Search

EP-4742839-A1 - ELECTRONIC ASSEMBLY

EP4742839A1EP 4742839 A1EP4742839 A1EP 4742839A1EP-4742839-A1

Abstract

An electronic assembly (10, 10a) including a circuit board (100, 100a), a power chip (200, 200a) and a heat sink (300). The power chip is disposed on the circuit board and has a first surface (231) facing away from the circuit board. The heat sink includes a cooling fin (310) and a joint part (320). The cooling fin has a second surface (311) thermally coupled to the first surface (231). Area of the second surface (311) is equal to or greater than area of the first surface (231), ensuring full contact between the entire first surface and the second surface. The power chip (200, 200a) is positioned between the cooling fin (310) and the circuit board (100, 100a). The joint part (320) has an end secured to the cooling fin (310) and the other end secured to the circuit board (100, 100a).

Inventors

  • LIAO, WEI SHENG
  • WANG, YUNG CHENG

Assignees

  • Everlight Electronics Co., Ltd.

Dates

Publication Date
20260513
Application Date
20250131

Claims (10)

  1. An electronic assembly (10, 10a), comprising: a circuit board (100, 100a); a power chip (200, 200a), disposed on the circuit board and having a first surface (231) facing away from the circuit board; and a heat sink (300), comprising a cooling fin (310) and at least one joint part (320), wherein the cooling fin (310) comprises a second surface (311) thermally coupled to the first surface (231), an area of the second surface (311) is equal to or greater than an area of the first surface (231), ensuring full contact between the entire first surface and the second surface, the power chip (200, 200a) is positioned between the cooling fin (310) and the circuit board (100, 100a), and at least one joint part (320) has an end secured to the cooling fin (310) and the other end secured to the circuit board (100, 100a).
  2. The electronic assembly according to claim 1, wherein the at least one joint part comprises a connecting part (321) and a mounted part (322), the connecting part connects the cooling fin and the mounted part, an extension direction (E1) of the connecting part and an extension direction (E2) of the mounted part are non-parallel, and the mounted part is fixed to the circuit board.
  3. The electronic assembly according to claim 2, wherein the at least one joint part comprises two joint parts, and the two connecting parts of the two joint parts are connected to two opposite side of the cooling fin, respectively.
  4. The electronic assembly according to claim 2, wherein the at least one joint part further comprises at least one fastened part (323), the mounted part has at least one fastening hole (324), and the at least one fastened part is fastened in the fastening hole and disposed on the circuit board.
  5. The electronic assembly according to claim 4, wherein the at least one fastened part comprises a plurality of fastened parts, the at least one fastening hole comprises a plurality of fastening holes spaced apart from each other, and the plurality of fastened parts are respectively fastened in the plurality of fastening holes and disposed on the circuit board.
  6. The electronic assembly according to claim 2, wherein the extension direction of the connecting part and the extension direction of the mounted part are perpendicular to each other.
  7. The electronic assembly according to claim 2, further comprising at least one thermally conductive component (400a), wherein the circuit board (100a) has at least one thermally conductive layer (1 10a), and the mounted part is thermally coupled to the at least one thermally conductive layer of the circuit board via the at least one thermally conductive component.
  8. The electronic assembly according to claim 7, wherein the at least one thermally conductive component is a thermal paste and is positioned between the mounted part and the circuit board.
  9. The electronic assembly according to claim 1, wherein the power chip comprises a chip body (210) and a plurality of leads (220), and the plurality of leads protrude from an identical side of the chip body.
  10. The electronic assembly according to claim 9, wherein the power chip further comprises a heat dissipation sheet (230), the heat dissipation sheet is disposed on the chip body, and the first surface is positioned on the heat dissipation sheet.

Description

Technical Field The disclosure relates to an electronic assembly, more particularly to an electronic assembly including at least one power chip. Background Power chip is a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) processing high-power voltage and current, and is commonly applied in an electronic assembly related to power control. Recently, with the rapid development of the semiconductor technology, the amount of heat generated by the power chip is significantly increased with the performance of the power chip. In a conventional electronic assembly, the direction along which the power chip is installed is limited, thereby reducing the flexibility for assembling the power chip and the heat sink. A screw is usually required to be disposed through the heat sink to fix the same to the power chip, which hinders the effective dissipation of the heat accumulated on the power chip due to the reduced contact area between the power chip and the heat sink. As a result, the heat dissipation efficiency of the power chip is limited, and the environment of high temperature adversely affect the performance of the power chip. In addition, such design occupies large space and thus is disadvantageous for the manufacturer to perform related arrangements and operations. SUMMARY The disclosure provides an electronic assembly that can effectively dissipate the heat accumulated on the power chip to prevent the performance of the single power chip from being reduced. One embodiment of this disclosure provides an electronic assembly including a circuit board, a power chip and a heat sink. The power chip is disposed on the circuit board and has a first surface facing away from the circuit board. The heat sink includes a cooling fin and at least one joint part. The cooling fin includes a second surface thermally coupled to the first surface. An area of the second surface is equal to or greater than an area of the first surface, ensuring full contact between the entire first surface and the second surface. The power chip is positioned between the cooling fin and the circuit board. At least one joint part has an end secured to the cooling fin and the other end secured to the circuit board. According to the electronic assembly disclosed by above embodiments, since the first surface faces away from the circuit board, the space above the power chip may be used to arrange the heat sink in a flexible manner. Accordingly, the heat sink having suitable configuration may be used to cool the power chip based on the demand for the heat dissipation in a focused manner, thereby preventing the performance of the power chip from being reduced. In addition, the joint part has an end secured to the cooling fin and the other end secured to the circuit board, so as to mount the cooling fin on the circuit board instead of on the power chip. Thus, it is not required to have a mounting hole on the power chip for mounting the cooling fin, thereby allowing the area of the second surface to be equal to or greater than the area of the first surface, ensuring full contact between the entire first surface and the second surface. In this way, the contact area between the first surface and the second surface is enlarged, thereby further ensuring the heat generated by the power chip to be effectively dissipated by the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS The present disclosure will become better understood from the detailed description given herein below and the accompanying drawings which are given by way of illustration only and thus are not intending to limit the present disclosure and wherein: FIG. 1 is a perspective view of an electronic assembly according to a first embodiment of the disclosure;FIG. 2 is an exploded view of the electronic assembly in FIG. 1;FIG. 3 is a rear view of the electronic assembly in FIG. 1;FIGS. 4 to 7 show a cooling effect of the electronic assembly in FIG. 1; andFIG. 8 is a rear view of an electronic assembly according to a second embodiment of the disclosure. DETAILED DESCRIPTION In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing. Please refer to FIGS. 1 to 3. FIG. 1 is a perspective view of an electronic assembly 10 according to a first embodiment of the disclosure. FIG. 2 is an exploded view of the electronic assembly 10 in FIG. 1. FIG. 3 is a rear view of the electronic assembly 10 in FIG. 1. In this embodiment, for example, the electronic assembly 10 is a power module, and includes a circuit board 100, a power chip 200 and a heat sink 300. For example, the electronic assembly 10 may be applied in an automotive electronic product, such as a charging pile, an A