JP-2020506537-A5 -

Dates

Publication Date

20221212

Application Date

20171205

Description

The additional reinforcing layer may be applied to the entire surface of at least one of the connection regions, thereby ensuring that the connection region of the connection established using anisotropic conductive film adhesive bonding is fixed and flat as much as possible. The reinforcing layer may also allow, for example, a camera image sensor to be directly bonded onto one of the connection regions of a flexible conductor track using anisotropic conductive film adhesive bonding. The load-bearing capacity of a flexible conductor track can be further optimized by providing an additional reinforcing layer. For example, the additional reinforcing layer may be in the form of a second metal layer (e.g., copper) that is not used on the conductor track and is configured to withstand the forces acting on the flexible conductor track during extreme deformation, particularly during bending and roll angle adjustment. Furthermore, line grids, dot matrices, and/or cross grids may be formed in the second metal layer. These structures can provide additional protection during bending and retaining force to suppress product deformation. Figure 5 shows two different configurations of such a second metal layer made of copper for increasing load-bearing capacity. In the configuration shown on the right side of Figure 5, the area for ACFA bonding is configured as fixed and flat as possible, and the second copper layer covers the entire surface of the connection area 28 to enable adhesion to the image sensor, with no slots penetrating the connection area 28. In the slot area 26, the second copper layer is configured in a cross grid shape. In the configuration shown on the left side of Figure 5, the second copper layer is configured as a dot matrix throughout, that is, in the connection region 28' and the slot region 26'. Furthermore, in this configuration, the slots are made very wide to ensure the best possible load-bearing capacity when adjusting the corresponding roll angle. Figure 6 shows four diagrams illustrating embodiments of the flexible conductor track 10 of the present invention, providing further details of possible forms of the conductor track 10. In the illustrated track 10, both vertical slots 18 and 20 terminate before the connection areas 14 and 16 provided for ACFA bonding, thereby ensuring the covering of the bonding connection areas 14 and 16 is as flat as possible. Furthermore, the width 24 of the vertical slots 18 and 20 decreases toward the connection areas 14 and 16, thereby expanding the covering surface for ACFA bonding and increasing the load-bearing capacity of the bonding connection. In the lower left diagram of Figure 6, the conductor track structure 12 and its extended state can be seen, and it can be observed that the spacing between individual structures in the connection areas 14 and 16 is increased in contrast to the spacing in area 11. The lower right diagram of Figure 6 shows additional reinforcing layers 26 and 28 for the conductor track 10, which are configured across the entire surface in connection areas 14 and 16 (area 28) and in a cross-grid shape in area 11 of the vertical slots 18 and 20 (area 26).