EP-4742223-A1 - DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS, AND METHOD FOR PRODUCING SAME

EP4742223A1EP 4742223 A1EP4742223 A1EP 4742223A1EP-4742223-A1

Abstract

According to an embodiment, a display device including semiconductor light emitting devices includes a display panel and a frame connected to the display panel. The display panel includes a first display module and a second display module disposed adjacent to each other, each of the first display module and the second display module including a plurality of semiconductor light emitting devices disposed on a substrate, and a seam filling material disposed between the first display module and the second display module. The seam filling material may have a curved surface on one side thereof.

Inventors

AN, Kitae
SHIM, BONGCHU

Assignees

LG Electronics Inc.

Dates

Publication Date: 20260513
Application Date: 20230920

Claims (10)

A display device including semiconductor light emitting devices, comprising: a display panel; and a frame connected to the display panel, wherein the display panel comprises a first display module and second display module disposed adjacent to each other, each of the first display module and the second display module comprising a plurality of semiconductor light emitting devices disposed on a substrate, and a seam filling material disposed between the first display module and the second display module, wherein the seam filling material has a curved surface on one side thereof.
The display device including semiconductor light emitting devices according to claim 1, wherein the first display module and the second display module comprise passivation layers disposed on surfaces facing each other, and wherein the seam filling material comprises a first region disposed to cover the passivation layers and a second region disposed between portions of the first region.
The display device including semiconductor light emitting devices according to claim 2, wherein a rear surface of the first region has a concave shape.
The display device including semiconductor light emitting devices according to claim 2, wherein a height of the first region and a height of the second region are different from each other.
The display device including semiconductor light emitting devices according to claim 1, wherein a horizontal width of the seam filling material is greater than a distance between the first display module and the second display module.
The display device including semiconductor light emitting devices according to claim 1, wherein the seam filling material comprises a hydrophilic material.
The display device including semiconductor light emitting devices according to claim 1, wherein the frame comprises a first frame disposed on the display panel, a second frame disposed on the first frame, and a third frame disposed on the second frame, wherein a gap of the first frame is smaller than a gap of the second frame, and wherein the gap of the second frame is smaller than a gap of the third frame.
A method for manufacturing a display device including semiconductor light emitting devices, comprising: inserting a seam filling tube into a display device comprising a display panel; bringing the seam filling tube into contact with a seam region of the display panel; injecting a seam filling material into the seam region through the seam filling tube; removing the seam filling tube; and curing the seam filling material.
The method for manufacturing a display device including semiconductor light emitting devices according to claim 8, wherein the seam filling tube is fixed by a step formed in a frame of the display device.
The method for manufacturing a display device including semiconductor light emitting devices according to claim 8, wherein the seam filling tube is configured to move while injecting the seam filling material into the seam region.

Description

[Technical Field] The present invention relates to a display device including a semiconductor light emitting device and a method for manufacturing the same. [Background Art] Large-area display devices include liquid crystal displays (LCDs), OLED displays, and micro-LED displays. Micro-LED displays use micro-LEDs, semiconductor light-emitting diodes with a diameter or cross-sectional area of 100um or less, as display elements. Because micro-LED displays utilize micro-LEDs, semiconductor light-emitting diodes, as display elements, they offer superior performance in many characteristics, including contrast ratio, response speed, color reproducibility, viewing angle, brightness, resolution, lifespan, luminous efficacy, and luminance. In particular, micro-LED displays offer the advantage of modular separation and combination, allowing for flexible display size and resolution adjustments. However, large-scale micro-LED displays require millions of micro-LEDs, making it difficult to quickly and accurately transfer micro-LEDs onto display panels. Recently developed transfer technologies include the pick-and-place process, the laser lift-off method, and the self-assembly method. Among these, the self-assembly method, in which semiconductor light emitting devices autonomously find their assembly positions within a fluid, is advantageous for implementing large-screen display devices. Conventional display devices using semiconductor light emitting devices are manufactured by transferring them onto substrates such as module substrates or wiring boards. However, this leads to low productivity due to transfer defects in the semiconductor light emitting devices, and the production yield of large-area display devices in particular is extremely low. To address these issues, research and development are currently underway on a 'multi-screen display device' that implements a large display device by tiling multiple semiconductor light-emitting diode display modules of relatively small size. However, in the case of multi-screen display devices, gaps may occur between connected unit display devices due to the bezel area at the edge of each unit display device. This gap area exists due to side electrodes (or side wiring) that provide electrical connection between components positioned above and below the substrate. When a single image is displayed across the entire screen of a multi-screen display device, the gaps or boundary lines between modules may be perceived as "visually recognizable" seams, creating a sense of disconnection and dissonance in the image, thereby reducing the immersive experience. Techniques for physically or optically obscuring the seams between display modules require changes in process conditions, or the process of removing the seams is performed during the display module manufacturing and bonding stages. This makes it difficult to remove the seams after the display panel is completed. In addition, after the display panel was completed, changes in the process environment, such as creating a vacuum, were required to remove the seam. [Disclosure] [Technical Problem] The technical object of the embodiment is to implement a seamless display device. Furthermore, the technical object of the embodiment is to implement a process for removing the seam without requiring vacuum conditions. Furthermore, the technical object of the embodiment is to implement a seamless display device through a simplified process even after the display panel is manufactured. The technical object of the embodiment is not limited to what is described in this section, but includes what may be understood from the description of the invention. [Technical Solution] According to an embodiment, a display device including semiconductor light emitting devices includes a display panel and a frame connected to the display panel. The display panel includes a first display module and a second display module disposed adjacent to each other, each of the first display module and the second display module including a plurality of semiconductor light emitting devices disposed on a substrate, and a seam filling material disposed between the first display module and the second display module. The seam filling material may have a curved surface on one side thereof. In addition, in an embodiment, the first display module and the second display module may include a passivation layer disposed on surfaces adjacent to each other, and the seam filling material may include a first region disposed to cover the passivation layer and a second region between the first region. In an embodiment, the back surface of the first region may have a concave shape. In addition, in the embodiment, the heights of the first region and the second region may be different from each other. In addition, in the embodiment, the horizontal width of the seam filling material may be greater than the gap between the first display module and the second display module. In addition, in the embodi