JP-2022536293-A5 -

Dates

Publication Date

20230524

Application Date

20200522

Description

In some embodiments, the apparatus may further include a controller configured to control a multi-station processing apparatus to deposit material onto a substrate at a plurality of process stations. In the case of a first flow path fluidly connected to a first station of the plurality of process stations, a first temperature control unit may be in thermal contact with the first flow element, and in the case of a second flow path fluidly connected to a second station of the plurality of process stations, a second temperature control unit may be in thermal contact with the second flow element, and the controller may include control logic for providing a substrate to each of the process stations and simultaneously depositing a first layer of material onto the first substrate at the first process station and a second layer of material onto the second substrate at the second process station, maintaining the first flow element at a first temperature for at least part of the deposit and maintaining the second flow element at a second temperature different from the first temperature. In some embodiments, a method can be provided for depositing material onto a substrate in a multi-station processing apparatus having a first station equipped with a first showerhead and a second station equipped with a second showerhead. The method includes providing a first substrate on a first base of a first station, providing a second substrate on a second base of a second station, simultaneously depositing a first layer of material onto the first substrate and depositing a second layer of material onto the second substrate, and maintaining a first flow element of a first channel at a first temperature for at least a portion of the simultaneous deposit, wherein the first channel is fluidically connected at a joint to a first showerhead, and maintaining a second flow element of a second channel at a second temperature different from the first temperature, wherein the second channel is fluidically connected at a joint to a second showerhead. Similarly, while operations may be depicted in a specific order in the diagrams, it should be understood that this does not mean that such operations must be performed in a specific or sequential order, or that all illustrated operations must be performed, in order to achieve the desired result. Furthermore, the diagrams may schematically depict one or more exemplary processes in the form of flow charts. However, other operations not depicted can also be incorporated into the schematically illustrated exemplary processes. For example, one or more additional operations may be performed before, after, simultaneously with, or between the illustrated operations. In some situations, multitasking and parallel processing may be advantageous. Furthermore, the separation of various system components in the embodiments described above should not be understood as requiring such separation in all embodiments, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged in multiple software products. In addition, other embodiments are also within the scope of the following claims. In some cases, the actions enumerated in the claims may be performed in a different order and still achieve the desired result. This disclosure may be implemented in the following forms. [Form 1] A multi-station processing device, Processing chamber and Multiple process stations within the processing chamber, each including a showerhead having a gas inlet, A gas supply system including a junction and multiple flow paths, wherein each flow path is Includes flow elements, The system includes a temperature control unit that is thermally connected to the flow element and is controllable to change the temperature of the flow element, One of the process stations is fluidly connected to the junction point by a different flow path, such that each of the multiple process stations is fluidly connected to the junction point. Gas supply system and A device equipped with the following features. [Form 2] The apparatus described in Embodiment 1, The apparatus is such that the temperature control unit can be controlled to change the flow conductance of the thermally contacting flow element via a temperature change. [Form 3] The apparatus described in Embodiment 1, The apparatus includes a temperature control unit which comprises a heating element configured to heat the flow element in thermal contact with it. [Form 4] The apparatus described in Embodiment 3, The apparatus includes a heating element, a resistive heating element, a thermoelectric heater, and/or a fluid conduit, the fluid conduit configured to carry a heated fluid. [Form 5] The apparatus described in Embodiment 1, Each showerhead further includes a faceplate and a temperature control unit that is thermally connected to the showerhead and is controllable to change the temperature of a porti