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EP-4742844-A1 - LAMINATE, HEAT DISSIPATION MEMBER, METHOD FOR MANUFACTURING SAME, HEAT DISSIPATION HOUSING, AND METHOD FOR MANUFACTURING SAME

EP4742844A1EP 4742844 A1EP4742844 A1EP 4742844A1EP-4742844-A1

Abstract

Provided is a laminate having good heat dissipation properties while reducing weight. A laminate having at least one metal layer and at least one resin layer, wherein a unit weight of the laminate is 2.0 kg/m 2 or less, and a thermal diffusivity of the laminate in a direction perpendicular to a lamination direction is 10 ×10 -6 m 2 /s or more.

Inventors

  • ORI,Yuki

Assignees

  • JX Advanced Metals Corporation

Dates

Publication Date
20260513
Application Date
20240613

Claims (8)

  1. A laminate having at least one metal layer and at least one resin layer, wherein a unit weight of the laminate is 2.0 kg/m 2 or less, and a thermal diffusivity of the laminate in a direction perpendicular to a lamination direction is 10 × 10 -6 m 2 /s or more.
  2. The laminate according to claim 1, wherein the thermal diffusivity of the resin layer in the direction perpendicular to the lamination direction is 0.05 × 10 -6 to 0.70 × 10 -6 m 2 /s.
  3. The laminate according to claim 1 or 2, wherein the resin layer comprises a magnetic metal material.
  4. The laminate according to any one of claims 1 to 3, wherein the metal layer comprises at least one selected from copper, copper alloy, aluminum, and aluminum alloy.
  5. A heat dissipation member having the laminate according to any one of claims 1 to 4.
  6. A method for manufacturing a heat dissipation member, the method comprising a step of manufacturing a heat dissipation member using the laminate according to any one of claims 1 to 4.
  7. A heat dissipation housing having the laminate according to any one of claims 1 to 4.
  8. A method for manufacturing a heat dissipation housing, the method comprising a step of manufacturing a heat dissipation housing using the laminate according to any one of claims 1 to 4.

Description

[Technical Field] This invention relates to a laminate, a heat dissipation member, and method for manufacturing the same, and a heat dissipation housing and a method for manufacturing the same. [Background Art] In recent years, interest in global environmental issues has been growing worldwide, and environmentally friendly vehicles equipped with rechargeable batteries, such as electric vehicles and hybrid vehicles, are becoming increasingly popular. Many of these vehicles use a system in which DC current generated from a mounted rechargeable battery is converted to AC current via an inverter, and necessary power is then supplied to an AC motor to obtain driving power. Electronic control units (ECUs) are also used in such automobiles to electronically control the engine drive, driving support systems, and the like. However, electronic devices such as inverters and ECUs are becoming smaller and more highly integrated, causing a problem of an increase in a temperature due to increased heat generation. The increase in the temperature of the electronic device can cause operational failures. Therefore, various measures must be taken to control the increase in the temperature of the electronic device. One means for achieving this would be to use SUS with excellent heat dissipation properties as a housing, as described in Patent Literature 1, for example. [Citation List] [Patent Literature] [PTL 1] Japanese Patent Application Publication No. 2020-172694 A [Summary of Invention] [Technical Problem] By the way, from the viewpoint of extending the cruising range of electric vehicles and the like, attention is being paid to improving the electric power cost (cruising range per unit of electric power). However, since the SUS housing described above is relatively heavy, housing the electronic device within the housing will likely reduce the cost of electricity for electric vehicles and the like. Furthermore, the replacement of SUS housings with resin housings is currently being considered from the viewpoint of weight reduction for electric vehicles and the like. However, the resin housings have lower heat dissipation properties than the SUS housings. Therefore, as the temperature of the electronic device increases, it may cause the electric device to malfunction. Thus, in an embodiment of this invention, an object is to provide a laminate having good heat dissipation properties while reducing weight. [Solution to Problem] As a result of intensive studies, the inventors have found that, in order to improve the heat dissipation properties of a three-dimensional molded article such as a housing while reducing the weight, it is important to form a laminate having at least one metal layer and at least one resin layer, while controlling the thermal diffusivity of the laminate in a direction perpendicular to a lamination direction to an appropriate range. This invention has been completed on the basis of these findings, and is illustrated below. [1] A laminate having at least one metal layer and at least one resin layer, wherein a unit weight of the laminate is 2.0 kg/m2 or less, and a thermal diffusivity of the laminate in the direction perpendicular to a lamination direction is 10 × 10-6 m2/s or more.[2] The laminate according to [1], wherein the thermal diffusivity of the resin layer in a direction perpendicular to the lamination direction is 0.05 × 10-6 to 0.70 × 10-6 m2/s.[3] The laminate according to [1] or [2], wherein the resin layer comprises a magnetic metal material.[4] The laminate according to any one of [1] to [3], wherein the metal layer comprises at least one selected from copper, copper alloy, aluminum, and aluminum alloy.[5] A heat dissipation member having the laminate according to any one of [1] to [4].[6] A method for manufacturing a heat dissipation member, the method comprising a step of manufacturing a heat dissipation member using the laminate according to any one of [1] to [4].[7] A heat dissipation housing having the laminate according to any one of [1] to [4].[8] A method for manufacturing a heat dissipation housing, the method comprising a step of manufacturing a heat dissipation housing using the laminate according to any one of [1] to [4]. [Advantageous Effects of Invention] In an embodiment of this invention, it is possible to have good heat dissipation properties while reducing the weight. [Brief Description of Drawings] [FIG. 1] FIG. 1 is a schematic view of a heat dissipation evaluation device used to evaluate heat dissipation properties of sheet-shaped samples according to Examples 1 to 5, Comparative Example 1, and Reference Example 1.[FIG. 2] FIG. 2 is schematic views of sheet-shaped samples according to Examples 1 to 5, Comparative Example 1, and Reference Example 1 before three-dimensional molding.[FIG. 3] FIG. 3 is a schematic view for explaining a method for producing three-dimensional molded samples from sheet-shaped samples according to Examples 1 to 5 and Reference Example 1.[FIG. 4]