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EP-4742308-A1 - ELECTRODE SUBSTRATE PROCESSING APPARATUS AND ELECTRODE SUBSTRATE PROCESSING METHOD

EP4742308A1EP 4742308 A1EP4742308 A1EP 4742308A1EP-4742308-A1

Abstract

A substrate processing apparatus includes an encoder configured to measure a substrate transport speed and a substrate transport position of a substrate being transported, a scanner configured to scan one surface of the substrate using light at predetermined time intervals, and a scanner control unit configured to control a scan trajectory based on the substrate transport speed and the substrate transport position, wherein the scanner control unit maintains a scan trajectory constant regardless of changes in the substrate transport speed by changing a scan speed of the scanner in real time.

Inventors

  • KO, Taeyoung

Assignees

  • SAMSUNG SDI CO., LTD.

Dates

Publication Date
20260513
Application Date
20251014

Claims (15)

  1. A substrate processing apparatus, comprising: an encoder (150) configured to measure a substrate transport speed and a substrate transport position of a substrate (130) being transported; a scanner (170) configured to scan one surface of the substrate using light (L) at predetermined time intervals; and a scanner control unit (160) configured to control a scan trajectory (SP) based on the substrate transport speed and the substrate transport position, wherein the scanner control unit (160) maintains a scan trajectory (SP) constant regardless of changes in the substrate transport speed by changing a scan speed of the scanner (170) in real time.
  2. The substrate processing apparatus as claimed in claim 1, wherein a substrate processing trajectory of the scanner control unit (160) comprises: a first processing trajectory (MP1) processed in a direction from one side (E) of the substrate toward an inside (I) of the substrate; a second processing trajectory (MP2) processed in a longitudinal direction of the substrate within the substrate; and a third processing trajectory (MP3) processed in a direction from the inside (I) of the substrate toward the one side (E) of the substrate, wherein the substrate is processed in an order of the first processing trajectory (MP1) , the second processing trajectory (MP2), and the third processing trajectory (MP3), and the substrate is repeatedly processed according to the substrate processing trajectory.
  3. The substrate processing apparatus as claimed in claim 2, wherein: the scanner control unit (160) is configured to maintain the scan trajectory (SP) and the substrate processing trajectory by maintaining constant the light regardless of changes in the substrate transport speed by controlling the scan speed to allow a relative speed, the relative speed being a ratio between the substrate transport speed and the scan speed, to be maintained constant, and the scan speed is a scan speed of the light (L) corresponding to the first processing trajectory (MP1) or the third processing trajectory (MP3).
  4. The substrate processing apparatus as claimed in claim 2 or claim 3, wherein the substrate (130) is cut along the substrate processing trajectory to form an electrode plate.
  5. The substrate processing apparatus according to any one of the preceding claims 2 to 4, wherein: the substrate (130) includes a composite portion (CL) having a part of one surface coated with a composite, and a non-coated portion (UL) located on an outer part of the one surface, the first processing trajectory (MP1) starts from one side (E) of the non-coated portion (UL), and the third processing trajectory (MP3) ends at the one side (E) of the non-coated portion (UL).
  6. The substrate processing apparatus of any one of the preceding claims, wherein: a pattern jig (140) having a through hole (140_H) corresponding to the scan trajectory (SP) of the light (L) is at a bottom of the substrate (130), and the light (L) penetrates the through hole (140_H) of the pattern jig (140).
  7. The substrate processing apparatus as claimed in claim 6, further comprising a suction portion (142) configured to suck processing debris (SP') of the substrate through the through hole (140_H) of the pattern jig (140), wherein the suction portion (142) is on a lower side of the pattern jig (140).
  8. A method for processing a substrate, the method comprising: measuring, by an encoder (150), a substrate transport speed and a substrate transport position of a substrate (130); scanning, by a scanner (170), one surface of the substrate using light (L) at predetermined time intervals; and controlling, by a scanner control unit (160), a scan trajectory (SP) based on the substrate transport speed and the substrate transport position, wherein the scanner control unit (160) maintains constant the scan trajectory (SP) regardless of changes in the substrate transport speed by changing a scan speed of the scanner (170) in real time.
  9. The method as claimed in claim 8, wherein controlling the scan trajectory comprises: inputting a processing trajectory length and a relative speed of the substrate, and generating a scan trajectory corresponding to the processing trajectory length, wherein generating the scan trajectory comprises controlling the scan speed of the scanner to allow a relative speed, the relative speed being a ratio between the substrate transport speed and the scan speed of the scanner, to be maintained constant.
  10. The method as claimed in claim 9, wherein, in generating the scan trajectory corresponding to the processing trajectory length, a substrate processing trajectory comprises: a first processing trajectory processed in a direction from one side of the substrate toward an inside of the substrate; a second processing trajectory processed in a longitudinal direction of the substrate within the substrate; and a third processing trajectory processed in a direction from the inside of the substrate toward the one side of the substrate, wherein the substrate is processed in an order of the first processing trajectory, the second processing trajectory, and the third processing trajectory, and the substrate is repeatedly processed by the substrate processing trajectory.
  11. The method of any one of the preceding claims 8 to 10, wherein: a pattern jig (140) having a through hole (140_H) corresponding to the scan trajectory of the light is located at a bottom of the substrate, and the light penetrates the through hole (140_H) of the pattern jig.
  12. The method of any one of the preceding claims 8 to 11 when combined with claim 9, wherein: the scanning, by the scanner, includes scanning one surface of the substrate using light at predetermined time intervals, and the substrate is cut along the substrate processing trajectory to form an electrode plate.
  13. The method of any one of the preceding claims 8 to 12 when combined with claim 10, wherein in generating the scan trajectory corresponding to the processing trajectory length, the scan speed of the scanner corresponding to the second processing trajectory is zero.
  14. The method of any one of the preceding claims 8 to 12 when combined with claim 10, wherein: the substrate comprises a composite portion (CL) having a part of one surface coated with a composite, and a non-coated portion (UL) located on an outer part of the one surface, the first processing trajectory starts from one side of the non-coated portion, and the third processing trajectory ends at the one side of the non-coated portion.
  15. The method as claimed in claim 14, wherein the second processing trajectory is within the composite portion (CL).

Description

BACKGROUND 1. Field The present disclosure relates to an electrode substrate processing apparatus and an electrode substrate processing method. 2. Description of Related Art A secondary battery may be completed by manufacturing an electrode by coating an electrode mixture, which contains an electrode active material, a conductive material, and a binder, on an electrode current collector, laminating the electrode with a separator, and then embedding and sealing the electrode in a battery case together with an electrolyte. During the electrode manufacturing process, a composite may be coated on a long sheet-shaped electrode current collector, and the resulting substrate may be notched to process an electrode tab, and then cut to a desired size to be manufactured into an electrode plate. The above information disclosed in this Background section is for enhancement of understanding of the background of the present disclosure, and therefore, it may contain information that does not constitute related (or prior) art. SUMMARY According to the present invention, a substrate processing apparatus and a method for processing a substrate as claimed in claims 1 and 8 are provided. Preferred embodiments of the invention are described in the dependent claims. Embodiments include a substrate processing apparatus, including an encoder configured to measure a substrate transport speed and a substrate transport position of a substrate being transported, a scanner configured to scan one surface of the substrate using light at predetermined time intervals, and a scanner control unit configured to control a scan trajectory based on the substrate transport speed and the substrate transport position, wherein the scanner control unit maintains a scan trajectory constant regardless of changes in the substrate transport speed by changing a scan speed of the scanner in real time. A substrate processing trajectory of the scanner control unit may include a first processing trajectory processed in a direction from one side of the substrate toward an inside of the substrate, a second processing trajectory processed in a longitudinal direction of the substrate within the substrate, and a third processing trajectory processed in a direction from the inside of the substrate toward the one side of the substrate, wherein the substrate is processed in an order of the first processing trajectory, the second processing trajectory, and the third processing trajectory, and the substrate is repeatedly processed according to the substrate processing trajectory. The scanner control unit may be configured to maintain the scan trajectory and the substrate processing trajectory by maintaining the light constant regardless of changes in the substrate transport speed by controlling the scan speed to allow a relative speed, the relative speed being a ratio between the substrate transport speed and the scan speed, to be maintained constant, and the scan speed may be a scan speed of the light corresponding to the first processing trajectory or the third processing trajectory. The substrate may be cut along the substrate processing trajectory to form an electrode plate. The scan speed of the scanner corresponding to the second processing trajectory may be zero. The first processing trajectory and the third processing trajectory may each parallel to a width of the substrate. The substrate may include a composite portion having a part of one surface coated with a composite, and a non-coated portion located on an outer part of the one surface, the first processing trajectory starts from one side of the non-coated portion, and the third processing trajectory ends at the one side of the non-coated portion. The second processing trajectory may be within the composite portion. A pattern jig may have a through hole corresponding to the scan trajectory of the light is at a bottom of the substrate, and the light may penetrate the through hole of the pattern jig. The substrate processing apparatus may further include a suction portion configured to suck processing debris of the substrate through the through hole of the pattern jig, wherein the suction portion is on a lower side of the pattern jig. The substrate processing apparatus may further include a beam dump configured to attenuate an intensity of light which penetrates the through hole of the pattern jig, wherein the beam dump is on a lower side of the pattern jig. The substrate processing apparatus may further include a light control device, wherein the light control device controls an output or a pulse repetition rate of the light in real time according to changes in the scan speed of the light. Embodiments include a method for processing a substrate, the method including measuring, by an encoder, a substrate transport speed and a substrate transport position of a substrate, scanning, by a scanner, one surface of the substrate using light at predetermined time intervals, and controlling, by a scanner control unit