EP-4740240-A1 - STAGE AND TOOL FOR HETEROGENEOUS INTEGRATION OF VARIABLY SIZED DIE

Abstract

A support structure for die comprising: an array of attachment connections configured to hold die actuators, each of the die actuators held by at least one attachment connection; and an array of controller connections configured to interface with die actuators to control movement of the die actuators, wherein the array of controller connections is interspersed in the array of attachment connections. And a system for die positioning comprising a first stage supporting an array of die actuators; a second stage supporting a plurality of acceptor target dies; and a measurement system functionally coupled to at least one of the first stage and the second stage and configured to: position at least one of the first stage and the second stage such that a position of the first donor die corresponds to a position of the first acceptor target die.

Inventors

• OTTENS, JOOST, JEROEN
• DE JAGER, PIETER, WILLEM, HERMAN
• HUMPHREYS, Bedwyr
• BENSCHOP, JOZEF, PETRUS, HENRICUS
• VAN ZWET, ERWIN, JOHN
• VAN RIEL, Martinus, Cornelius, Johannes, Maria

Assignees

• ASML Netherlands B.V.

Dates

Publication Date

20260513

Application Date

20240610

Claims (15)

1. 1. A support structure for die comprising: an array of attachment connections configured to hold die actuators, each of the die actuators held by at least one attachment connection; and an array of controller connections configured to interface with die actuators to control movement of the die actuators, wherein the array of controller connections is interspersed in the array of attachment connections, and wherein the array of attachment connections and the array of controller connections are configured to remain in a static position during said movement of the die actuators.
2. 2. The support structure of claim 1 , wherein the support structure further comprises a plurality of die actuators, individual of the die actuators attached to the support structure via at least one of the attachment connections and individual of the die actuators connected to at least one of the controller connections.
3. 3. The support structure of claim 2, wherein the die actuators are configured to mechanically move dies in a direction substantially perpendicular to a longitudinal plane of the support structure.
4. 4. The support structure of claim 2, wherein the die actuators are individually controllable via the controller connections.
5. 5. The support structure of claim 2, wherein the die actuators are placed on the support structure and attached to the support structure by activation of the attachment connections.
6. 6. The support structure of claim 5, wherein the die actuators are detached from the support structure by deactivation of the attachment connections.
7. 7. The support structure of claim 1, wherein a face of the support structure defines the attachment connections and the controller connections.
8. 8. The support structure of claim 1, wherein the attachment connections are orifices configured to hold individual die actuators by applying vacuum force, or wherein the attachment connections are electrical connections configured to hold individual die actuators by applying electrostatic force.
9. 9. The support structure of claim 1, wherein the controller connections comprise at least one of: orifices configured to control movement of the die actuators by applying vacuum force, orifices configured to control movement of the die actuators by applying compressed air force, and electrical connections configured to control movement of the die actuators by applying electrical signal.
10. 10. The support structure of claim 1, wherein the array of controller connections comprises controller connections of at least two different types.
11. 11. A system for die positioning comprising: a first stage supporting an array of die actuators, wherein the die actuators are configured to actuate at least one of a plurality of donor dies; a second stage supporting a plurality of target dies; and a measurement system functionally coupled to at least one of the first stage and the second stage and configured to: obtain a relative position between a first donor die of the plurality of donor dies and a first target die of the plurality of target dies; position at least one of the first stage and the second stage such that a position of the first donor die corresponds to a position of the first target die; and activate a die actuator supporting the first donor die to place the first donor die on the first target die.
12. 12. The system of claim 11, wherein the measurement system is further configured to: obtain a relative position between a second donor die of the plurality of donor dies and a second target die of the plurality of target dies; position at least one of the first stage and the second stage such that a position of the second donor die corresponds to a position of the second target die; and activate a die actuator supporting the second donor die to place the second donor die on the second target die.
13. 13. The system of claim 12, wherein the measurement system is further configured to: maintain pressure from the die actuator supporting the first donor die placed on the first target die after placing the first donor die on the first target die; and position at least one of the first stage and the second stage such that the position of the second donor die corresponds to a position of the second target die while maintaining pressure supporting the first donor die.
14. 14. The system of claim 12, wherein the measurement system is configured to obtain the relative position between the first donor die and the first target die and the relative position between the second donor die and the second target die substantially simultaneously.
15. 15. The system of claim 11, wherein the measurement system is further configured to retract the die actuator supporting the first donor die after a bonding time period has expired.

Description

STAGE AND TOOL FOR HETEROGENEOUS INTEGRATION OF VARIABLY SIZED DIE CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims priority of EP application 23184264.2 which was filed on 7 July 2023 and which is incorporated herein in its entirety by reference. TECHNICAL FIELD [0002] The present disclosure relates generally to a stage and tool for heterogeneous integration. BACKGROUND [0003] In manufacturing processes of integrated circuits (ICs), multiple finished or unfinished ICs (e.g., whole wafers, diced wafers, partially diced wafers, chips, die, etc.) may be placed in contact, stacked, bonded, or otherwise joined (e.g., to heterogeneous or homogeneous devices) at various points in the fabrication process. Heterogeneous integration, e.g., the integration of different circuits or other patterned devices, may rely upon joining of specific portions (for example, conductive contact elements) of multiple die — where these specific portions which may be aligned in three-dimensional space to ensure functional connectivity. Alignment of these die, which may have multiple fabrication layers, different critical dimensions, different nodes, packaging, etc., with each other may require different techniques than use for lithography during fabrication. As the physical sizes of IC components continue to shrink, and their structures continue to become more complex, accuracy and throughput in integration become more important. For applications such as heterogeneous integration, it may be desirable to obtain both accurate and fast placement of die with respect to one another [0004] In the context of semiconductor manufacture, improvements in die placement and alignment (e.g., improvements in heterogeneous integration) lead to improvements in IC manufacturing and integration abilities. SUMMARY [0005] According to an embodiment, there is provided a support structure for die comprising: an array of attachment connections configured to hold die actuators, each of the die actuators held by at least one attachment connection; and an array of controller connections configured to interface with die actuators to control movement of the die actuators, wherein the array of controller connections is interspersed in the array of attachment connections, and wherein the array of attachment connections and the array of controller connections are configured to remain in a static position during said movement of the die actuators. [0006] In an embodiment, the support structure further comprises a plurality of die actuators, individual of the die actuators attached to the support structure via at least one of the attachment connections and individual of the die actuators connected to at least one of the controller connections. [0007] According to another embodiment, a system is provided for die positioning comprising at least two support structures of any other embodiment. [0008] According to another embodiment, there is provided a system for die positioning comprising: a first stage supporting an array of die actuators, wherein the die actuators are configured to actuate at least one of a plurality of donor dies; a second stage supporting a plurality of target dies; and a measurement system functionally coupled to at least one of the first stage and the second stage and configured to: obtain a relative position between a first donor die of the plurality of donor dies and a first acceptor target die of the plurality of target dies; position at least one of the first stage and the second stage such that a position of the first donor die corresponds to a position of the first target die; and activate a die actuator supporting the first donor die to place the first donor die on the first target die. [0009] According to an embodiment, a die positioning tool configured to perform the method of any other embodiment is provided. [0010] According to another embodiment, one or more non-transitory, machine -readable medium is provided having instructions thereon, the instructions when executed by a processor being configured to perform the method of any other embodiment. BRIEF DESCRIPTION OF THE DRAWINGS [0011] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate one or more embodiments and, together with the description, explain these embodiments. Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which: [0012] Figures 1A-1D are schematic diagrams illustrating an exemplary die bonding method, according to an embodiment. [0013] Figures 2A-2B are schematic diagrams illustrating an example apparatus for die bonding, according to an embodiment. [0014] Figures 3A-3H are schematic diagrams illustrating a method of die placement, according to an embodiment. [0015] Figures 4A-4C are schematic diagrams illustrating a support structure fo