EP-4742845-A1 - COMMUNICATION DEVICE

EP4742845A1EP 4742845 A1EP4742845 A1EP 4742845A1EP-4742845-A1

Abstract

This application provides a communication device, and relates to the field of communication technologies, to resolve a technical problem about a poor effect of heat dissipation for communication devices. The communication device provided in this application may include a housing, a first heat emitting component, a second heat emitting component, and an air guide pipe. The housing has a heat dissipation air duct and an air inlet and an air outlet that are in communication with the heat dissipation air duct. The first heat emitting component and the second heat emitting component are both located in the heat dissipation air duct. The air guide pipe is located in the heat dissipation air duct, the air guide pipe has an air inlet end and an air outlet end, and the air inlet end is in communication with the air inlet end. The first heat emitting component is located at the air outlet end of the air guide pipe. One part of air entering from the air inlet may dissipate heat for the second heat emitting component, and the other part of the air may cool the first heat emitting component through the air guide pipe, thereby ensuring efficiency of heat dissipation for the first heat emitting component.

Inventors

ZHANG, Yuandong
HUANG, FEI
HU, WEIFENG
ZHANG, SHUFENG

Assignees

Huawei Technologies Co., Ltd.

Dates

Publication Date: 20260513
Application Date: 20240725

Claims (16)

A communication device, comprising a housing, a first heat emitting component, a second heat emitting component, and an air guide pipe, wherein the housing has a heat dissipation air duct and an air inlet and an air outlet that are in communication with the heat dissipation air duct, and the first heat emitting component and the second heat emitting component are both located in the heat dissipation air duct; the air guide pipe is located in the heat dissipation air duct, the air guide pipe has an air inlet end and an air outlet end, and the air inlet end is in communication with the air inlet; and the first heat emitting component is located at the air outlet end of the air guide pipe.
The communication device according to claim 1, wherein the air guide pipe has a thermal insulation side wall, and the thermal insulation side wall is disposed facing the second heat emitting component.
The communication device according to claim 1 or 2, wherein the air guide pipe is made of a thermal insulation material.
The communication device according to any one of claims 1 to 3, wherein the air guide pipe has one air inlet end and a plurality of air outlet ends; and an air deflector is further disposed in the air guide pipe, and the air deflector is configured to guide a volume of flow in the air guide pipe to each air outlet end.
The communication device according to claim 4, wherein the air guide pipe is in a long strip shape, and the plurality of air outlet ends are sequentially disposed in a length direction of the air guide pipe; and a plurality of air deflectors are disposed in the air guide pipe, and the plurality of air deflectors are sequentially disposed in the length direction of the air guide pipe.
The communication device according to any one of claims 1 to 5, wherein in a connection path between the air inlet end and the air outlet end of the air guide pipe, the air guide pipe is in a straight line shape or a curve shape.
The communication device according to any one of claims 1 to 6, wherein a diameter of the air inlet is greater than a diameter of the air inlet end; and the communication device further comprises a first fan, and the first fan is located at the air inlet and/or the air outlet of the housing.
The communication device according to any one of claims 1 to 7, wherein the communication device further comprises a second fan; and the second fan is located at the air inlet end or the air outlet end, or the second fan is located in the air guide pipe.
The communication device according to any one of claims 1 to 8, wherein an outer surface of the air guide pipe is provided with an avoidance slot, and at least a part of electronic components comprised in the second heat emitting component are located in the avoidance slot.
The communication device according to any one of claims 1 to 9, wherein the communication device further comprises a heat sink, and the heat sink is located in the heat dissipation air duct and is in thermal conduction contact with the second heat emitting component.
The communication device according to claim 10, wherein the heat sink has a heat sink fin, and the air guide pipe is located on the top of the heat sink fin.
The communication device according to any one of claims 1 to 11, wherein the air guide pipe has a pipe body and a heat dissipation portion that is disposed on an outer side of the pipe body, and the heat dissipation portion is in thermal conduction contact with the second heat emitting component.
The communication device according to claim 12, wherein the air guide pipe has a thermal insulation portion, and the thermal insulation portion is located between the pipe body and the heat dissipation portion.
The communication device according to any one of claims 1 to 13, wherein the first heat emitting component comprises a plurality of optical modules, and the plurality of optical modules are sequentially disposed in the length direction of the air guide pipe.
The communication device according to any one of claims 1 to 14, wherein the second heat emitting component comprises a circuit board and a plurality of electronic components located on the circuit board.
The communication device according to any one of claims 1 to 15, wherein the communication device is a building baseband unit or a radio HUB unit.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to Chinese Patent Application No. 202310952110.7, filed with the China National Intellectual Property Administration on July 28, 2023 and entitled "COMMUNICATION DEVICE", which is incorporated herein by reference in its entirety. TECHNICAL FIELD This application relates to the field of communication technologies, and in particular, to a communication device. BACKGROUND With rapid development of electronic technologies, electronic devices are highly integrated than ever and their thermal densities are increasingly high. Usually heat dissipation is required for electronic components to ensure good performance and reliability of the electronic components. In a current electronic device, heat dissipation is usually performed on an electronic component in an air cooling manner, and heat of the electronic component is reduced by air that flows through a surface of the electronic component, to control the electronic component to operate in a proper temperature range. Existing communication devices such as a building baseband unit (building baseband unit, BBU) and a radio HUB (radio HUB, RHUB) unit are mainly applied to scenarios such as office buildings, shopping malls, and subways, to implement functions such as signal encryption and coverage hole filling. Such communication devices have high requirements on heat dissipation and noise, and different electronic components in the communication devices have different requirements on heat dissipation. However, to satisfy a high requirement of an electronic component on heat dissipation in conventional technologies, usually a heat dissipation capability of the entire communication device is enhanced, for example, usually by directly increasing an air volume of a fan and a quantity of in-use fans. Such a solution lacks research and optimization for the device in practical application. Increasing the quantity of fans brings about an increase in a size and a weight of the communication device, and increasing the air volume of the fan causes loud noise. Therefore, how to improve heat dissipation performance of some electronic components in a communication device is an urgent technical problem to be resolved. SUMMARY This application provides a communication device with good heat dissipation performance. The communication device may include a housing, a first heat emitting component, a second heat emitting component, and an air guide pipe. The housing has a heat dissipation air duct and an air inlet and an air outlet that are in communication with the heat dissipation air duct. The first heat emitting component and the second heat emitting component are both located in the heat dissipation air duct. The air guide pipe is located in the heat dissipation air duct, the air guide pipe has an air inlet end and an air outlet end, and the air inlet end is in communication with the air inlet. The first heat emitting component is located at the air outlet end of the air guide pipe. During practical application, external air may enter the heat dissipation air duct from the air inlet, and is discharged from the air outlet. One part of air entering from the air inlet flows through the second heat emitting component, to dissipate heat for the second heat emitting component, and is ultimately discharged from the air outlet. In addition, the air inlet end of the air guide pipe is in communication with the air inlet. Therefore, the other part of the air entering from the air inlet enters the air guide pipe from the air inlet end and then is discharged from the air outlet end. The first heat emitting component is located at the air outlet end of the air guide pipe. Therefore, when the air discharged from the air outlet end flows through the first heat emitting component, the first heat emitting component can be cooled, thereby ensuring efficiency of heat dissipation for the first heat emitting component. During specific arrangement, the air guide pipe may have a thermal insulation side wall, and the thermal insulation side wall is disposed facing the second heat emitting component. Heat generated by the second heat emitting component can be effectively blocked through the thermal insulation side wall, to prevent the heat generated by the second heat emitting component from being transferred to the air guide pipe and causing a temperature rise of air in the air guide pipe, thereby effectively ensuring efficiency of heat dissipation for the first heat emitting component. Alternatively, during specific arrangement, the entire air guide pipe may be made of a thermal insulation material, thereby improving convenience of manufacturing and helping reduce a size of a heat conduction pipe. In an example, the air guide pipe may have one air inlet end and a plurality of air outlet ends. An air deflector is further disposed in the air guide pipe, and the air deflector is configured to guide a volume of flow in the air guide pipe