JP-2022533102-A5 -

Dates

Publication Date

20230519

Application Date

20200520

Description

A composite layer formed from the compositions disclosed herein can exhibit thermosetting properties due to the formation of a crosslinked network. During the polymerization of the crosslinked network, the viscosity and temperature at which the film begins to soften and reach its minimum melt viscosity, and before the crosslinking agent begins to increase its molecular weight, can be determined to be the minimum melt viscosity of the composition at the corresponding temperature. The composition can have a minimum melt viscosity of 80 kilopoise ( kP ) or more, or 80 to 700 kP , as determined by heating at a rate of 5°C per minute using the vibration rheology of parallel plates. The composite layer derived from the aforementioned composition may have a minimum melt viscosity of 80 kilopoise or more, or 80 to 700 kilopoise ; a peel strength to copper of 0.54 kilograms or more per centimeter; an average coefficient of thermal expansion in the z direction of parts per 95 million or less per degree Celsius at 150 to 250 degrees Celsius, or parts per 90 million or less per degree Celsius; a dielectric constant of 2.5 to 3.5 at 10 gigahertz; and a dielectric loss of 0.0030 or less, or 0.0021 or less, or 0.001 to 0.0025 at 10 gigahertz. A multilayer article is disclosed that includes a composite layer bonded to the low-profile side of a conductive layer such as a low-profile copper layer. In the examples, the minimum melt viscosity (MMV) was determined using the vibration rheology of parallel plates with a temperature increase of 5°C per minute. The minimum melt viscosity and corresponding temperature can be defined as the viscosity and temperature at which the film begins to soften and reaches the minimum melt viscosity, and before the crosslinking agent begins to increase its molecular weight. The minimum melt viscosity is expressed in kilopoise ( kP ). Embodiment 17: A composite layer according to Embodiment 16 having one or more of the following properties. The composition may have a minimum melt viscosity of 80 kP or more or 80 to 700 kP . The composite layer may have a peel strength to copper of 0.54 kg/cm or more. The composite layer may have an average thermal expansion coefficient in the z direction of 95 ppm/°C or less, or 90 ppm/°C or less, at 150 to 250°C. The composite layer may have a dielectric constant of 2.5 to 3.5 at 10 GHz. The composite layer may have a dielectric loss of 0.0030 or less, or 0.0021 or less, or 0.001 to 0.0025 at 10 GHz.