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EP-4741165-A1 - LIQUID DISCHARGE HEAD, HEAD MODULE, AND LIQUID DISCHARGE APPARATUS

EP4741165A1EP 4741165 A1EP4741165 A1EP 4741165A1EP-4741165-A1

Abstract

A liquid discharge head (1) includes: a substrate component (10) including: a nozzle (24) to discharge a liquid; a channel (21a, 21b) communicating with the nozzle (24); and a frame (5) bonded to the substrate component with an adhesive in a lamination direction, the frame including a communicating portion (20a, 20b) communicating with the channel. The frame (5) and the substrate component have: a bonding region (9a) in which the frame (5) and the substrate component (10) are bonded with the adhesive; and a non-bonding region (9b) in which the frame (5) and the substrate component (10) are not bonded with the adhesive. The bonding region (9a) has: a first bonding region around the communicating portion (20a, 20b) of the frame (5); and a second bonding region at both end portions of the frame (5) in a longitudinal direction of the frame orthogonal to the lamination direction.

Inventors

  • WATANABE, YU

Assignees

  • Ricoh Company, Ltd.

Dates

Publication Date
20260513
Application Date
20250923

Claims (15)

  1. A liquid discharge head (1) comprising: a substrate component (10) including: a nozzle (24) to discharge a liquid; a channel (21a, 21b) communicating with the nozzle (24); and a frame (5) bonded to the substrate component with an adhesive in a lamination direction, the frame including a communicating portion (20a, 20b) communicating with the channel, wherein the frame (5) and the substrate component have: a bonding region (9a) in which the frame (5) and the substrate component (10) are bonded with the adhesive; and a non-bonding region (9b) in which the frame (5) and the substrate component (10) are not bonded with the adhesive, the bonding region (9a) has: a first bonding region around the communicating portion (20a, 20b) of the frame (5); and a second bonding region at both end portions of the frame (5) in a longitudinal direction of the frame orthogonal to the lamination direction, and the non-bonding region (9b) has a hollow portion between the end portions of the frame (5).
  2. The liquid discharge head (1) according to claim 1, wherein the non-bonding region (9b) has the hollow portion at a central portion of the frame (5) between the both end portions of the second bonding region of the frame (5) in the longitudinal direction.
  3. The liquid discharge head (1) according to claim 2, wherein the non-bonding region (9b) includes multiple communicating portions (20a, 20b) including the communicating portion (20a, 20b), the hollow portion of the non-bonding region (9b) is disposed between the multiple communicating portions (20a, 20b) in a transverse direction orthogonal to each of the longitudinal direction and the lamination direction, and the non-bonding region (9b) has an area larger than an area of the bonding region (9a) in the central portion of the frame (5) in the longitudinal direction.
  4. The liquid discharge head (1) according to any one of claims 2 to 3, wherein the first bonding region and the second bonding region are discontinuous.
  5. The liquid discharge head (1) according to any one of claims 1 to 4, wherein the substrate component (10) includes an actuator substrate including a piezoelectric element (23) in a piezoelectric-element arrangement region, and the first bonding region overlaps a part of an end portion of the piezoelectric-element arrangement region in the longitudinal direction in a cross section of the liquid discharge head (1) in the lamination direction.
  6. The liquid discharge head (1) according to any one of claims 1, 2, 4 or 5, wherein the non-bonding region (9b) includes multiple communicating portions (20a, 20b) including the communicating portion (20a, 20b), the multiple communicating portions are on both sides of the frame in a transverse direction orthogonal to each of the longitudinal direction and the lamination direction, in a central portion of the frame (5) in the longitudinal direction, the hollow portion of the non-bonding region (9b) is disposed between the multiple communicating portions (20a, 20b) in the transverse direction, and the bonding region includes: multiple first bonding regions, including the first bonding region (9a-2), at both ends of the frame in the transverse direction; and a third bonding region: connecting the multiple first bonding regions (9a-2) across the hollow portion in the transverse direction; and partitioning the hollow portion into multiple non-bonding regions.
  7. The liquid discharge head (1) according to any one of claims 1 to 6, wherein the frame has a groove portion (15) facing the non-bonding region of the frame (5).
  8. The liquid discharge head (1) according to any one of claims 1 to 6, wherein the frame has a through hole (16) facing the non-bonding region of the frame (5).
  9. The liquid discharge head (1) according to any one of claims 1 to 8, wherein the substrate component has a linear expansion coefficient smaller than that of the frame (5).
  10. The liquid discharge head (1) according to any one of claims 1 to 9, wherein the substrate component is formed with a member including silicon.
  11. The liquid discharge head (1) according to any one of claims 1 to 10, wherein the adhesive includes a thermosetting resin, and the adhesive has a linear expansion coefficient larger than that of the substrate component.
  12. The liquid discharge head (1) according to any one of claims 1 to 11, wherein the adhesive has a Young's modulus after curing of 2 GPa or more.
  13. Ahead module (100) comprising multiple liquid discharge heads (1) including the liquid discharge head (1) according to any one of claims 1 to 12.
  14. A liquid discharge apparatus comprising: the liquid discharge head (1) according to any one of claims 1 to 12, and a holder holding the liquid discharge head (1).
  15. A liquid discharge apparatus comprising: the head module (100) according to claim 13; and a holder holding the head module (100).

Description

BACKGROUND Technical Field The present embodiment relates to a liquid discharge head, a head module, and a liquid discharge apparatus. Related Art In related art, there has been known a liquid discharge head including a substrate component including at least a nozzle for discharging liquid, a channel communicating with the nozzle, and a piezoelectric element, and a frame including a communicating portion communicating with the channel and bonded to the substrate component with an adhesive. In Japanese Patent No. 4735819, the liquid discharge head has a bonding region in which a head case is bonded with an adhesive and a non-bonding region in which the head case is not bonded with an adhesive. The bonding region and the non-bonding region are provided between a head body that is a substrate component and a head case that is a frame. In addition, a potting agent flows into a portion of the non-bonding region between the head body and the head case, and the head case is bonded to the head body also by the potting agent flowing into the non-bonding region. The potting agent fills an opening provided in the head case and protects a drive IC that drives a piezoelectric element. However, there is a possibility that liquid discharging performance may be deteriorated. SUMMARY The present disclosure described herein provides a liquid discharge head including: a substrate component includes: a nozzle to discharge a liquid; a channel communicating with the nozzle; and a frame bonded to the substrate component with an adhesive in a lamination direction, the frame including a communicating portion communicating with the channel. The frame and the substrate component have: a bonding region in which the frame and the substrate component are bonded with the adhesive; and a non-bonding region in which the frame and the substrate component are not bonded with the adhesive. The bonding region has: a first bonding region around the communicating portion of the frame; and a second bonding region at both end portions of the frame in a longitudinal direction of the frame orthogonal to the lamination direction, and the non-bonding region has a hollow portion between the end portions of the frame. According to the present embodiment, it is possible to satisfactorily suppress deterioration of liquid discharging performance. BRIEF DESCRIPTIONS OF THE DRAWINGS A more complete appreciation of embodiments of the present disclosure and many of the attendant advantages and features thereof can be readily obtained and understood from the following detailed description with reference to the accompanying drawings, wherein: FIG. 1 is an external perspective explanatory view of a liquid discharge head according to the present embodiment;FIG. 2 is a view for explaining bonding between a MEMS component and a frame in the present embodiment;FIG. 3A is a perspective view illustrating a bonding region in a comparative example;FIG. 3B is a cross-sectional view taken along a line A-A in FIG. 3A;FIG. 3C is a view illustrating a stress distribution in a nozzle forming region of a MEMS component in the comparative example;FIGS. 4A and 4B are views for explaining bonding of the frame and the MEMS component according to the present embodiment;FIG. 5A is a perspective view illustrating a bonding region of the present embodiment;FIG. 5B is a cross-sectional view taken along a line B-B of FIG. 5A;FIG. 5C is a view illustrating a stress distribution in a nozzle forming region of the MEMS component in the present embodiment;FIG. 6 is a view for explaining an example in which a non-bonding region is divided into a plurality of regions with the bonding region;FIG. 7 is a view for explaining an example in which a bonding region at an end portion in a longitudinal direction and a bonding region around a common supply main channel and a common collection main channel are discontinuous;FIGS. 8A and 8B are views for explaining an example in which a groove portion is formed at a position corresponding to a non-bonding region of the frame;FIGS. 9A and 9B are views for explaining an example in which a portion corresponding to a non-bonding region of the frame is opened;FIG. 10 is an exploded perspective explanatory view of a head module of the present embodiment;FIG. 11 is an exploded perspective explanatory view of the head module according to the present embodiment as viewed from a nozzle face side;FIG. 12 is a schematic explanatory view of a printer according to the present embodiment;FIG. 13 is a plan explanatory view of an example of a head unit of the printer;FIG. 14 is a plan explanatory view of a main portion of an example of the printer;FIG. 15 is a side explanatory view of the main portion of an example of the printer;FIG. 16 is a plan explanatory view of the main portion of an example of a liquid discharge unit; andFIG. 17 is a front explanatory view of an example of the liquid discharge unit according to the present embodiment. The accompanying drawings are i