JP-2025022167-A5 -

Dates

Publication Date

20260511

Application Date

20230802

Description

As shown in Figure 1, the lead frame 1 has a plurality of individualization regions 110. For example, the individualization regions 110 have a rectangular planar shape. Figure 2 shows one of the individualization regions 110. Each individualization region 110 has an annular frame portion 10 and a plurality of lead portions 20. The frame portion 10 is shared between two adjacent individualization regions 110. Each lead portion 20 extends from the frame portion 10 inward. The frame portion 10 is formed in a rectangular shape, and the plurality of lead portions 20 extend inward from each of the four sides of the frame portion 10. As the material for the lead frame 1, for example, copper (Cu), Cu alloy, 42 alloy, etc. can be used. The thickness of the lead frame 1 can be, for example, about 100 μm to 300 μm . The lead frame 1 does not have to have a die pad portion. First, as shown in Figure 3(a), a metal plate 101 of a predetermined shape is prepared. The metal plate 101 is a component that is cut and separated into individual pieces for each individual piece region 110. As the material for the metal plate 101, for example, copper, copper alloy, 42 alloy, etc. can be used. The thickness of the metal plate 101 can be, for example, about 100 μm to 300 μm .