Search

EP-4740708-A1 - HEAT DISSIPATION ASSEMBLY FOR COMMUNICATION DEVICE

EP4740708A1EP 4740708 A1EP4740708 A1EP 4740708A1EP-4740708-A1

Abstract

The present invention provides a heat dissipation assembly (100) for a communication device (102), comprising: one or more bottom heat sinks (104); one or more Phased Array Antenna module (PAAM) (106); and at least one heat dissipation plate assembly (108) in connection with at least one baseband printed circuit board (PCB) (110) of the communication device (102), wherein the at least one heat dissipation plate assembly (108) comprises: one or more heat dissipation plates (112); one or more heat dissipation tubes (114) and one or more pedestals (116).

Inventors

  • SHAH, BRIJESH
  • BHATNAGAR, AAYUSH
  • BHATNAGAR, PRADEEP KUMAR
  • Verma, Vijay Mohan
  • MULLA, Lalesa
  • SINGH, BAJINDER PAL
  • GUPTA, SUMIT

Assignees

  • Jio Platforms Limited

Dates

Publication Date
20260513
Application Date
20240612

Claims (7)

  1. 1. A heat dissipation assembly (100) for a communication device (102), comprising: one or more bottom heat sinks (104); one or more Phased Array Antenna module (PAAM) (106); and at least one heat dissipation plate assembly (108) in connection with at least one baseband printed circuit board (PCB) ( 110) of the communication device ( 102), wherein the at least one heat dissipation plate assembly (108) comprises: ■ one or more heat dissipation plates (112); ■ one or more heat dissipation tubes (114), and ■ one or more pedestals (116).
  2. 2. The heat dissipation assembly (100) as claimed in claim 1, wherein the at least one heat dissipation plate assembly (108) is configured to conduct a heat generated by the one or more PAAMs (106) to the one or more bottom heat sinks (104).
  3. 3. The heat dissipation assembly (100) as claimed in claim 1, wherein each of the one or more bottom heat sinks (104) is configured to dissipate heat associated with the at least one baseband PCB (110) and the one or more PAAMs (106).
  4. 4. The heat dissipation assembly ( 100) as claimed in claim 1 , wherein the one or more pedestals (116) is configured to facilitate a predetermined space between the at least one heat dissipation plate assembly (108) and the at least one baseband PCB (110).
  5. 5. The heat dissipation assembly (100) as claimed in claim 1, wherein the one or more PAAMs (106) is integrated on a side of the one or more heat dissipation plates (112), and wherein the one or more heat dissipation plates (112) is further connected to the one or more bottom heat sinks (104).
  6. 6. The heat dissipation assembly (100) as claimed in claim 1, wherein the one or more heat dissipation plates (112) is mounted on the one or more bottom heat sinks (104) via one or more spacers (118).
  7. 7. The heat dissipation assembly (100) as claimed in claim 1, wherein the one or more heat dissipation tubes (114) are embedded in the one or more heat dissipation plates (112).

Description

HEAT DISSIPATION ASSEMBLY FOR COMMUNICATION DEVICE FIELD OF THE INVENTION [0001] The present invention generally relates to technologies for enhancing functioning of an antenna module of a wireless communication system. In particular, the present invention relates to effective dissipation of heat generated during operation of an antenna module of a wireless communication system. BACKGROUND OF THE INVENTION [0002] The following description of related art is intended to provide background information pertaining to the field of the invention. This section may include certain aspects of the art that may be related to various features of the present invention. However, it should be appreciated that this section be used only to enhance the understanding of the reader with respect to the present invention, and not as admissions of prior art. [0003] Currently, as the advanced communication technology is being deployed such as a fifth generation (5G) communication technology, promising faster data speeds, low latency, and the ability to connect multiple devices simultaneously. In these technologies, communication devices have started to utilize higher communication bands in order to support higher data-flow rates. In order to achieve higher data-flow rates, 5G communication systems utilize spectrum in millimetre wave (mm-Wave) bands (24-86 GHz). In the 5G mm-Wave products, the heat generation of the Phased Array Antenna Module (PAAM) is in the range of 30 to 60W, as it includes the RF front end (Up-convertor, Down-Convertor, Power Amplifier, LNA and mixers) integrated into a small module. Moreover, the 5G communication systems utilizing the mm-Wave band have short wavelengths in the range of 1-10 mm, and in order to achieve the same, Phased Array Antenna Module (PAAM) are required to be mounted either within or near surface of the communication devices to allow the communication devices to work in an efficient manner and allowing maximum PAAM performance. [0004] These communication devices are configured to equip multiple PAAMs configurations to allow these communication devices to accommodate multiple transmit and receive antennas to exploit multipath propagation, particularly in the mm-Wave bands. The communication devices utilized to provide 5G communication are implemented for higher data-flow rates and faster communication performance. However, the higher data-flow rates and faster communication performance leads to extensive heat generation. Since, the placement of the PAAMs is close to the communication devices, the extensive heat generation can lead to device shutdown, system failure, equipment damage, PAAMs reaching their thermal specification limits in a short amount of time, disrupted communication, and the like. [0005] There is, therefore, a requirement in the art for a way to provide effective heat dissipation for an antenna module of a wireless communication device without significantly affecting the signal transmission characteristics of the antenna module. OBJECTS OF THE INVENTION [0006] Some of the objects of the present invention, which at least one embodiment disclosed herein satisfies are listed herein below. [0007] An object of the present invention is to provide an effective heat dissipating means for an antenna module of a wireless communication device. [0008] Another object of the present invention is to provide an effective heat dissipating means that can be implemented in millimetre -wave antenna modules. [0009] Another object of the present invention is to provide a heat dissipating means that does not require significant energy for its operation. [0010] Yet another object of the present invention is to provide a heat dissipating means that does not require additional material resources. [0011] Another object of the present invention is to provide a heat dissipating means that is lightweight and cost-effective. [0012] Yet another object of the present invention is to provide a heat dissipating mechanism that does not significantly affect the signal transmission performance of the antenna module of the wireless communication device. SUMMARY OF THE INVENTION [0013] This section is provided to introduce certain implementations of the present invention in a simplified form that are further described below in the detailed description. This summary is not intended to identify the key features or the scope of the claimed subject matter. [0014] In an aspect of the present invention, there is provided a heat dissipation assembly for a communication device, comprising: one or more bottom heat sinks; one or more Phased Array Antenna module (PAAM); and at least one heat dissipation plate assembly in connection with at least one baseband printed circuit board (PCB) of the communication device, wherein the at least one heat dissipation plate assembly comprises: one or more heat dissipation plates; one or more heat dissipation tubes; and one or more pedestals. [0015] In an aspect of the present inven