EP-4742865-A1 - LIGHT-EMITTING DIODE AND DISPLAY MODULE COMPRISING SAME

EP4742865A1EP 4742865 A1EP4742865 A1EP 4742865A1EP-4742865-A1

Abstract

A light-emitting diode and a display module comprising same are disclosed. The disclosed light-emitting diode comprises: a first semiconductor layer; a second semiconductor layer; an active layer provided between the first semiconductor layer and the second semiconductor layer so as to emit light; a first contact electrode electrically connected to the first semiconductor layer; a second contact electrode electrically connected to the second semiconductor layer; and a plurality of conductive members provided on the first contact electrode and the second contact electrode, wherein each of the plurality of conductive members includes a conductive adhesive member and a first protective layer that covers the conductive adhesive member.

Inventors

PARK, Youngmok
JUNG, JONGHOON
HONG, Soonmin

Assignees

Samsung Electronics Co., Ltd.

Dates

Publication Date: 20260513
Application Date: 20241031

Claims (15)

A light-emitting diode comprising: a first semiconductor layer; a second semiconductor layer; an active layer between the first semiconductor layer and the second semiconductor layer, the active layer being configured to emit light; a first contact electrode to be electrically connected with the second semiconductor layer; a second contact electrode to be electrically connected with the first semiconductor layer; and a plurality of conductive members on the first contact electrode and the second contact electrode, wherein the plurality of conductive members respectively comprise: a conductive adhesive member; and a first protective layer that covers the conductive adhesive member.
The light-emitting diode of claim 1, wherein the protective layer is a first protective layer, and the plurality of conductive members further respectively comprise: a second protective layer that covers the first protective layer.
The light-emitting diode of claim 1, further comprising: a partition between the first contact electrode and the second contact electrode and includes an insulating material.
The light-emitting diode of claim 1, wherein the plurality of conductive members are arranged on the first contact electrode and the second contact electrode at intervals.
The light-emitting diode of claim 1, wherein the plurality of conductive members are arranged on the first contact electrode and the second contact electrode in specific patterns.
The light-emitting diode of claim 1, wherein the plurality of conductive members have a polygonal shape, a circular shape, or an oval shape when the light-emitting diode is viewed from a bottom surface.
The light-emitting diode of claim 1, wherein a curing temperature of the conductive adhesive member is lower than 200°C.
The light-emitting diode of claim 1, wherein a range of resistance values after curing of the conductive adhesive member is from 0.1 ohm to 20 ohm.
The light-emitting diode of claim 1, wherein the conductive adhesive member comprises: an epoxy resin; and conductive materials dispersed on the epoxy resin at intervals, and wherein the intervals between the conductive materials narrow when the light-emitting diode is thermally pressed to the substrate, the conductive materials contacting each other or being clumped, the conductive materials making electric currents flow between the first contact electrode and a first substrate pad of the substrate and between the second contact electrode and a second substrate pad of the substrate.
The light-emitting diode of claim 9, wherein areas of each of the conductive adhesive members are from 1% to 30% of smaller areas between the areas of the first contact electrode and the second contact electrode and the areas of the first substate pad and the second substrate pad.
The light-emitting diode of claim 1, wherein the light-emitting diode is one of a plurality of light-emitting diodes, the plurality of light-emitting diodes being constituted in forms of flip chips.
A method of manufacturing a light-emitting diode, the method comprising: patterning a plurality of conductive adhesive members on a first contact electrode and a second contact electrode of the light-emitting diode formed on a wafer; and forming a plurality of protective layers so as to cover the plurality of conductive adhesive members, respectively.
The method of manufacturing the light-emitting diode of claim 12, further comprising: forming a partition including an insulating material between the first contact electrode and the second contact electrode of the light-emitting diode.
The method of manufacturing the light-emitting diode of claim 12, further comprising: forming a plurality of second protective layers so as to cover the plurality of protective layers, respectively.
A display module comprising: a substrate having a surface; a plurality of substrate pads arranged on the surface of the substrate; and a plurality of light-emitting diodes including a plurality of contact electrodes connected to the plurality of substrate pads, wherein the plurality of light-emitting diodes respectively comprise: a conductive connection member that electrically and physically connects the plurality of substrate pads and the plurality of contact electrodes; and a plurality of walls between the plurality of contact electrodes insulate the plurality of contact electrodes.

Description

[Technical Field] The disclosure relates to light-emitting diodes and a display module including the same. [Background Art] A display panel includes a TFT substrate including a plurality of thin film transistors (TFTs) and a plurality of light-emitting diodes mounted on the substrate. The plurality of light-emitting diodes express various colors as they operate in pixel or subpixel units. Operations of each pixel or subpixel are controlled by the plurality of TFTs. Each light-emitting diode emits various colors, e.g., a red color, a green color, and a blue color. The plurality of light-emitting diodes may be transferred to the TFT substrate from a wafer or a relay substrate by a pick-and-place transfer method, a stamping transfer method, or a laser transfer method. The plurality of light-emitting diodes are electrically connected to substrate pads provided on the substrate by using a solder ball or an anisotropic conductive film (ACF), or a conductive adhesive. [Disclosure of Invention] [Solution to Problem] A light-emitting diode according to an embodiment of the disclosure may include a first semiconductor layer, a second semiconductor layer, an active layer provided between the first semiconductor layer and the second semiconductor layer and configured to emit light, a first contact electrode electrically connected with the second semiconductor layer, a second contact electrode electrically connected with the first semiconductor layer, and a plurality of conductive members provided on the first contact electrode and the second contact electrode. The plurality of conductive members may include a conductive adhesive member, and a protective layer that covers the conductive adhesive member. The protective layer may be a first protective layer. The plurality of conductive members may further respectively include a second protective layer that covers the first protective layer. A light-emitting diode according to an embodiment may further include a partition between the first contact electrode and the second contact electrode and includes an insulating material. The plurality of conductive members may be arranged on the first contact electrode and the second contact electrode at intervals. The plurality of conductive members may be arranged on the first contact electrode and the second contact electrode in specific patterns. The plurality of conductive members may have a polygonal shape, a circular shape, or an oval shape when the light-emitting diode is viewed from a bottom surface. A curing temperature of the conductive adhesive member may be lower than 200°C. A range of a resistance value after curing of the conductive adhesive member may be from 0.1 ohm to 20 ohm. The conductive adhesive member may include an epoxy resin, and conductive materials dispersed on the epoxy resin at intervals. The intervals between the conductive materials may narrow when the light-emitting diode is thermally pressed to the substrate. The conductive materials may contact each other or may be clumped. The conductive materials may make electric currents flow between the first contact electrode and a first substrate pad of the substrate and between the second contact electrode and a second substrate pad of the substrate. Areas of each of the conductive adhesive members may be from 1% to 30% of smaller areas between the areas of the first contact electrode and the second contact electrode and the areas of the first substate pad and the second substrate pad. The light-emitting diode is one of a plurality of light-emitting diodes. The plurality of light-emitting diodes may be constituted in forms of flip chips. A method of manufacturing a light-emitting diode according to an embodiment may include the steps of patterning a plurality of conductive adhesive members on a first contact electrode and a second contact electrode of the light-emitting diode formed on a wafer, and forming a plurality of protective layers so as to cover the plurality of conductive adhesive members, respectively. The method of manufacturing a light-emitting diode according to an embodiment may further include the step of forming a partition including an insulating material between the first contact electrode and the second contact electrode of the light-emitting diode. The method of manufacturing a light-emitting diode according to an embodiment may further include the step of forming a plurality of second protective layers so as to cover the plurality of protective layers. A display module according to an embodiment may include a substrate having a surface. A plurality of substrate pads are arranged on the surface of the substrate. A plurality of light-emitting diodes include a plurality of contact electrodes that are connected to the plurality of substrate pads. Each of the plurality of light-emitting diodes may include a conductive connection member that electrically and physically connects the plurality of substrate pads and the plurality of contact electr