EP-4739509-A1 - INTERCONNECT CIRCUIT FOR PRINT COMPONENT

Abstract

An interconnect circuit (140) may include a first portion (141) including an electrical interconnect pad array (142) to connect to a printer-side contact array to electrically connect the interconnect circuit with a printer circuit, wherein the electrical interconnect pad array extends along both sides of a center axis (A) of the electrical interconnect pad array. The interconnect circuit may include a second portion (147) including contact pads (146) connected to the electrical interconnect pads through lines (144), the contact pads to connect with an integrated circuit of a print component (100), wherein the second portion is displaced laterally relative to the center axis of the electrical interconnect pad array.

Inventors

• QUINN, MAX
• BAHNSEN, Kyle
• MCCOURT, Zachary T.
• STUMBO, Samuel
• SCHWEITZER, PAUL

Assignees

• Hewlett-Packard Development Company, L.P.

Dates

Publication Date

20260513

Application Date

20230703

Claims (20)

1. 1. An interconnect circuit comprising: a first portion including an electrical interconnection pad array to connect to a host controller-side contact array, to electrically connect the interconnect circuit with a host controller circuit, the electrical interconnection pad array extending along both sides of a center axis of the electrical interconnection pad array; and a second portion including contact pads connected to the electrical interconnection pads through lines, the contact pads to connect with an integrated circuit of a print component, the second portion displaced laterally relative to the center axis of the electrical interconnection pad array.
2. 2. The interconnect circuit of claim 1, further comprising a middle portion connecting the first portion and the second portion.
3. 3. The interconnect circuit of claim 2, wherein a center axis of the middle portion extends at an acute angle relative to the center axis of the electrical interconnection pad array.
4. 4. The interconnect circuit of any of claims 1-3, further comprising an electrically insulative support substrate to support the lines, wherein a center axis of the substrate in the middle portion extends at an acute angle relative to a center axis of the substrate in the first portion and/or second portion.
5. 5. The interconnect circuit of any of claims 1-4, wherein center axes of the first portion and second portion extend parallel to each other.
6. 6. The interconnect circuit of any of claims 1-5, wherein a general direction of the lines in the middle portion extends at an acute angle with a general direction of the lines in the first portion and/or second portion.
7. 7. The interconnect circuit of any of claims 1-6, wherein the center axis of the middle portion extends at an angle of 45° relative to the center axis of the electrical interconnection pad array.
8. 8. The interconnect circuit of any of claims 1-7 wherein the contact pads are displaced laterally relative to a center axis of the second portion.
9. 9. The interconnect circuit of any of claims 1-8, wherein the contact pads are displaced laterally relative to the center axis of the second portion towards the integrated circuit in an installed state.
10. 10. The interconnect circuit of any of claims 1-9, wherein the integrated circuit comprises at least one fluid ejection die, and the contact pads are provided in two groups, one group of contact pads to connect to a first end of the at least one fluid ejection die of the print component, and another group of contact pads to connect to a second end of the at least one fluid ejection die of the print component.
11. 11. The interconnect circuit of any of claims 1-10, wherein the interconnect circuit is a flex circuit comprising a flexible substrate, and wherein the lines are flex lines.
12. 12. The interconnect circuit of any of claims 1-11, wherein the print component comprises a fluid ejection device.
13. 13. The interconnect circuit of any of claims 1-12, wherein the electrical interconnection pad array comprises two columns, with a first column on a first side of the center axis of the electrical interconnection pad array, and a second column on a second side of the center axis of the electrical interconnection pad array.
14. 14. The interconnect circuit of any of claims 1-13, wherein the columns extend substantially parallel to each other and the center axis of the electrical interconnection pad array.
15. 15. A print component comprising the interconnect circuit of any of claims 1-14, wherein the second portion extends only along one side of the integrated circuit.
16. 16. The print component of claim 15, wherein the center axis of the electrical interconnection pad array aligns with a center axis of the integrated circuit of the print component in an installed state.
17. 17. The print component of claim 15 or 16, comprising a molded reservoir body to hold fluid, wherein the first portion is attached to the molded reservoir body such that the center axis of the electrical interconnection pad array aligns with a center axis of the molded body.
18. 18. A print component, for example of any of claims 15-17, comprising: a molded reservoir body; an integrated circuit of any of claim 1-14; the interconnect circuit attached to the molded body and the integrated circuit, the first portion attached to a front face of the molded body along a center axis of the face of the molded body; and the second portion comprising at least one contact pad, the at least one contact pad electrically connected to the integrated circuit, the second portion laterally displaced relative to the center axis of the face of the molded body.
19. 19. The print component of claim 18 wherein the at least one contact pad is connected with the integrated circuit via one or more wires.
20. 20. The print component of claim 18 or claim 19, wherein the integrated circuit comprises at least one fluid ejection die and the at least one die is connected to the interconnect circuit via at least one corresponding wire.

Description

INTERCONNECT CIRCUIT FOR PRINT COMPONENT BACKGROUND [0001] Inkjet printing involves depositing ink onto a surface, such as sheet of paper. Print fluid can be stored in a print fluid reservoir until it is used for printing. Print dies may dispense the print fluid for printing. An interconnect circuit may interface with a printer control interface and the print dies. BRIEF DESCRIPTION OF THE DRAWINGS [0002] FIG. 1 illustrates a perspective view of an example print component. [0003] FIG. 2 illustrates an exploded view of the print component of FIG. 1. [0004] FIG. 3 illustrates a front view of the print component of FIG. 1. [0005] FIG. 4 illustrates a fluidic structure assembly including the fluidic structure, the fluid ejection device, and the interconnect circuit, as used in FIG. 1. [0006] FIG. 5 illustrates the interconnect circuit of FIG. 1. [0007] FIG. 6 illustrates an example fluidic structure assembly including a fluidic structure, a print component having one fluid ejection die, and an interconnect circuit. [0008] FIG. 7 is a block diagram of an example interconnect circuit. [0009] FIG. 8 is a block diagram of an example print component. [0010] FIG. 9 is a block diagram of an example print component including at least one bond. [0011] FIG. 10 illustrates the contact pads on a north portion of the interconnect circuit of FIG. 1. [0012] FIG. 11 illustrates the contact pads on a north portion of the interconnect circuit of FIG. 6. [0013] FIG. 12 illustrates example bond wires to connect contact pads to fluid ejection dies. [0014] FIG. 13 illustrates the interconnect circuit of FIG. 6 attached to a molded body. [0015] FIG. 14 illustrates a portion of the interconnect circuit of FIG. 1 including the tooling hole. [0016] FIG. 15 illustrates a cross-section of an example interconnect circuit. [0017] FIG. 16 illustrates an exploded view of the fluidic structure assembly of FIG. 6. [0018] FIG. 17 illustrates an exploded view of the fluidic structure assembly of FIG. 1. [0019] FIG. 18 is a block diagram of an example interconnect circuit. [0020] FIG. 19 is a block diagram of an example fluid ejection device assembly including the interconnect circuit of FIG. 18. [0021] FIG. 20 is a block diagram of an example interconnect circuit. [0022] FIG. 21 is a block diagram of an example flexible circuit including a metal plating and a protective layer. [0023] FIG. 22 illustrates the south end of the fluidic structure assembly of FIG. 4. [0024] FIG. 23 illustrates a close-up of a portion of FIG. 22. [0025] FIG. 24 illustrates the north end of the fluidic structure assembly of FIG. 4. [0026] FIG. 25 illustrates a close-up of a portion of FIG. 24. [0027] FIG. 26 is a block diagram of an example interconnect circuit. [0028] The foregoing and other features of the present disclosure will become apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. Understanding that these drawings depict only several examples in accordance with the disclosure and are therefore, not to be considered limiting of its scope, the disclosure will be described with additional specificity and detail through use of the accompanying drawings. DETAILED DESCRIPTION [0029] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative examples described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here. It will be readily understood that the aspects of the present disclosure, as generally described herein, and illustrated in the figures, can be arranged, substituted, combined, and designed in a wide variety of different configurations, all of which are explicitly contemplated and made part of this disclosure. [0030] This disclosure relates to print components. A print component may be any component for print systems, such as an exchangeable print cartridge, or a component of a cartridge such as a fluid ejection device (e.g., printhead) or other integrated circuit associated with a cartridge. A print component may include a print component for dispensing print fluid and a reservoir for storing the print fluid. The print fluid may include any 2D or 3D print agent including ink for printing on a medium such as paper (2D) or (e.g., powdered) build material (3D). The print fluid may include dispensable fluid to be dispensed at relatively high precision (as to volume and/or location) for fields of implementation other that 2D or 3D imaging, including but not limited to forensic, laboratory or pharmaceutical applications. [0031] FIG. 1 illustrates a perspective view of an example print component 100. The print component 100 may be a fluid ejection device as