JP-2022515400-A5 -

Dates

Publication Date

20221221

Application Date

20191220

Description

It should be understood that the aspects and features provided herein may include any combination of the aspects and features described herein. That is, the aspects and features provided herein are not limited to any combination of the aspects and features specifically described herein, but also include any combination of the aspects and features provided herein. The present invention provides, for example, the following: (Item 1) An apparatus for cutting a wafer into one or more shapes, wherein the apparatus is A fixing device including a first base portion, wherein the first base portion includes an array of pin holes configured to hold a plurality of pins, An inlay to rest on the shorter pins of the plurality of pins, wherein the inlay includes holes that receive the medium-length pins of the plurality of pins and stabilize the inlay so that it does not move in a direction parallel to the first base portion, and Equipped with, The apparatus wherein the wafer is placed on the long pins of the plurality of pins, and a laser cuts a shape corresponding to the inlay from the wafer, and the cut portion of the wafer is placed on the inlay. (Item 2) The apparatus according to item 1, wherein the thickness of the inlay and the length of the short pin provide a cutting groove for the laser. (Item 3) The apparatus according to item 2, wherein the cutting groove is configured to reduce reflection from the laser. (Item 4) The apparatus as described in item 2, wherein the depth of the cutting groove is within the range of 15 to 25 mm. (Item 5) The apparatus according to item 1, wherein the fixing device further includes a second floor portion below the first floor portion. (Item 6) The apparatus according to item 5, wherein the first floor section and the second floor section each include a second array of ventilation holes. (Item 7) The fastener further includes a cavity below the second floor portion, as described in item 5. (Item 8) The apparatus according to item 7, wherein the cavity connects the second array of ventilation holes and the air transport pipe. (Item 9) The apparatus according to item 1, further comprising a cover which is placed on the wafer and the long pins. (Item 10) The apparatus according to item 9, wherein the cover includes a gap within the area of the cover corresponding to the position of the inlay. (Item 11) The apparatus according to item 1, wherein the inlay includes a recess defining a margin around the periphery of the inlay. (Item 12) The apparatus according to item 11, wherein the short peg contacts the inlay within the recess. (Item 13) A method for cutting an eyepiece from a wafer, wherein the method is The wafer is positioned within the fixing device, and the fixing device is A floor portion, the floor portion defining an array of pinholes configured to hold a plurality of pins, An inlay resting on the shorter pins of the plurality of pins, wherein the inlay defines holes, the holes receive the medium-length pins of the plurality of pins, and stabilizes the inlay so as not to move in a direction parallel to the first base, and the wafer resting on the longer pins of the plurality of pins, and To be equipped with, The wafer is laser-cut into a shape corresponding to the shape of the inlay, thereby creating a cut portion of the wafer, wherein the cut portion of the wafer is placed on the inlay. Methods that include... (Item 14) The method according to item 13, further comprising applying a vacuum to the floor to remove debris generated by the laser cutting from the fixture. (Item 15) The method according to item 13, further comprising positioning the wafer in direct contact with the inlay. (Item 16) The method of item 13, further comprising bonding a plastic film to the wafer before laser cutting the wafer. (Item 17) The method according to item 13, wherein the space defined by the fixing device directly below the wafer is located along the cutting line of the laser. (Item 18) The method according to item 17, wherein the space reduces the reflection of the laser used to cut the wafer. (Item 19) The method according to item 13, wherein the short pins prevent the inlay from bending during laser cutting of the wafer. (Item 20) The method according to item 13, wherein the laser cutting is achieved in conjunction with a laser cutting machine that is numerically controlled using a computer.