EP-4742466-A2 - CARRIER BASED LASER ASSEMBLY FOR HIGH VOLUME INTEGRATION ONTO A SUBSTRATE

Abstract

A carrier based laser assembly for high volume integration onto a substrate is provided. In particular, a device is provided that includes: a semiconductor laser comprising: a laser body comprising a laser end; a laser output at the laser end; and one or more first mating surfaces along the laser body; and a carrier comprising: a carrier body; and one or more second mating surfaces along the carrier body. The one or more first mating surfaces and the one or more second mating surfaces are configured to slidably mate with each other. The laser body and the carrier body are configured to expose the laser output at the laser end when the one or more first mating surfaces and the one or more second mating surfaces slidably mate.

Inventors

• GRZYBOWSKI, RICHARD
• BEHFAR, ALEX
• GREDA, Muhammad

Assignees

• Ranovus Inc.

Dates

Publication Date

20260513

Application Date

20251105

Claims (9)

1. A device comprising: a semiconductor laser comprising: a laser body comprising a laser end; a laser output at the laser end; and one or more first mating surfaces along the laser body; and a carrier comprising: a carrier body; and one or more second mating surfaces along the carrier body, the one or more first mating surfaces and the one or more second mating surfaces configured to slidably mate with each other, and the laser body and the carrier body configured to expose the laser output at the laser end when the one or more first mating surfaces and the one or more second mating surfaces slidably mate.
2. The device of claim 1, wherein the laser end overhangs an adjacent end of the carrier body.
3. The device of claim 1, wherein the one or more first mating surfaces along the laser body are located at an end opposite the laser end, and the one or more second mating surfaces along the carrier body are located at a respective adjacent end of the carrier body.
4. The device of claim 1, wherein the one or more first mating surfaces along the laser body comprises one or more recesses in the laser body, wherein the one or more second mating surfaces along the carrier body comprises one or more protrusions from the carrier body, and wherein respective surfaces of the one or more recesses and the one or more protrusions are configured to slidably mate, the respective surfaces being perpendicular to a respective body.
5. The device of claim 1, wherein at least one facet of the semiconductor laser comprises an etched facet.
6. The device of claim 1, wherein the carrier body is wider than the laser body, the device further comprising: a substrate comprising: a cavity which accepts the laser body, the cavity including a respective laser end and an opposite end; a laser input at the respective laser end; and one or more carrier mating surfaces, wherein the carrier further comprises one or more substrate mating surfaces, wherein the one or more substrate mating surfaces and the one or more carrier mating surfaces are configured to slidably mate with each other as a combination of the semiconductor laser and the carrier, as mated, slides in the cavity towards the laser input, to align the laser output with the laser input.
7. The device of claim 6, wherein the one or more carrier mating surfaces of the substrate are located at the respective laser end of the cavity, and the one or more substrate mating surfaces of the carrier are located adjacent the laser end.
8. The device of claim 6, wherein the one or more carrier mating surfaces of the substrate comprises one or more protrusions from the substrate, and wherein the one or more substrate mating surfaces of the carrier comprises one or more recesses in the carrier body.
9. The device of claim 6, wherein the substrate comprises a plurality of cavities, including the cavity, to receive a plurality of respective mated semiconductor lasers and carriers.

Description

BACKGROUND Increasingly, photonic and/or silicon photonics based optical engines require multiple laser sources to support multiple lanes of data. Often, the need for a greater number of lasers is due to higher optical reflection tolerance, which often dictates lower output power that, in turn, supports fewer channels. This high number of lasers necessitates very high single-device laser yield in an integrated optical engine and the cumulative yield is compounded by the number of devices used. Furthermore, the lowest-loss and most cost-effective assembly methods require that the laser light source be directly attached to silicon photonics, for example, using pick and place techniques. However, the yield from pick and place techniques, which may, for example, rely on fiducials on the laser light source for accurate assembly, may still be lower than desired. BRIEF DESCRIPTION OF THE DRAWINGS For a better understanding of the various examples described herein and to show more clearly how they may be carried into effect, reference will now be made, by way of example only, to the accompanying drawings in which: FIG. 1A depicts a side view of a laser device assembly, which includes a semiconductor laser and a carrier, according to non-limiting examples.FIG. 1B depicts a top view of the laser device assembly, according to non-limiting examples.FIG. 1C depicts a laser-end view of the laser device assembly, according to non-limiting examples.FIG. 2A depicts a top view of a carrier-facing side of the laser of the laser device assembly, according to non-limiting examples.FIG. 2B depicts a top view of a portion of the carrier-facing side of the laser of the laser device assembly, showing first mating surfaces, according to non-limiting examples.FIG. 3A depicts a top view of a laser-facing side of the carrier of the laser device assembly, according to non-limiting examples.FIG. 3B depicts a top view of a portion of the laser-facing side of the carrier of the laser device assembly, showing second mating surfaces, according to non-limiting examples.FIG. 4 depicts a perspective view of the laser and the carrier prior to assembly, according to non-limiting examples.FIG. 5 depicts a perspective view of the laser and the carrier in a process of assembly, according to non-limiting examples.FIG. 6 depicts a perspective view of the laser and the carrier further into the process of assembly, and showing a beginning of a sliding mating process, according to non-limiting examples.FIG. 7 depicts a detailed perspective view of a portion of the laser and the carrier further into the process of assembly, and showing a continuing of the sliding mating process, focusing on an approach of the first and second mating surfaces, according to non-limiting examples.FIG. 8 depicts a detailed perspective view of a portion of the laser and the carrier further into the process of assembly, after the sliding mating process is completed, with the first and second mating surfaces mated and/or engaged, according to non-limiting examples.FIG. 9 depicts a bottom view of a substrate-facing side of the laser device assembly, and showing substrate mating surfaces, according to non-limiting examples.FIG. 10 depicts a perspective view of the laser device assembly and a substrate, prior to assembly, and showing carrier mating surfaces of a cavity of the substrate, according to non-limiting examples.FIG. 11 depicts a detailed perspective view of a portion of the laser device assembly and the substrate, showing the laser device assembly inserted into a cavity of the substrate, with the carrier resting on surfaces of the cavity, and a beginning of an assembly including another sliding mating process, according to non-limiting examples.FIG. 12 depicts a detailed perspective view of a portion of the laser device assembly and the substrate further into the process of assembly, after the sliding mating process is completed, with the substrate and carrier mating surfaces mated and/or engaged, according to non-limiting examples.FIG. 13 depicts a perspective view of the laser device assembly and substrate in an assembled state, according to non-limiting examples.FIG. 14 depicts a perspective view of a device, illustrating an array of laser device assemblies mated with the substrate, which includes a plurality of cavities and waveguides, according to non-limiting examples. Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of embodiments of the present invention. The apparatus and method components have been represented where appropriate by conventional symbols in the drawings, showing only those specific details that are pertinent to understanding the embodiments of the present invention so as not to obscure the disclosure with