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EP-4740243-A1 - COOLER FOR POWER ELECTRONICS

EP4740243A1EP 4740243 A1EP4740243 A1EP 4740243A1EP-4740243-A1

Abstract

A cooler for power electronics comprises: first mounting surfaces for first power electronics modules, respectively; second mounting surfaces for second power electronics modules, respectively, each of the first mounting surfaces being parallel to and overlapping a corresponding one of the second mounting surfaces; and coolant paths extending between an inlet and an outlet, the coolant paths providing parallel flows among the first and second mounting surfaces.

Inventors

  • SADRI, Samaneh
  • LUNA, Jonathan
  • JAMBON, Jerome
  • HALL, Bradley Lucas

Assignees

  • Atieva, Inc.

Dates

Publication Date
20260513
Application Date
20230712

Claims (20)

  1. 1. A cooler for power electronics, the cooler comprising: first mounting surfaces for first power electronics modules, respectively; second mounting surfaces for second power electronics modules, respectively, each of the first mounting surfaces being parallel to and overlapping a corresponding one of the second mounting surfaces; and coolant paths extending between an inlet and an outlet, the coolant paths providing parallel flows among the first and second mounting surfaces.
  2. 2. The cooler of claim 1, wherein each of the parallel flows initially abuts a first half of a first one of the first mounting surfaces, thereafter abuts a first half of a first one of the second mounting surfaces, thereafter abuts a second half of the first one of the second mounting surfaces, and thereafter abuts a second half of the first one of the first mounting surfaces.
  3. 3. The cooler of claim 2, wherein the inlet leads to an inlet manifold extending through a space between the first and second mounting surfaces, the inlet manifold positioned substantially at a center of the space.
  4. 4. The cooler of claim 3, wherein the outlet leads to an outlet manifold, the outlet manifold also extending through the space between the first and second mounting surfaces, the outlet manifold positioned adjacent the inlet manifold.
  5. 5. The cooler of claim 1, wherein the cooler has three instances of the first mounting surfaces and three instances of the second mounting surfaces.
  6. 6. The cooler of claim 1, further comprising first pin fin plates for the first mounting surfaces, respectively, and second pin fin plates for the second mounting surfaces, respectively.
  7. 7. The cooler of claim 1, wherein the cooler comprises a stack of laminates, the stack of laminates at least in part forming the first and second mounting surfaces, and the inlet and the outlet.
  8. 8. The cooler of claim 1, wherein the cooler comprises a first piece and a second piece, and wherein the first and second pieces are joined together to at least in part form: the first and second mounting surfaces, and the inlet and the outlet.
  9. 9. The cooler of claim 8, wherein each of the first and second pieces is molded.
  10. 10. The cooler of claim 8, wherein each of the first and second pieces is 3D printed.
  11. 11. The cooler of claim 8, wherein each of the first and second pieces is formed by vacuum infusion.
  12. 12. The cooler of claim 8, further comprising an adhesive at a joint between the first and second pieces.
  13. 13. The cooler of claim 8, further comprising a seal at a joint between the first and second pieces, and at least one bolt connection between the first and second pieces.
  14. 14. The cooler of claim 1, wherein the cooler comprises a first metal piece and a second metal piece, and wherein the first and second metal pieces are joined together to at least in part form: the first and second mounting surfaces, and the inlet and the outlet.
  15. 15. The cooler of claim 14, wherein the first and second metal pieces are cast.
  16. 16. The cooler of claim 14, wherein the first and second metal pieces are forged.
  17. 17. The cooler of claim 14, wherein the first and second metal pieces are 3D printed.
  18. 18. The cooler of claim 14, further comprising an adhesive at a joint between the first and second metal pieces.
  19. 19. The cooler of claim 14, further comprising a seal at a joint between the first and second metal pieces, and at least one bolt connection between the first and second metal pieces.
  20. 20. The cooler of claim 1, wherein the cooler is cast or molded as a single piece.

Description

COOLER FOR POWER ELECTRONICS CROSS-REFERENCE TO RELATED APPLICATION [0001] This application claims priority to U.S. Provisional Patent Application No. 63/373,773, filed on August 29, 2022, entitled “COOLER FOR POWER ELECTRONICS”, the disclosure of which is incorporated by reference herein in its entirety. TECHNICAL FIELD [0002] This document relates to a cooler for power electronics. BACKGROUND [0003] Power electronics are used in a variety of situations. In electric vehicles, they can be included in an inverter that converts direct current from a high-voltage battery pack into alternating current for powering a propulsion motor, or to feed energy recovered from the motor to the battery pack. Similarly, power electronics can be used in non-mobile energy storage systems, for example when serving as a power solution for a house or another building. Common to these examples of uses is that the power electronics generate heat that may need to be managed in some way. Moreover, space constraints can be a factor, such that more compact solutions for thermal control may be favorable. SUMMARY [0004] In an aspect, a cooler for power electronics comprises: first mounting surfaces for first power electronics modules, respectively; second mounting surfaces for second power electronics modules, respectively, each of the first mounting surfaces being parallel to and overlapping a corresponding one of the second mounting surfaces; and coolant paths extending between an inlet and an outlet, the coolant paths providing parallel flows among the first and second mounting surfaces. [0005] Implementations can include any or all of the following features. Each of the parallel flows initially abuts a first half of a first one of the first mounting surfaces, thereafter abuts a first half of a first one of the second mounting surfaces, thereafter abuts a second half of the first one of the second mounting surfaces, and thereafter abuts a second half of the first one of the first mounting surfaces. The inlet leads to an inlet manifold extending through a space between the first and second mounting surfaces, the inlet manifold positioned substantially at a center of the space. The outlet leads to an outlet manifold, the outlet manifold also extending through the space between the first and second mounting surfaces, the outlet manifold positioned adjacent the inlet manifold. The cooler has three instances of the first mounting surfaces and three instances of the second mounting surfaces. The cooler further comprises first pin fin plates for the first mounting surfaces, respectively, and second pin fin plates for the second mounting surfaces, respectively. The cooler comprises a stack of laminates, the stack of laminates at least in part forming the first and second mounting surfaces, and the inlet and the outlet. The cooler comprises a first piece and a second piece, and wherein the first and second pieces are joined together to at least in part form: the first and second mounting surfaces, and the inlet and the outlet. Each of the first and second pieces is molded. Each of the first and second pieces is 3D printed. Each of the first and second pieces is formed by vacuum infusion. The cooler further comprises an adhesive at a joint between the first and second pieces. The cooler further comprises a seal at a joint between the first and second pieces, and at least one bolt connection between the first and second pieces. The cooler comprises a first metal piece and a second metal piece, and wherein the first and second metal pieces are joined together to at least in part form: the first and second mounting surfaces, and the inlet and the outlet. The first and second metal pieces are cast. The first and second metal pieces are forged. The first and second metal pieces are 3D printed. The cooler further comprises an adhesive at a joint between the first and second metal pieces. The cooler further comprises a seal at a joint between the first and second metal pieces, and at least one bolt connection between the first and second metal pieces. The cooler is cast or molded as a single piece. BRIEF DESCRIPTION OF DRAWINGS [0006] FIG. 1 shows an example of a cooler for power electronics. [0007] FIG. 2 shows an example of a pin fin plate that can be used with a cooler. [0008] FIG. 3 shows an example of a cooler. [0009] FIG. 4 shows an example of assembling the cooler of FIG. 3. [0010] FIG. 5 shows an example of a fluid volume that can be defined by a cooler. [0011] FIG. 6 shows a side view of the fluid volume in FIG. 5. [0012] FIG. 7 shows a bottom view of another example of the fluid volume in FIG. 5 when pin fin plates are used. [0013] FIG. 8 shows a top view of the fluid volume in FIG. 7. [0014] FIG. 9 shows examples of relative temperature changes. [0015] FIG. 10 shows an example of a cooler manufactured by casting or molding. [0016] FIG. 11 shows an example of a cooler manufactured by lamination. [0017] Like reference symbols in the var