EP-4740702-A1 - INTERCONNECT CIRCUIT FOR PRINT COMPONENT

Abstract

An interconnect circuit may include a first portion including an electrical interconnect pad array to connect to the host controller, the electrical interconnect pad array including a first electrical interconnect pad on a first lateral side of the first portion, and a second electrical interconnect pad on a second lateral side of the first portion, a second portion separate from the first portion, including a contact pad array to connect to the integrated circuit, the contact pad array on the first surface the second portion including a first contact pad to connect to a fluid ejection device, a second contact pad to connect to the fluid ejection device, a first trace connecting the first electrical interconnect pad and first contact pad, and a second trace connecting the second electrical interconnect pad and second contact pad, where the first trace is configured to conduct a higher voltage than the second trace.

Inventors

• QUINN, MAX
• BAHNSEN, Kyle
• SCHWEITZER, PAUL
• CUMBIE, MICHAEL W.
• GARDNER, JAMES
• MCCOURT, Zachary T.
• STUMBO, Samuel

Assignees

• Hewlett-Packard Development Company, L.P.

Dates

Publication Date

20260513

Application Date

20230703

Claims (1)

1. Atty. Dkt. No.86256452 WHAT IS CLAIMED IS: 1. A flexible circuit to connect an integrated circuit of a print component to a host controller, the flexible circuit comprising: a first portion comprising an electrical interconnect pad array to connect to the host controller, the electrical interconnect pad array including: a first electrical interconnect pad on a first lateral side of the first portion; and a second electrical interconnect pad on a second lateral side of the first portion; a second portion separate from the first portion, including a contact pad array to connect to the integrated circuit, the contact pad array on the first surface the second portion including: a first contact pad to connect to a fluid ejection device; a second contact pad to connect to the fluid ejection device; a first trace connecting the first electrical interconnect pad to the first contact pad; and a second trace connecting the second electrical interconnect pad to the second contact pad, wherein the first trace is configured to conduct a higher voltage than the second trace., wherein the first electrical interconnect pad, the second electrical interconnect pad, the first contact pad, the second contact pad, the first trace, and the second trace are on a same surface of the flexible circuit. 2. The flexible circuit of claim 1, wherein the first electrical interconnect pad, the second electrical interconnect pad, the first contact pad, the second contact pad, the first trace, and the second trace are on a same surface of the flexible circuit. 3. The flexible circuit of claim 1 or claim 2, wherein the electrical interconnect pad array is provided in two parallel columns along two lateral sides of a center axis and equidistant from the center axis, one column on the first side and one column on the second side of the first portion. 4. The flexible circuit of any of claims 1-3, wherein a width of the electrical interconnect pad array is less than four times the width of the surface of a contact pad. 52 -7083-3774.1 Atty. Dkt. No.86256452 5. The flexible circuit of any of claims 1-4, wherein the corresponding traces extending at least partially parallel to the center axis and to each other in at least the first portion. 6. The flexible circuit of any of claims 1-5, wherein the parallel portion of the traces in the first portion extend at least partially between the interconnect pads. 7. The flexible circuit of any of claims 1-6, wherein the first electrical interconnect pad comprises at least one of: a high power supply, logic power that is lower than the high power supply, fire that is lower power than the high power supply, reset and/or ground, and wherein the at least one second electrical interconnect pad comprises at least one of a data, clock, mode and/or analog read pad. 8. The flexible circuit of any of claims 1-7, wherein the first trace is wider than the second trace. 9. The flexible circuit of any of claims 1-8, wherein the first trace is to deliver power to the fluid ejection device to drive fluid ejection. 10. The flexible circuit of any of claims 1-9, wherein the second trace is an analog reading trace to communicate analog values corresponding to data and/or to at least one sensed characteristic of the fluid ejection device. 11. The flexible circuit of any of claims 1-10, wherein the first trace and the second trace include at least one chamfered corner. 12. The flexible circuit of any of claims 1-11, wherein the fluid ejection device is configured to transmit analog data signals to the host controller. 13. The flexible circuit of any of claims 1-12, wherein the fluid ejection device comprises drop generators to eject fluid. 14. A flexible circuit comprising: a first portion including: 53 -7083-3774.1 Atty. Dkt. No.86256452 a first electrical interconnect pad on a first lateral side of the first portion; a second electrical interconnect pad on a second lateral side of the first portion; and a third electrical interconnect pad on the first lateral side of the first portion; a second portion including: a first contact pad to connect to a fluid ejection device; a second contact pad to connect to the fluid ejection device; and a third contact pad to connect to the fluid ejection device; a first trace connecting the first electrical interconnect pad to the first contact pad; a second trace connecting the second electrical interconnect pad to the second contact pad, the second trace separated from the first trace by a first distance; and a third trace connecting the third electrical interconnect pad to the third contact pad, the third trace separated from the first trace by a second distance, wherein the first distance is greater than the second distance. 15. The flexible circuit of claim 14, wherein the first trace is configured to receive a higher voltage than the second trace. 16. The flexible circuit of claim 14 or claim 15, wherein the first trace is wider than the second trace. 17. The flexible circuit of any of claims 14-16, wherein the first trace is to deliver power to the fluid ejection device to drive fluid ejection. 18. The flexible circuit of any of claims 14-17, wherein the second trace is an analog reading trace to communicate analog values corresponding to data and/or to at least one sensed characteristic of the fluid ejection device. 19. The flexible circuit of any of claims 14-18, wherein the third trace is to control a data transfer mode of the fluid ejection device. 20. The flexible circuit of any of claims 14-19, wherein the first distance is greater than or equal to two times the second distance. 54 -7083-3774.1 Atty. Dkt. No.86256452 21. The flexible circuit of any of claims 14-20, wherein the first trace, the second trace, and the third trace include at least one chamfered corner. 22. The flexible circuit of any of claims 1-21, wherein the second contact pad is closer to a distal edge of the second portion than the first contact pad. 23. A thin circuit to attach to a print component that is replaceable with respect to a host printer, the thin circuit comprising: an insulative support structure; an electrical interconnect pad array to enable the replaceable component to communicate with a host printer circuit; the electrical interconnect pad array consisting of two parallel columns at each side of a center axis, each column comprising a plurality of pads, the columns at opposite sides of an axis; wherein a first column of the two parallel columns includes pads to conduct higher energy signals including a high power supply pad, a logic pad lower than the high power supply pad, a fire pad that is lower power than the high power supply pad, a reset pad, and/or a ground pad; a second column of the two parallel columns includes pads to conduct lower energy signals, which energy is lower than the higher energy signals, the pads including a data pad, a clock pad, a mode pad, and/or an analog reading signal pad; and parallel routings extending from the electrical interconnect pad array to connect to an integrated circuit of the component. 24. The thin circuit of claim 23, further comprising parallel routings extending from the electrical interconnect pad array to connect to an integrated circuit of the component. 25. The thin circuit of claim 23 or claim 24, wherein the first column includes: a first higher energy electrical interconnect pad to conduct a voltage greater than 4 VDC, and/or a second higher energy electrical interconnect pad to conduct a voltage greater than 10 VDC, and wherein the second column includes: 55 -7083-3774.1 Atty. Dkt. No.86256452 a first lower energy electrical interconnect pad to transmit a logic low value of approximately 0 V and a logic high value of approximately 3.3 V, and/or a second lower energy electrical interconnect pad that transmits analog voltage values between 0 and 3.3 V. 26. The thin circuit of any of claims 23-25, wherein the first column includes at least one lower energy electrical interconnect pad to transmit a logic low value of approximately 0 V value and a logic high value of approximately 3.3 V, and/or the second column includes a plurality of lower energy electrical interconnect pads to transmit a logic low value of approximately 0 V and a logic high value of approximately 3.3 V. 27. The thin circuit of any of claims 23-26, wherein the integrated circuit is configured to transmit memory and/or analog values using lower energy signals over the lower energy pads, in response to instruction signals over the lower energy pads. 28. The thin circuit of any of claims 23-27, wherein the integrated circuit comprises a fluid ejection device to eject fluid based on the lower energy and higher energy signals. 29. The thin circuit of any of claims 23-28, wherein the thin circuit is a flexible circuit or a thin printed circuit board (PCB). 30. The thin circuit of any of claims 23-29, wherein the integrated circuit comprises a fluid ejection device or a replacement memory device for a fluid ejection device. 31. The thin circuit of any of claims 23-30, wherein a first distance between a power routing of the parallel routings and an analog reading signal routing of the parallel routings is greater than a second distance between the analogue reading signal routing and a mode routing of the parallel routings. 32. The thin circuit of claim 30, wherein the first distance is greater than or equal to two times the second distance. 56 -7083-3774.1 Atty. Dkt. No.86256452 33. The thin circuit of any of claims 23-32, wherein the parallel routings include at least one chamfered corner. 34. A fluid ejection device assembly comprising: a fluid ejection device; and the flexible circuit of any of claims 1-22. 35. A fluid ejection device assembly comprising: a fluid ejection device; and the thin circuit of any of claims 23-33. 57 -7083-3774.1

Description

Atty. Dkt. No.86256452 INTERCONNECT CIRCUIT FOR PRINT COMPONENT BACKGROUND [0001] Inkjet printing involves depositing ink onto a surface, such as sheet of paper. Print fluid can be stored in a print fluid reservoir until it is used for printing. Print dies may dispense the print fluid for printing. An interconnect circuit may interface with a printer control interface and the print dies. BRIEF DESCRIPTION OF THE DRAWINGS [0002] FIG.1 illustrates a perspective view of an example print component. [0003] FIG.2 illustrates an exploded view of the print component of FIG.1. [0004] FIG.3 illustrates a front view of the print component of FIG.1. [0005] FIG.4 illustrates a fluidic structure assembly including the fluidic structure, the fluid ejection device, and the interconnect circuit, as used in FIG.1. [0006] FIG.5 illustrates the interconnect circuit of FIG.1. [0007] FIG.6 illustrates an example fluidic structure assembly including a fluidic structure, a print component having one fluid ejection die, and an interconnect circuit. [0008] FIG.7 is a block diagram of an example interconnect circuit. [0009] FIG.8 is a block diagram of an example print component. [0010] FIG.9 is a block diagram of an example print component including at least one bond. [0011] FIG. 10 illustrates the contact pads on a north portion of the interconnect circuit of FIG.1. [0012] FIG. 11 illustrates the contact pads on a north portion of the interconnect circuit of FIG.6. 1 4895-7083-3774.1 Atty. Dkt. No.86256452 [0013] FIG.12 illustrates example bond wires to connect contact pads to fluid ejection dies. [0014] FIG.13 illustrates the interconnect circuit of FIG.6 attached to a molded body. [0015] FIG.14 illustrates a portion of the interconnect circuit of FIG.1 including the tooling hole. [0016] FIG.15 illustrates a cross-section of an example interconnect circuit. [0017] FIG.16 illustrates an exploded view of the fluidic structure assembly of FIG.6. [0018] FIG.17 illustrates an exploded view of the fluidic structure assembly of FIG.1. [0019] FIG.18 is a block diagram of an example interconnect circuit. [0020] FIG.19 is a block diagram of an example fluid ejection device assembly including the interconnect circuit of FIG.18. [0021] FIG.20 is a block diagram of an example interconnect circuit. [0022] FIG. 21 is a block diagram of an example flexible circuit including a metal plating and a protective layer. [0023] FIG.22 illustrates the south end of the fluidic structure assembly of FIG.4. [0024] FIG.23 illustrates a close-up of a portion of FIG.22. [0025] FIG.24 illustrates the north end of the fluidic structure assembly of FIG.4. [0026] FIG.25 illustrates a close-up of a portion of FIG.24. [0027] FIG.26 is a block diagram of an example interconnect circuit. [0028] The foregoing and other features of the present disclosure will become apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. Understanding that these drawings depict only several examples in accordance with the disclosure and are therefore, not to be considered limiting of its scope, the disclosure 2 4895-7083-3774.1 Atty. Dkt. No.86256452 will be described with additional specificity and detail through use of the accompanying drawings. DETAILED DESCRIPTION [0029] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative examples described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here. It will be readily understood that the aspects of the present disclosure, as generally described herein, and illustrated in the figures, can be arranged, substituted, combined, and designed in a wide variety of different configurations, all of which are explicitly contemplated and made part of this disclosure. [0030] This disclosure relates to print components. A print component may be any component for print systems, such as an exchangeable print cartridge, or a component of a cartridge such as a fluid ejection device (e.g., printhead) or other integrated circuit associated with a cartridge. A print component may include a print component for dispensing print fluid and a reservoir for storing the print fluid. The print fluid may include any 2D or 3D print agent including ink for printing on a medium such as paper (2D) or (e.g., powdered) build material (3D). The print fluid may include dispensable fluid to be dispensed at relatively high precision (as to volume and/or location) for fields of implementation other that 2D or 3D imaging, including but not limited to forensic, laboratory or pharmaceutical applications. [0031] FIG. 1 illustrates a perspective view of an example print com