Electronic chip incorporating a crack detection device

Abstract

Electronic chip comprising a crack detection device This description relates to an electronic chip comprising a crack detection device formed in and on a substrate or on the substrate, the device comprising a conductive path having an alternation of lower (201) and upper (203) conductive bands, the path comprising, for each lower band: a first (205A) and a second (205B) conductive vias in contact with the lower band, a third (207A) and a fourth (207B) conductive vias in contact with one upper band and another upper band, respectively, at least a first (209A) and a second (209B) conductive tracks connecting the first and third vias and the second and fourth vias, respectively, the first and second vias being located directly above a first and second end of the lower band, respectively, and the third and fourth vias being located directly above one end of the band and the other upper band, respectively. Figure for the abridged version: Fig. 2A

Inventors

Gregoire JOUAN

Assignees

STMICROELECTRONICS INTERNATIONAL N.V.

Dates

Publication Date: 20260508
Application Date: 20241106