JP-2022540589-A5 -

Dates

Publication Date

20230509

Application Date

20200629

Description

A method for measuring a reference point in real time during lithograph printing may also be provided. In one embodiment, this method is: - A step of modulating the exposure beam according to the exposure pattern, - A step of measuring the location of several alignment marks previously patterned on the substrate, - The steps include delivering a modulated exposure beam onto a substrate as an image provided by an optical modulator, - A step of calculating the orientation of the substrate based on the position of the alignment marks, - Includes the step of controlling the delivery of a modulated exposure beam with respect to the calculated orientation of the substrate. The present invention provides, for example, the following: (Item 1) A device for measuring a reference point in real time during lithograph printing, A light source that provides an exposure beam, - An optical modulator that modulates the exposure beam according to the exposure pattern, - A measurement system configured to measure the positions of several alignment marks previously arranged on a substrate, - An exposure optical system comprising a control unit, wherein the exposure optical system delivers the modulated exposure beam onto the substrate as an image provided by the optical modulator, and Equipped with, The exposure system control unit is, - Calculate the orientation of the substrate based on the position of the alignment marks, - Controlling the delivery of the modulated exposure beam with respect to the calculated orientation of the substrate. A device configured to perform the following actions. (Item 2) The device according to item 1, wherein the XY position and rotation matrix for each alignment mark is calculated simultaneously with the exposure, and the calculated position/rotation is used within the exposure system to control the positioning of subsequent exposed images. (Item 3) The exposure pattern is provided in stripes, and as each stripe is exposed, the position of the alignment mark within the same stripe and/or within the next stripe to be printed is measured, according to the device described in item 2. (Item 4) The measurement system is the device described in item 1, which includes a camera. (Item 5) The camera system is arranged to use direct high data rate transfer from the camera chip directly into the FPGA or processor for data transfer to a pattern calculation module within the high-speed analysis and exposure optical system control unit, as described in item 4. (Item 6) A device as described in any one of items 1 to 5, in which an electrical connection pad on the die is used as a alignment mark. (Item 7) A device according to any one of items 1 to 6, wherein the body of the die or a part thereof is used as a conformity mark. (Item 8) The measurement system and the exposure optical system are devices according to any one of items 1 to 7, having at least partially parallel optical paths. (Item 9) The camera's area of interest is positioned in close proximity to the exposure optical system and is mechanically connected to the exposure optical system, as described in any one of items 4 to 8. (Item 10) The measurement system is a device according to any one of items 4 to 9, which defines the area of the camera of interest and optimizes high-speed camera data transfer. (Item 11) The measurement system, like a line sensor, defines a special focus camera area for automatic focused laser light reflection detection, and utilizes the defined special focus camera area for high-speed camera data transfer for automatic focusing calculation and automatic focusing adjustment, as described in any one of items 4 to 10. (Item 12) The device according to any one of items 1 to 11, wherein the light source includes a plurality of light sources having at least one wavelength. (Item 13) The exposure optical system comprises a projection lens, and the light source is positioned and optically coupled through the projection lens, as described in item 12. (Item 14) The exposure optical system comprises a projection lens, and the light source is located at the bottom of the exposure optical system and surrounds the projection lens, as described in item 12. (Item 15) A method for measuring a reference point in real time during lithograph printing, - A step of modulating the exposure beam according to the exposure pattern, - A step of measuring the positions of several alignment marks previously arranged on the substrate, - The steps of delivering the modulated exposure beam onto the substrate as an image provided by the optical modulator, - A step of calculating the orientation of the substrate based on the position of the alignment marks, - A step of controlling the delivery of the modulated exposure beam with respect to the calculated orientation of the substrate. Methods that include... (Item 16) The device according to item 15, comprising calculating the XY position and rotation matrix for each alignment mark simultaneously with the