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JP-2026074487-A - Dry film, light-emitting electronic component, and method for manufacturing the same

JP2026074487AJP 2026074487 AJP2026074487 AJP 2026074487AJP-2026074487-A

Abstract

[Problem] To provide a dry film capable of suppressing brightness loss in a display when the light-emitting element is lit, a light-emitting electronic component using the film, and a method for manufacturing the same. [Solution] The present invention relates to a dry film for pressing onto the surface on which a plurality of light-emitting elements are arranged on an element-equipped substrate, wherein the dry film includes at least a colored curable resin layer for shielding light between the plurality of light-emitting elements, and the relationship shown below (Equation 1) holds between the average absorbance values in the wavelength range of 360 to 830 nm, the average absorbance values in the wavelength range of 450 to 480 nm, the average absorbance values in the wavelength range of 510 to 540 nm, and the average absorbance values in the wavelength range of 620 to 650 nm of the ultraviolet-visible absorption spectrum obtained by measuring the colored resin layer after curing. [Selection Diagram] Figure 1

Inventors

  • 片桐 航

Assignees

  • 信越ポリマー株式会社

Dates

Publication Date
20260507
Application Date
20241021

Claims (16)

  1. A dry film for pressing onto the surface of an element-equipped substrate on which a plurality of light-emitting elements are arranged, wherein the plurality of light-emitting elements are arranged on the substrate, The present invention includes at least a colored curable resin layer for shielding light between the plurality of light-emitting elements, A dry film characterized in that the following relationship (Equation 1) holds between the average absorbance between wavelengths of 360 to 830 nm, the average absorbance between wavelengths of 450 to 480 nm, the average absorbance between wavelengths of 510 to 540 nm, and the average absorbance between wavelengths of 620 to 650 nm, obtained by measuring the ultraviolet-visible absorption spectrum of the colored resin layer after curing, the average absorbance between wavelengths of 450 to 480 nm, the average absorbance between wavelengths of 510 to 540 nm, and the average absorbance between wavelengths of 620 to 650 nm. (Abs. all: average absorbance at wavelengths of 360–830 nm, Abs. 2: average absorbance between wavelengths of 450–480 nm, Abs. 3: average absorbance between wavelengths of 510–540 nm, Abs. 5: average absorbance between wavelengths of 620–650 nm.)
  2. The dry film according to claim 1, characterized in that the colored curable resin layer contains a dye.
  3. The dry film according to claim 2, characterized in that the colored curable resin layer contains two or more different dyes.
  4. The dry film according to claim 2, characterized in that the colored curable resin layer further contains a pigment.
  5. The dry film according to claim 1, further comprising a transparent curable resin layer with higher light transmittance than the aforementioned colored curable resin layer.
  6. The dry film according to claim 1, characterized in that the total light transmittance of the colored resin layer is 0 to 80%.
  7. The dry film according to claim 6, characterized in that the total light transmittance of the colored resin layer is 0 to 30%.
  8. The dry film according to claim 1, characterized in that the storage modulus of the colored curable resin layer at 100°C is 1.0 × 10⁵ Pa or less.
  9. The dry film according to claim 1, characterized in that the colored curable resin layer contains an epoxy resin.
  10. The dry film according to claim 1, characterized in that the colored curable resin layer contains a cationic polymerization initiator.
  11. The dry film according to claim 1, characterized in that the colored curable resin layer contains an elastomer.
  12. The dry film according to claim 1, characterized in that the following relationship (Equation 2) holds between the minimum of the average absorbance values obtained by measuring the colored resin layer after curing, the average absorbance values between wavelengths of 410 to 440 nm, the average absorbance values between wavelengths of 560 to 590 nm, and the average absorbance values between wavelengths of 700 to 730 nm, and the average absorbance value between wavelengths of 360 to 830 nm. (Abs. (min): The minimum of the average absorbance values between wavelengths of 410-440 nm, 560-590 nm, and 700-730 nm. Abs. all: Average absorbance values between wavelengths of 360-830 nm.)
  13. A substrate with multiple light-emitting elements arranged on the substrate, A cured dry film according to any one of claims 1 to 12, which is in a state of being pressed against the surface on which the plurality of light-emitting elements are arranged on the substrate with the element, Equipped with, A light-emitting electronic component characterized in that the following relationship (Equation 1) holds between the average absorbance between wavelengths of 360 to 830 nm, the average absorbance between wavelengths of 450 to 480 nm, the average absorbance between wavelengths of 510 to 540 nm, and the average absorbance between wavelengths of 620 to 650 nm, obtained by measuring the ultraviolet-visible absorption spectrum of the colored resin layer contained in the cured dry film, and the above-mentioned relationship. (Abs. all: Average absorbance between wavelengths of 360 and 830 nm; Abs. 2: Average absorbance between wavelengths of 450 and 480 nm; Abs. 3: Average absorbance between wavelengths of 510 and 540 nm; Abs. 5: Average absorbance between wavelengths of 620 and 650 nm.)
  14. The light-emitting electronic component according to claim 13, characterized in that the cured dry film further comprises a transparent resin layer with higher light transmittance than the colored resin layer, located on the side further from the substrate than the colored resin layer.
  15. The light-emitting electronic component according to claim 14, characterized in that the thickness of the transparent resin layer is 0.1 to 5.0 times the height of the plurality of light-emitting elements.
  16. A step of placing the dry film according to any one of claims 1 to 12 on the surface of an element-equipped substrate on which a plurality of light-emitting elements are arranged, A step of filling at least a portion of the colored curable resin layer between the plurality of light-emitting elements, A method for manufacturing a light-emitting electronic component, comprising the step of curing all curable resin layers, including the colored curable resin layer.

Description

This invention relates to a dry film, a light-emitting electronic component, and a method for manufacturing the same. In recent years, displays using extremely small light-emitting diodes, known as mini-LEDs or micro-LEDs, have attracted considerable attention. There are two main methods for using these tiny LEDs in displays. One method involves arranging numerous LEDs on a substrate to form a liquid crystal backlight, and then locally controlling the brightness of this backlight. The other method involves emitting light from red (R), green (G), and blue (B) LEDs, sending light of each color to the viewer's eye on a pixel-by-pixel basis. Light-emitting diodes, such as mini-LEDs or micro-LEDs, are generally arranged on a substrate. When multiple light-emitting diodes (referred to as light-emitting elements) are arranged on a substrate, it is necessary to shield the space between adjacent light-emitting elements. A method for shielding the space between multiple light-emitting elements with a light-shielding resin is known, for example, the use of a dry film (see Conventional Art 1 and Patent Document 1). A dry film is, for example, a film obtained by coating and drying a light-shielding resin composition on a protective film. When a dry film is pressed onto multiple light-emitting elements on a substrate, a light-shielding resin layer is formed not only in the gaps between the light-emitting elements but also on the top surface (light-emitting surface) of each element. Under these circumstances, this resin layer may block the light reaching the viewer of the display. To prevent this, the conventional technology 1 employs a method of removing the resin layer from the light-emitting surface of the light-emitting element by etching, such as through plasma treatment, and then covering the removed surface with a light-transmitting encapsulant. However, the above-mentioned conventional technology 1 requires a considerable amount of time for etching, leading to increased manufacturing costs. Furthermore, it is difficult to completely remove the light-shielding resin layer (hereinafter also referred to as the "light-shielding layer") on the light-emitting surface of the light-emitting element, making it difficult to completely prevent the diffusion of light that should reach the viewer of the display. In addition, the process of laminating a highly transparent sealing film after the etching process is also required, resulting in a complex manufacturing process. To solve the problems of the above-mentioned prior art 1, the present inventors have developed a novel dry film having a structure in which a curable light-shielding layer and a curable surface layer with higher light transmittance than the curable light-shielding layer are laminated, and the storage modulus of the curable surface layer is greater than that of the curable follow-up layer (see prior art 2 and Patent Document 2). When such a novel dry film is pressed toward the substrate side with the curable light-shielding layer in contact with the top surface side of multiple light-emitting elements, the curable light-shielding layer, which is pressed by the curable surface layer, easily moves between the multiple light-emitting elements due to its relatively small storage modulus. After mounting the dry film to the substrate, curing the curable light-shielding layer and the curable surface layer fills the spaces between the multiple light-emitting elements, and a light-emitting electronic component can be obtained in which the surface layer is positioned on the top surface side of the multiple light-emitting elements. This solves the problems of the above-mentioned prior art 1. Japanese Patent Publication No. 2022-22562Japanese Patent Publication No. 2024-19872 Figure 1 shows a cross-sectional view of a dry film comprising a colored curable resin layer and a transparent curable resin layer as curable resin layers.Figure 2 shows a cross-sectional view identical to Figure 1 of a dry film having only a colored curable resin layer as the curable resin layer.Figure 3 shows a cross-sectional view identical to that of Figure 1, when the dry film shown in Figure 1 is positioned so that its colored curable resin layer is in contact with the top surface of the light-emitting element on the substrate with the element.Figure 4 shows a cross-sectional view identical to Figure 1, showing the state after the dry film has been pressed onto the substrate with the elements attached, progressing from the stage in Figure 3 to the point where the colored curable resin layer and the transparent curable resin layer shown in Figure 1 are embedded between the light-emitting elements.Figure 5 shows a cross-sectional view identical to Figure 1, showing the state after further progress from the stage in Figure 4, where the protective sheet on the transparent curable resin layer has been peeled off and the curing process has been performed. Next, embodiments of the present invention wi