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EP-4742838-A1 - METHOD AND SYSTEM FOR ATTACHING A COMPONENT ON A SUBSTRATE

EP4742838A1EP 4742838 A1EP4742838 A1EP 4742838A1EP-4742838-A1

Abstract

The present disclosure relates to a method (100) for attaching one or more components (3), such as a camera or a sensor, onto a substrate (10), such as a printed circuit board, PCB, the method comprising: arranging (110) a component (3) onto an attachment portion (11) of a substrate (10), wherein the attachment portion (11) is at least partially provided with an adhesive (12); curing (120) the adhesive (12) by at least partially heating the attachment portion (11) and thereby at least partially attaching the component (3) to the substrate (10); wherein at least partially heating the attachment portion (11) comprises directly heating the attachment portion (11).

Inventors

  • HEBDA, PAWEL
  • Antos, Przemyslaw

Assignees

  • Aptiv Technologies AG

Dates

Publication Date
20260513
Application Date
20241111

Claims (15)

  1. A method (100) for attaching one or more components (3), such as a camera or a sensor, onto a substrate (10), such as a printed circuit board, PCB, the method comprising: arranging (110) a component (3) onto an attachment portion (11) of a substrate (10), wherein the attachment portion (11) is at least partially provided with an adhesive (12); curing (120) the adhesive (12) by at least partially heating the attachment portion (11) and thereby at least partially attaching the component (3) to the substrate (10); wherein at least partially heating the attachment portion (11) comprises directly heating the attachment portion (11).
  2. The method (100) according to the preceding claim, wherein directly heating the attachment portion (11) comprises using heating means (20) provided on the substrate (10).
  3. The method (100) according to the preceding claim, wherein the heating means (20) comprises a heating element (21) that is integrated in the substrate (10).
  4. The method (100) according to the preceding claim, wherein the heating element (21) is distributed in a pattern in a top portion of the substrate (10), wherein the heating element (21) preferably comprises copper and/or plated copper wire.
  5. The method (100) according to any one of the preceding claims, wherein directly heating the attachment portion (11) comprises directly heating the adhesive (12).
  6. The method (100) according to any one of the preceding claims, wherein at least partially heating the attachment portion (11) can be selectively activated by controlling auxiliary means (22), such as connection pins, wherein controlling auxiliary means (22) is preferably performed in a space apart from the attachment portion (11).
  7. The method (100) according to claim 6, wherein controlling auxiliary means (22) comprises contacting connection pads (23) provided on the substrate (10) with the auxiliary means (22) to establish a connection of a heater circuit.
  8. The method (100) according to claim 7, wherein the connection pads (23) are provided on the same side (10') of the substrate (10) where heating means (20) is arranged, or wherein the connection pads (23) are provided on a side (10") opposite to the side where heating means (20) is arranged.
  9. The method (100) according to any one of the preceding claims, wherein the attachment portion (11) comprises an attachment path that preferably resembles one or more contact surfaces of the component (3).
  10. The method (100) according to any one of the preceding claims, wherein directly heating the attachment portion (11) comprises using radiation, convection, and/or conduction as heat transfer mechanisms.
  11. The method (100) according to any one of the preceding claims, wherein the adhesive (12) comprises thermoset polymers, wherein the adhesive (12) preferably consists of thermoset polymers.
  12. The method (100) according to any one of the preceding claims, further comprising further curing (120) the cured adhesive (12) using an oven for attaching the component (3) onto the substrate (10).
  13. The method (100) according to any one of the preceding claims, wherein one or more contact surfaces of the component (3) form a frame, preferably having an essentially rectangular shape.
  14. An active alignment process for one or more components (3), such as a camera or a sensor, the process comprising: performing the method (100) according to any one of the preceding claims for attaching a component (3) onto a substrate (10), such as a printed circuit board, PCB, wherein curing (120) the adhesive (12) is performed until a predefined temperature of the adhesive (12) is reached.
  15. A system (1) for carrying out the method of claims 1-13 or the process of claim 14, the system (1) comprising: a substrate (10), such as a printed circuit board, PCB, the substrate (10) comprising an attachment portion (11) for arranging (110) a component (3) on it; heating means (20) provided on the substrate (10); wherein the heating means (20) is configured to cure an adhesive (12) comprised by the attachment portion (11) by at least partially heating the attachment portion (11) and thereby at least partially attaching a component (3) to the substrate (10); wherein at least partially heating the attachment portion (11) comprises directly heating the attachment portion (11).

Description

1. Field of the invention The present disclosure relates to a method and a system for attaching components such as cameras or sensors onto substrates, specifically printed circuit boards (PCBs). Specifically, the present disclosure relates to a method involving the use of adhesive and direct heating for curing the adhesive, as well as an active alignment process and a system for implementing the method. 2. Background In the field of manufacturing electronic parts, it is common to attach various components, such as cameras or sensors, onto substrates like printed circuit boards (PCBs). In this field, active alignment processes are well known. Active alignment processes allow the precise assembly of components, e.g., optical components, ensuring optimal performance in systems including but not limited to camera modules, projection devices, and augmented reality applications that maybe used in the automotive sector. While passive alignment methods rely on fixed positions, active alignment utilizes dynamic adjustments to align optical elements with high accuracy. This process may involve real-time feedback mechanisms, often incorporating imaging systems or laser measurements, to detect misalignments and correct them during assembly. Known systems for attaching various components onto substrates like printed circuit boards (PCBs) involve the use of adhesives to secure these components onto the substrate. The adhesive is generally cured through a process of heating, which ensures that the component is firmly attached. Traditional methods often employ external heating mechanisms, such as infrared lamps for partially curing the adhesive, followed by a full cure in a oven, to achieve the necessary temperatures for curing the adhesive. These methods, while effective to some extent, present several challenges and notable drawbacks. Firstly, the necessity of UV light for preliminary curing introduces complexity and additional equipment requirements into the assembly process. The UV light curing step necessitates specific clearance on the PCB to ensure adequate exposure, thereby limiting the available space for other components. Moreover, the reliance on UV light restricts the types of adhesives that can be used, as not all adhesives are compatible with UV curing. Secondly, the requirement for an additional oven curing station further complicates the assembly line. This additional step not only increases the overall processing time but also demands more space and resources, thereby reducing the efficiency of the manufacturing process. The need for multiple curing stages-initial UV curing followed by oven curing-adds to the operational complexity and potential for defects. It is therefore a technical problem underlying the present invention to provide an improved method and system that overcome the disadvantages of known systems. 3. Summary of the invention The above-mentioned objects are at least partially achieved by the subject-matter of the independent claims. Preferred embodiments are subject of the dependent claims, and the skilled person finds hints for other suitable aspects of the present invention through the overall disclosure of the present application. In particular, this object is addressed by a method for attaching one or more components, such as a camera or a sensor, onto a substrate, such as a printed circuit board, PCB, the method comprising: arranging a component onto an attachment portion of a substrate, wherein the attachment portion is at least partially provided with an adhesive; curing the adhesive by at least partially heating the attachment portion and thereby at least partially attaching the component to the substrate; wherein at least partially heating the attachment portion comprises directly heating the attachment portion. In this manner, the invention offers several advantages over the prior art. By directly heating the attachment portion, the method is not dependent on provision of UV light lenses. Hence, the method may simplify the assembly process and may reduce the need for additional equipment. The direct heating mechanism may reduce processing time and allow for the use of a wider range of adhesive types. This may enhance manufacturing flexibility. Furthermore, the method provides for an optimized space usage, as the UV light access clearance may no longer be required compared to known systems in the prior art. Moreover, precision in attaching components due to the direct heating process may be improved. This may lead to stronger and more reliable bonds. This method may also enhance efficiency of the manufacturing process by reducing the time required for adhesive curing. As can be gathered from further below, the method may also provide for multiple connection options for heater means, including connection pads on the surface, connection pads on the bottom layer, and additional connectors, thereby offering flexibility in design and integration without impairment of installation space