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EP-4741997-A2 - ELECTRONIC DEVICE ASSEMBLY, EXPANSION COMPONENT THEREOF, AND HEAT DISSIPATION MODULE

EP4741997A2EP 4741997 A2EP4741997 A2EP 4741997A2EP-4741997-A2

Abstract

A heat dissipation module (30) includes a diversion case (33) and a fan (31). The diversion case (33) includes an input section (331), an output section (332), and a connecting section (333) that connects the input section (331) and the output section (332), where an angle is defined between an extending direction of the input section (331) and an extending direction of the output section (332), and an end of the input section (331) away from the connecting section (333) and an end of the output section (332) away from the connecting section (333) are respectively inclined relative to the connecting section (333). The fan (31) is accommodated in the connecting section (333). An electronic device assembly includes an expansion component (E1) and the heat dissipation module (30).

Inventors

  • YANG, JUI-LIN
  • HSU, WAN-LIN
  • CHOU, HSIN-CHIH
  • LEE, KUN-CHENG
  • CHANG, JUEI-CHI

Assignees

  • Getac Technology Corporation

Dates

Publication Date
20260513
Application Date
20230207

Claims (15)

  1. A heat dissipation module (30), comprising: a diversion case (33), comprising an input section (331), an output section (332), and a connecting section (333) that connects the input section (331) and the output section (332), wherein an angle is defined between an extending direction of the input section (331) and an extending direction of the output section (332), and an end of the input section (331) away from the connecting section (333) and an end of the output section (332) away from the connecting section (333) are respectively inclined relative to the connecting section (333); and a fan (31), accommodated in the connecting section (333).
  2. The heat dissipation module (30) according to claim 1, wherein the diversion case (33) comprises an edge (334) and an inner surface (335), the edge (334) surrounds and forms an opening (3341), the output section (332) comprises a first heat dissipation section (3321) and a second heat dissipation section (3322), the inner surface (335) has a first height (L1) between the first heat dissipation section (3321) and the opening (3341), the inner surface (335) has a second height (L2) between the second heat dissipation section (3322) and the opening (3341), and the first height (L1) is different from the second height (L2).
  3. The heat dissipation module (30) according to claim 2, wherein the first heat dissipation section (3321) is farther away from the fan (31) than the second heat dissipation section (3322), and the first height (L1) is less than the second height (L2).
  4. The heat dissipation module (30) according to claim 2 or 3, wherein the output section (332) further comprises a third heat dissipation section (3323), the inner surface (335) has a third height (L3) between the third heat dissipation section (3323) and the opening (3341), and the third height (L3) is different from the first height (L1) and the second height (L2).
  5. The heat dissipation module (30) according to claim 4, wherein the third heat dissipation section (3323) is flush with the fan (31), and the third height (L3) is greater than the first height (L1) and less than the second height (L2).
  6. The heat dissipation module (30) according to claim 2, wherein the input section (331) of the diversion case (33) comprises an inlet section (3311), the inlet section (3311) has a first end (3313) and a second end (3314), the second end (3314) is closer to the fan (31) than the first end (3313), and a height of the inner surface (335) from the second end (3314) to the opening (3341) is greater than a height of the inner surface (335) from the first end (3313) to the opening (3341).
  7. The heat dissipation module (30) according to claim 6, wherein the input section (331) of the diversion case (33) further comprises a collecting section (3312), the collecting section (3312) is located between the inlet section (3311) and the fan (31), the inner surface (335) has the second height (L2) from the collecting section (3312) to the opening (3341).
  8. The heat dissipation module (30) according to claim 2, wherein the fan (31) comprises a case (311), the case (311) is provided with an air inlet (3111) and an air outlet (3112) that are perpendicular to each other, the air inlet (3111) faces toward the inner surface (335) and is spaced apart from the inner surface (335) by a distance, and the air outlet (3112) faces toward the output section (332).
  9. An expansion component (E1), comprising: a case (H, H1), comprising a bottom plate (H12), a top plate (H11), and an accommodating space (S) located between the bottom plate (H12) and the top plate (H11); a partition (10), arranged in the accommodating space (S) and parallel to the bottom plate (H12), wherein the partition (10) divides the accommodating space (S) into an upper compartment (S11) and a lower compartment (S12); a plurality of electronic components (A), scattered in the upper compartment (S11) and the lower compartment (S12), wherein one of the electronic components (A) located in the upper compartment (S11) abuts against the partition (10); and the heat dissipation module (30) according to any one of claims 1 to 8, arranged in the case (H, H1) and wherein: the input section (331) and the output section (332) are connected to form an L-shape, wherein the diversion case (33) is accommodated in the lower compartment (S12) and fixed to the bottom plate (H12), and the output section (332) abuts against the partition (10) and one of the electronic components (A) located in the lower compartment (S12); and wherein the fan (31) is arranged at a junction of the input section (331) and the output section (332).
  10. The expansion component (E1) according to claim 9, wherein the bottom plate (H12) comprises a plurality of through holes (H121), the edge (334) abuts against the bottom plate (H12), and the opening (3341) covers the through holes (H121), wherein the through holes (H121) comprise a plurality of first through holes (H1211) and a plurality of second through holes (H1212), the first through holes (H1211) correspond to a position of the input section (331), and the second through holes (H1212) correspond to a position of the output section (332).
  11. The expansion component (E1) according to claim 9, wherein the inner surface (335) faces toward the bottom plate (H12), the first heat dissipation section (3321) abuts against the electronic component (A) located in the lower compartment (S12), and the second heat dissipation section (3322) abuts against a position at which the partition (10) corresponds to the electronic component (A) located in the upper compartment (S11).
  12. The expansion component (E1) according to claim 9 or 11, wherein the inner surface (335) is inclined to the bottom plate (H12) in an extending direction between the first heat dissipation section (3321) and the second heat dissipation section (3322).
  13. The expansion component (E1) according to claim 9, wherein the third heat dissipation section (3323) is closer to the fan (31) than the first heat dissipation section (3321) and the second heat dissipation section (3322), and the third heat dissipation section (3323) abuts against another electronic component (A) located in the lower compartment (S12).
  14. The expansion component (E1) according to claim 11 or 12, wherein the inner surface (335) is inclined to the bottom plate (H12) at the inlet section (3311), and the collecting section (3312) abuts against the partition (10).
  15. An electronic device assembly, comprising: the expansion component (E1) as claimed in any one of claims 2 to 14, comprising: a first connector (A2), electrically connected to a first circuit board (A1) and exposed from the top plate (H11) at an opening (H111), wherein the top plate (H11) is provided with the opening (H111); and a host (E2), comprising: a second case (H, H2), having a second accommodating space (S2); a main circuit board (A3), accommodated in the second accommodating space (S2); and a main connector (A4), electrically connected to the main circuit board (A3) and arranged on a surface of the second case (H, H2), wherein after the host (E2) is assembled to the expansion component (E1), the second case (H, H2) covers the top plate (H11) of the first case (H, H1) and the opening (H111), and the first connector (A2) is electrically connected to the main connector (A4).

Description

BACKGROUND OF THE INVENTION The present invention relates to an electronic device assembly, an expansion component thereof, and a heat dissipation module. With the popularization of electronic products, users have increasingly diversified requirements for the performance of electronic devices. To meet various requirements of the users, a quantity of electronic components in the electronic device is increasing, which also causes problems of space configuration and heat dissipation in the electronic device. How to increase configurations of the electronic components in a limited space of the electronic device to improve efficiency while taking into account a heat dissipation effect is a problem that the inventors are urgently trying to resolve. SUMMARY OF THE INVENTION The present invention provides an expansion component, including a case, a partition, a plurality of electronic components, and a heat dissipation module. The case includes a bottom plate, a top plate, and an accommodating space located between the bottom plate and the top plate. The partition is arranged in the accommodating space and parallel to the bottom plate, and the partition divides the accommodating space into an upper compartment and a lower compartment. The electronic components are scattered in the upper compartment and the lower compartment, where one of the electronic components located in the upper compartment abuts against the partition. The heat dissipation module is arranged in the case and includes a diversion case and a fan. The diversion case includes an input section and an output section that are connected, an angle is defined between an extending direction of the input section and an extending direction of the output section, the diversion case is accommodated in the lower compartment, and the output section abuts against the partition and one of the electronic components located in the lower compartment. The fan is arranged at a junction of the input section and the output section. In some embodiments, the bottom plate includes through holes, and the diversion case includes an edge, the edge surrounds and forms an opening, the edge abuts against the bottom plate, and the opening covers the through holes. In some embodiments, the through holes include first through holes and second through holes, the first through holes correspond to a position of the input section, and the second through holes correspond to a position of the output section. In some embodiments, the diversion case includes an inner surface, the inner surface faces toward the bottom plate, the output section includes a first heat dissipation section and a second heat dissipation section, the inner surface has a first height between the first heat dissipation section and the opening, the inner surface has a second height between the second heat dissipation section and the opening, and the first height is different from the second height. In some embodiments, the expansion component further includes heat dissipation fins that are arranged on the first heat dissipation section and the second heat dissipation section. In some embodiments, the first heat dissipation section abuts against the electronic component located in the lower compartment, and the second heat dissipation section abuts against a position at which the partition corresponds to the electronic component located in the upper compartment. In some embodiments, the first heat dissipation section is farther away from the fan than the second heat dissipation section, and the first height is less than the second height. In some embodiments, the inner surface is inclined to the bottom plate in an extending direction between the first heat dissipation section and the second heat dissipation section. In some embodiments, the output section further includes a third heat dissipation section, the inner surface has a third height between the third heat dissipation section and the opening, and the third height is different from the first height and the second height. In some embodiments, the third heat dissipation section is closer to the fan than the first heat dissipation section and the second heat dissipation section, and the third heat dissipation section abuts against another electronic component located in the lower compartment. In some embodiments, the third heat dissipation section is flush with the fan, and the third height is greater than the first height and less than the second height. In some embodiments, the input section of the diversion case includes an inlet section, the inlet section has a first end and a second end, the inner surface is inclined to the bottom plate at the inlet section, the second end is closer to the fan than the first end, and a height of the inner surface from the second end to the opening is greater than a height of the inner surface from the first end to the opening. In some embodiments, the expansion component further includes heat dissipation fins that are arrange