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EP-4740082-A2 - POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY

EP4740082A2EP 4740082 A2EP4740082 A2EP 4740082A2EP-4740082-A2

Abstract

A device includes a power substrate and a first power device on the power substrate. A housing having housing sides having at least a first housing side and a second housing side, the housing configured to house at least the power substrate and the first power device. A plurality of power terminals extending from at least one of the housing sides. The plurality of power terminals having at least a first power terminal and a second power terminal. A plurality of signal terminals extending from at least one of the housing sides. The plurality of signal terminals having at least a source kelvin signal terminal, a gate driver signal terminal, and at least one additional signal terminal.

Inventors

  • WHEELER, PAUL
  • MCPHERSON, BRICE
  • SCHUPBACH, ROBERTO MARCELO
  • MONTOYA, Leonardo
  • PASSMORE, BRANDON
  • MAHMUD, Mohammed Hazzaz
  • SAMPLES, BEN
  • BHUVANESH, Prasana Obala
  • KANALE, Ajit R.

Assignees

  • Wolfspeed, Inc.

Dates

Publication Date
20260513
Application Date
20240627

Claims (20)

  1. 1 . A power package comprising: a power substrate; a first power device on the power substrate; a housing having housing sides comprising at least a first housing side and a secondousing side, the housing configured to house at least the power substrate and the firstower device; a plurality of power terminals extending from at least one of the housing sides; the plurality of power terminals comprising at least a first power terminal and aecond power terminal; a plurality of signal terminals extending from at least one of the housing sides; and the plurality of signal terminals comprising at least a source kelvin signal terminal, aate driver signal terminal, and at least one additional signal terminal.
  2. 2. The power package according to claim 1 wherein the first power terminal extends from the first housing side and the secondower terminal extends from the second housing side; and wherein at least one of the plurality of signal terminals extends from the first housingide and at least one of the plurality of signal terminals extends from the second housingide.
  3. 3. The power package according to claim 1 wherein the first power terminal extends from the first housing side and the secondower terminal extends from the second housing side; and wherein at least two of the plurality of signal terminals extend from the first housingide and at least two of the plurality of signal terminals extend from the second housingide.
  4. 4. A configuration of a plurality of implementations of the power package oflaim 1 , wherein the plurality of implementations of the power package are arranged in aridge leg configuration topology.
  5. 5. A configuration of a plurality of implementations of the power package of claim 1 , wherein the plurality of implementations of the power package are arranged in a plurality of paralleled bridge leg configuration topologies.
  6. 6. The power package according to claim 1 wherein at least one implementation of the at least one additional signal terminal is onfigured as an overcurrent/desaturation signal terminal configured to provide overcurrent ignals and/or desaturation signals.
  7. 7. The power package according to claim 6 wherein the vercurrent/desaturation signal terminal is connected to a drain pad on the power substrate.
  8. 8. The power package according to claim 6 wherein the vercurrent/desaturation signal terminal is configured to allow a gate driver and/or easurement/instrumentation circuitry to monitor a voltage across a switch position.
  9. 9. The power package according to claim 1 wherein at least one implementation of the at least one additional signal terminal is onfigured as a current sensing signal terminal; and wherein the current sensing signal terminal is connected to a current sensor.
  10. 10. The power package according to claim 9 wherein the current sensing ignal terminal comprises two current sensing terminals.
  11. 11. The power package according to claim 9 wherein the current sensor omprises an integrated current sensor implemented with at least one implementation of he first power device.
  12. 12. The power package according to claim 9 wherein the current sensor omprises an on-chip current sensor implemented in at least one implementation of the first ower device.
  13. 13. The power package according to claim 1 wherein at least one implementation of the at least one additional signal terminal is configured as a temperature sensing terminal.
  14. 14. The power package according to claim 13 wherein the temperature sensing terminal comprises two temperature sensing terminals.
  15. 15. The power package according to claim 13 wherein the temperature ensing terminal is connected to a temperature sensor comprising: an on-chip temperature ensor implemented with at least one implementation of the first power device, an isolatedemperature sensor, a non-isolated temperature sensor, and/or a temperature sensing evice integrated with the power substrate.
  16. 16. The power package according to claim 1 wherein at least onemplementation of the at least one additional signal terminal is connected to a strain gauge.
  17. 17. The power package according to claim 1 wherein the plurality of signalerminals are symmetrically arranged on the housing sides.
  18. 18. The power package according to claim 1 wherein the plurality of signalerminals are asymmetrically arranged on the housing sides.
  19. 19. The power package according to claim 1 wherein all of the plurality of ignal terminals are symmetrically arranged on either the first housing side or the second ousing side.
  20. 20. The power package according to claim 1 wherein all of the plurality of ignal terminals are asymmetrically arranged on either the first housing side or the second ousing side.

Description

POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY BACKGROUND OF THE DISCLOSURE [0001] Power electronics packages typically implement one or more power devices, such as Silicon Carbide (SiC) power devices, which offer a high level of performance benefits, including high voltage blocking, low on-resistance, high current, fast switching, low switching losses, high junction temperatures, and high thermal conductivity. Ultimately, these power device characteristics result in a notable increase in potential power density, which is power processed per area or volume. However, typical power electronics packages have limited functionality and/or capabilities. [0002] Accordingly, what is needed is power electronics packages which implement layouts, structures, and/or configurations that can provide increased functionality and/or capability. SUMMARY OF THE DISCLOSURE [0003] In one aspect, a power package includes a power substrate. The power package in addition includes a first power device on the power substrate. The package moreover includes a housing having housing sides having at least a first housing side and a second housing side, the housing configured to house at least the power substrate and the first power device. The package also includes a plurality of power terminals extending from at least one of the housing sides. The package further includes the plurality of power terminals having at least a first power terminal and a second power terminal. The package in addition includes a plurality of signal terminals extending from at least one of the housing sides. The package moreover includes the plurality of signal terminals having at least a source kelvin signal terminal, a gate driver signal terminal, and at least one additional signal terminal. [0004] In one aspect, a power package includes a power substrate. The power package in addition includes a first power device on the power substrate. The package moreover includes a housing having housing sides having at least a first housing side and a second housing side, the housing 200 configured to house at least the power substrate and the first power device. The package also includes a plurality of power terminals extending from at least one of the housing sides. The package further includes the plurality of power terminals having at least a first power terminal and a second power terminal. The package in addition includes a plurality of signal terminals extending from at least one of the housing sides. The package moreover includes the plurality of signal terminals having at least a source kelvin signal terminal and a gate driver signal terminal. The package also includes a common source connection connected between the first power device and a second power device. [0005] Additional features, advantages, and aspects of the disclosure may be set forth or apparent from consideration of the following detailed description, drawings, and claims. Moreover, it is to be understood that both the foregoing summary of the disclosure and the following detailed description are exemplary and intended to provide further explanation without limiting the scope of the disclosure as claimed. BRIEF DESCRIPTION OF THE DRAWINGS [0006] The accompanying drawings, which are included to provide a further understanding of the disclosure, are incorporated in and constitute a part of this specification, illustrate aspects of the disclosure and together with the detailed description serve to explain the principles of the disclosure. No attempt is made to show structural details of the disclosure in more detail than may be necessary for a fundamental understanding of the disclosure and the various ways in which it may be practiced. In the drawings: [0007] Figure 1 illustrates a top side perspective view of an external configuration a power package according to aspects of the disclosure. [0008] Figure 2 illustrates a top side view of an external configuration a power package according to Figure 1. [0009] Figure 3 illustrates a top view of a configuration of a plurality of implementations of the power package according to Figure 1. [0010] Figure 4 illustrates a top view of a configuration of a plurality of implementations of the power package according to Figure 1. [0011] Figure 5A illustrates a partial top view of the power package according to aspects of the disclosure. [0012] Figure 5B illustrates a partial schematic of the power package according to Figure 5A. [0013] Figure 6 illustrates a partial top perspective view of the power package according to aspects of the disclosure. [0014] Figure 7 illustrates a partial top view of the power package according to aspects of the disclosure. [0015] Figure 8 illustrates a partial top perspective view of the power package according to aspects of the disclosure. [0016] Figure 9 illustrates a partial top view of the power package according to aspects of the disclosure. [0017] Figure 10 illustrates a partial top view of the power package acc