EP-4741526-A1 - WIRE ROD DEPOSITION DEVICE

Abstract

The present invention relates to a wire rod deposition device including a plurality of roller parts which move a wire rod wound thereon, a heater part that is intensively heats the wire rod passing over the roller parts, a cathode part that provides a deposition material to the wire rod, and an attachment preventing part that covers an outside of the wire rod except for a deposition space of the wire rod and prevents attachment of scattered particles.

Inventors

• KIM, DONG JIN

Assignees

• Maru L&C Co., Ltd.

Dates

Publication Date

20260513

Application Date

20231121

Claims (8)

1. A wire rod deposition device comprising: a plurality of roller parts which move a wire rod wound thereon; a heater part configured to intensively heat the wire rod passing over the roller parts; a cathode part configured to provide a deposition material onto the wire rod; and an attachment preventing part configured to cover an outside of the wire rod except for a deposition space of the wire rod and prevent attachment of scattered particles.
2. The wire rod deposition device of claim 1, wherein the heater part includes: a first heater portion disposed above the wire rod and heated when power is applied thereto; and one or more first heat blocking portions configured to cover the first heater portion such that only a lower portion thereof under the first heater portion is open to emit heat.
3. The wire rod deposition device of claim 1, wherein the heater part includes: a second heater portion disposed above the wire rod and heated as a lamp is turned on when power is applied thereto; a second reflective portion configured to cover the second heater portion such that only a lower portion thereof under the second heater portion is open and reflect heat generated by the second heater portion; and a second cooling portion that is in contact with the second reflective portion and cools the second reflective portion as a coolant flows therethrough.
4. The wire rod deposition device of claim 1, wherein the heater part includes: an upper heater portion disposed above the wire rod and configured to generate heat; an upper reflective portion configured to cover the upper heater portion such that only a lower portion thereof under the upper heater portion is open and reflect heat generated by the upper heater portion; an upper cooling portion configured to cool the upper reflective portion; a lower heat blocking portion disposed between the wire rod and the cathode part and configured to induce heat to be focused on the wire rod; and a lower cooling portion configured to cool the lower heat blocking portion.
5. The wire rod deposition device of claim 4, wherein the lower heat blocking portion includes: a plurality of heat blocking center portions that have through-hole portions formed in centers thereof and are stacked on the lower cooling portion; and a plurality of heat blocking side portions configured to cover edges of the heat blocking center portions.
6. The wire rod deposition device of claim 5, wherein the heat blocking center portion includes: a center plate portion having the through-hole portion formed at a center thereof; a plurality of center fixing hole portions formed in the center plate portion; and a center support portion mounted on the lower cooling portion through the center fixing hole portions and configured to support the center plate portion.
7. The wire rod deposition device of claim 6, wherein the center support portion fixes a center of the center plate portion, and wherein the center fixing hole portion has a rectangular hole shape of which a length increases from the center to an end portion of the center plate portion.
8. The wire rod deposition device of claim 1, further comprising a cooling part disposed between the heater part and the roller part and configured to cool the wire rod while in direct contact with the wire rod.

Description

[Technical Field] The present invention relates to a wire rod deposition device, and more particularly, to a wire rod deposition device that allows materials to reach a wire rod surface in a set area and obtain high thin film quality while having a certain orientation. [Background Art] Generally, as expectations for the commercialization of superconducting application technologies using high-temperature superconductors increase, R&D for high-temperature superconducting wire rods is actively conducted worldwide. Methods of manufacturing the high-temperature superconducting wire rods include a first generation high-temperature superconducting wire rod manufacturing method using a powder-in-tube (PIT) process of filling a precursor powder into an Ag pipe and processing the precursor powder, and a second generation high-temperature superconducting wire rod manufacturing method of manufacturing a high-temperature superconducting wire rod called a coated conductor (CC). The CC, which is a second generation high-temperature superconducting wire rod, is being researched and developed by many research institutes and companies around the world, is manufactured using various methods, and has a more complex multi-layer structure than the first generation high-temperature superconducting wire rod. Meanwhile, in the related art, in a process of heating the wire rod at a high temperature, a roller on which the wire rod is wound is damaged, and thus wire rod deposition defects frequently occur. Therefore, it is required to solve this problem. The background technology of the present invention is disclosed in Korean Patent No. 10-0910613 (registered on July 28, 2009, Title of Invention: Apparatus for continuous fabrication of superconducting tapes). [Disclosure] [Technical Problem] The present invention is created to solve the above problems, and the present invention is directed to providing a wire rod deposition device that allows materials to reach a wire rod surface in a set area and obtain high thin film quality while having a certain orientation. [Technical Solution] A wire rod deposition device according to the present invention includes a plurality of roller parts which move a wire rod wound thereon, a heater part that intensively heats the wire rod passing over the roller parts, a cathode part that provides a deposition material to the wire rod, and an attachment preventing part that covers an outside of the wire rod except for a deposition space of the wire rod and prevents attachment of scattered particles. The heater part may include a first heater portion disposed above the wire rod and heated when power is applied thereto, and one or more first heat blocking portions that cover the first heater portion such that only a lower portion thereof under the first heater portion is open to emit heat. The heater part may include a second heater portion disposed above the wire rod and heated as a lamp is turned on when power is applied thereto, a second reflective portion that covers the second heater portion such that only a lower portion thereof under the second heater portion is open and reflects heat generated by the second heater portion, and a second cooling portion that is in contact with the second reflective portion and cools the second reflective portion as a coolant flows therethrough. The heater part may include an upper heater portion that is disposed above the wire rod and generates heat, an upper reflective portion that covers the upper heater portion such that only a lower portion thereof under the upper heater portion is open and reflects heat generated by the upper heater portion, an upper cooling portion that cools the upper reflective portion, a lower heat blocking portion that is disposed between the wire rod and the cathode part and induces heat to be focused on the wire rod, and a lower cooling portion that cools the lower heat blocking portion. The lower heat blocking portion may include a plurality of heat blocking center portions that have through-hole portions formed in centers thereof and are stacked on the lower cooling portion, and a plurality of heat blocking side portions that cover edges of the heat blocking center portions. The heat blocking center portion may include a center plate portion having the through-hole portion formed at a center thereof, a plurality of center fixing hole portions formed in the center plate portion, and a center support portion that is mounted on the lower cooling portion through the center fixing hole portions and supports the center plate portion. The center support portion may fix a center of the center plate portion, and the center fixing hole portion may have a rectangular hole shape of which a length increases from the center to an end portion of the center plate portion. The wire rod deposition device according to the present invention may further include a cooling part that is disposed between the heater part and the roller part and cools the wire rod