad of each of the at least two dies.
  19. 19. The fluid ejection device assembly of claim 18, wherein the first single bond wire and the second single bond wire extend parallel to each other.
  20. 20. The fluid ejection device assembly of claim 18 or claim 19, wherein each of the distal bond pads of each of the at least three dies includes a first single bond element, wherein the first single bond wire contacts each of the at least three dies only at the first single bond element of the distal bond pad of each of each of the at least three dies, wherein each of the proximal bond pad of each of the at least three dies includes a second single bond element, and wherein the second single bond wire contacts each of the at least three dies only at the second single bond element of the proximal bond pad of each of the at least three dies.

Description

BOND WIRES FOR FLUID EJECTION DEVICE ASSEMBLIES BACKGROUND [0001] Inkjet printing involves depositing ink onto a surface, such as sheet of paper. Print fluid can be stored in a print fluid reservoir until it is used for printing. Print dies may dispense the print fluid for printing. BRIEF DESCRIPTION OF THE DRAWINGS [0002] FIG. 1 illustrates a fluidic structure assembly of a fluid ejection device assembly. [0003] FIG. 2 illustrates a close-up view of a portion of FIG. 1. [0004] FIG. 3 illustrates a cross-section view of the fluidic structure assembly of FIG. 1. [0005] FIG. 4 illustrates a cross-section view of the fluidic structure assembly of FIG. 1 including an encapsulant. [0006] FIG. 5 illustrates a perspective view of a plurality of bond wires of an example fluidic structure assembly with the plurality of bond wires unsupported. [0007] FIG. 6 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by a fluid ejection device. [0008] FIG. 7 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by an adhesive on top of an edge of a fluid ejection device. [0009] FIG. 8 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by an adhesive on a corner of a fluid ejection device. [0010] FIG. 9 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by an adhesive on a bevel of a fluid ejection device. [0011] FIG. 10 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by tape on top of an edge of a fluid ejection device. [0012] FIG. 11 illustrates a cross-section view of an example fluidic structure assembly with a plurality of bond wires supported by tape on a comer of a fluid ejection device. [0013] FIG. 12 illustrates a perspective view of a plurality of bond wires of an example fluidic structure assembly with the plurality of bond wires supported by a support material. [0014] FIG. 13 is a block diagram illustrating a plurality of bond wires connecting a die and an interface circuit of a fluid ejection device assembly. [0015] FIG. 14 illustrates a first bond wire and a second bond wire electrically connected to a bond pad of a fluid ejection die. [0016] FIG. 15 illustrates a single bond wire electrically connected to a bond pad of a fluid ejection die. [0017] FIG. 16 is a perspective view of the first bond wire and the second bond wire electrically connected to the bond pad of the fluid ejection die of FIG. 14. [0018] FIG. 17 is a perspective view of the single bond wire electrically connected to the bond pad of the fluid ejection die of FIG. 15. [0019] FIG. 18 is a top view of the first bond wire and the second bond wire electrically connected to the bond pad of the fluid ejection die of FIG. 14. [0020] FIG. 19 is a top view of the single bond wire electrically connected to the bond pad of the fluid ejection die of FIG. 15. [0021] FIG. 20 is a block diagram of a single bond wire electrically connecting a first fluid ejection die, a second fluid ejection die, and an interface circuit of a fluid ejection device assembly. [0022] FIG. 21 is a block diagram of a first single bond wire electrically connecting at least three dies and an interface circuit of a fluid ejection device assembly. [0023] The foregoing and other features of the present disclosure will become apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. Understanding that these drawings depict only several examples in accordance with the disclosure and are therefore, not to be considered limiting of its scope, the disclosure will be described with additional specificity and detail through use of the accompanying drawings. DETAILED DESCRIPTION [0024] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative examples described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here. It will be readily understood that the aspects of the present disclosure, as generally described herein, and illustrated in the figures, can be arranged, substituted, combined, and designed in a wide variety of different configurations, all of which are explicitly contemplated and made part of this disclosure. [0025] This disclosure relates to fluid ejection device assemblies. A fluid ejection device assembly may include a fluid ejection device for dispensing print fluid and a reservoir for storing the print fluid. The print fluid may include any 2D or 3D print agent i