EP-4739512-A2 - JEWELRY FORM FACTOR WITH EMBEDDED FUNCTIONALITY AND ADORNED WITH EMBELLISHMENTS

Abstract

A personalized and intrinsically valuable jewelry form factor or greeting card that includes electronic functionality. In an embodiment, one form factor is metallic, rectangular device with overall thickness of 3 mm that is credit-card sized. Embedded inside the form factor are electronic components giving rise to its functionality such as processing, data storage, messaging display, user input, wireless charging facilities, battery compactly disposed inside of a 2 mm cavity. Further, the form factor provides strength with a wall thickness of 0.5 mm and made of titanium, or the like.

Inventors

• LAZAR, Chanie

Assignees

• Notocard LLC

Dates

Publication Date

20260513

Application Date

20240703

Claims (20)

1. 1 . A jewelry form factor, comprising a body having a base material comprising a metal or metal alloy for at least one surface thereof and one or more jeweled embellishments and/or an engraving set in the metal or metal alloy, the body encompassing a cavity suited to enclose electronic components; a processor disposed in the cavity and configured to execute computer instructions; a memory disposed in the cavity and coupled to the processor, the memory having computer executable instructions to be executed by the processor; a display disposed on the exterior of the body and coupled to the processor, the display configured to display visual indications on the display in response to the execution of the computer instructions; and a communication module disposed in the cavity and configured to receive and send messages to one or more remote devices in response to the execution of the computer instructions.
2. 2. The jewelry form factor of claim 1, wherein the base material comprises platinum, titanium, aluminum, brass, chromium, iron, manganese, molybdenum, steel, tungsten, vanadium, silver, gold, alloys thereof, or combinations thereof.
3. 3. The jewelry form factor of claim 1, wherein the one or more jewelled embellishments comprise one or more gemstones set in the base material in a pre-determined pattern or location.
4. 4. The jewelry form factor of claim 3, wherein one or more gemstones comprise natural, synthetic, colored, or treated diamonds.
5. 5. The jewelry form factor of claim 1, further comprising a rechargeable battery coupled to the processor and configured to provide power signals to other electronic componentry of the jewelry form factor.
6. 6. The jewelry form factor of claim 5, further comprising a wireless recharging port for receiving a wireless recharging signal to recharge the rechargeable battery.
7. 7. The jewelry form factor of claim 1, further comprising a user input button configured to change a message displayed on the display.
8. 8. The jewelry form factor of claim 7, further comprising a second user input button configured to communicatively engage a remote computing device to exchange electronic messages.
9. 9. The jewelry form factor of claim 1, further comprising an accelerometer coupled to the processor and configured to detect an orientation of the body and change an orientation of messages displayed on the display in response to the detection of the orientation of the body.
10. 10. The jewelry form factor of claim 1, wherein the body comprises a thickness of about 2.0 mm to about 4.0 mm.
11. 11. The jewelry form factor of claim 1, wherein the body comprises a first dimension of about 70 mm to about 90 mm.
12. 12. The jewelry form factor of claim 11, wherein the body comprises a second dimension of about 50 mm to about 60 mm.
13. 13. The jewelry form factor of claim 1, wherein the communication module disposed in the cavity is configured to receive and send messages in real-time as real time communications.
14. 14. The jewelry form factor of claim 1, wherein the cavity comprises a thickness of about 1.0 mm to about 3.0 mm.
15. 15. A computing system, comprising a local computing device having a processor configured to execute instructions to send and receive electronic signals; a jewelry form factor in electronic communication with the local computing device, the jewelry form factor, comprising a body having a base material and one or more jeweled embellishments and/or an engraving, the body encompassing a cavity suited to enclose electronic components; a processor disposed in the cavity and configured to execute computer instructions; a memory disposed in the cavity and coupled to the processor, the memory having computer executable instructions to be executed by the processor; a display disposed on the exterior of the body and coupled to the processor, the display configured to display visual indications on the display in response to the execution of the computer instructions; and a communication module disposed in the cavity and configured to the electronic communication with the local computing device; and a remote computing device communicatively coupled to the local computing device via the computer network, the remote computing device having a processor configured to execute instructions to send electronic signals to the jewelry form factor via the computer network and via the local computing device.
16. 16. The computing system of claim 15, further comprising a third-party computing device communicatively coupled to the local computing device via the computer network, the third-party computing device having a processor configured to execute instructions to send electronic signals to the jewelry form factor via the computer network and via the local computing device.
17. 17. The computing system of claim 15, wherein the jewelry form factor further comprises a rechargeable battery coupled to the processor and configured to provide power signals to other electronic componentry of the jewelry form factor.
18. 18. The computing system of claim 17, wherein the local computing device is further configured to send wireless charging signals to the jewelry form factor to recharge the battery.
19. 19. The computing system of claim 15, wherein the local computing device further comprises a body having an intrinsically valuable base material and one or more jeweled embellishments, the body encompassing a cavity suited to enclose electronic components.
20. 20. A greeting card, comprising: a body having a base material comprising a metal or metal alloy for at least one surface thereof, the body encompassing a cavity suited to enclose electronic components a processor disposed in the cavity and configured to execute computer instructions; a memory disposed in the cavity and coupled to the processor, the memory having computer executable instructions to be executed by the processor; a display disposed on the exterior of the body and coupled to the processor, the display configured to display visual indications on the display in response to the execution of the computer instructions; a communication module disposed in the cavity and configured to receive and send messages in real-time to one or more remote devices in response to the execution of the computer instructions. a rechargeable battery coupled to the processor and configured to provide power signals to other electronic componentry of the jewelry form factor; a wireless recharging port for receiving a wireless recharging signal to recharge the rechargeable battery; a first user input configured to change a message displayed on the display; and a second user input button configured to communicatively engage a remote computing device to exchange electronic messages.

Description

JEWELRY FORM FACTOR WITH EMBEDDED FUNCTIONALITY AND ADORNED WITH EMBELLISHMENTS CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application is a Continuation-in-part of U.S. Non-Provisional Application No. 18/046,425, filed on October 13, 2022, which is a continuation of U.S. Patent 11,498,355, issued November 15, 2022, entitled “Combination Greeting Card,” filed December 6, 2019 as U.S. Nonprovisional 16/620,202, which is a national phase entry of international patent application No. PCT/US2018/036283 filed June 6, 2018, and which claims the benefit of priority from U.S. Provisional Application No. 62/515,798, the disclosures of which are incorporated, in their entirety, herein by reference, for all purposes. TECHNICAL FIELD [0002] This application relates generally to jewelry form factors, more particular jewelry form factors, such as greeting cards, that are adorned with embellishments and that have a display and a processor configured to display a real time communication from the sender to the recipient. BACKGROUND [0003] The greeting card industry and fine j ewelry industry are competitive industries where attempts are constantly made to produce novel features for greeting cards and/or fine jewelry. However, the greeting card industry suffers from several issues thought to be inherent to the industry. For example, after a person has received a greeting card, they are typically soon simply discarded and the message which was contained in the greeting card is lost, forgotten, or ignored. Even when greeting cards are saved, they are typically stored in a box or other protective casing because their traditional materials (e.g., paper) make them relatively fragile to daily use. Thus, typical greeting cards have limited effectiveness as long-lasting methods of communication of human sentiments between individuals. There is a need for novel greeting cards that have an intrinsic gift value that will be kept so that the message that was originally conveyed is preserved, as well as for greeting cards that have ongoing functional utility. [0004] Further, as some greeting cards have emerged that do have some limited functionality, it is typically limited to minimal audio recordings that cannot be changed or repurposed. Further yet, even with slightly improved functionality, the consumer perception remains that such a “paper” greeting card is to be discarded or otherwise disposed. There is a need for enough improved functionality in a form factor that reaches beyond the perceived connotation that greeting cards are disposable by providing intrinsic value to such a form factor that also includes improved functionality capable of repurpose. BRIEF DESCRIPTION OF THE DRAWINGS [0005] Embodiments of the subject matter disclosed herein in accordance with the present disclosure will be described with reference to the drawings, in which: [0006] FIG. 1 is a plan view of a jewelry form factor having improved functionality according to an embodiment of the subject matter disclosed herein. [0007] FIG. 2A is an isometric view of a jewelry form factor having improved functionality according to an embodiment of the subject matter disclosed herein. [0008] FIG. 2B is another plan view of a jewelry form factor having improved functionality and an embedded message according to an embodiment of the subject matter disclosed herein. [0009] FIG. 3 is a block diagram of electronic components that give rise to the improved functionality of the jewelry form factor of FIGS. 1 and 2 according to an embodiment of the subject matter disclosed herein. [0010] FIG. 4 is a system diagram of a computing environment utilizing the improved functionality of the jewelry form factors of FIGS. 1 and 2 according to an embodiment of the subject matter disclosed herein. [0011] FIG. 5 is a side perspective view of the front of a second embodiment of a j ewelry form factor according to an embodiment of the subject matter disclosed herein. [0012] FIG. 6 is an end perspective view of a back panel of a jewelry form factor according to an embodiment of the subject matter disclosed herein. [0013] FIG. 7 is a plan view of the interior of the back panel of FIG. 6 according to an embodiment of the subject matter disclosed herein. [0014] FIG. 8 is an end perspective view of the back panel of FIG. 6 according to an embodiment of the subject matter disclosed herein. [0015] FIG. 9 is a perspective the jewelry form factor of FIG. 1 showing a small button for case access according to an embodiment of the subject matter disclosed herein. [0016] FIG. 10 is an exploded view of jewelry form factor of FIG. 1 showing details of functional buttons according to an embodiment of the subject matter disclosed herein. [0017] FIG. 11 is a cutaway view of the jewelry form factor of FIG. 1 showing a groove for an adhesive according to an embodiment of the subject matter disclosed herein. [0018] FIG. 12 is a cutaway view of FIG. 11 showing additional detail of the groove for adhesiv