JP-2026074494-A - Curable composition, cured product, laminate, and method for producing the cured product

Abstract

【assignment】 The object of the present invention is to provide a curable composition, a cured product, a laminate, and a method for producing a cured product that has good kneadability and yields a cured product with high gas barrier function and excellent adhesion. [Solution Method] A curable composition comprising a tetracarboxylic acid modified product (A), at least one of a silica filler (B) and an insulating thermal conductive filler (C), and a curing agent (D), wherein the tetracarboxylic acid modified product (A) is a reaction product of an aliphatic tetracarboxylic anhydride (a1) and a compound (a2) having one hydroxyl group at its terminus, and the curable composition contains 0.1 to 5% by mass of the tetracarboxylic acid modified product (A) and a total of 40 to 95% by mass of the silica filler (B) and insulating thermal conductive filler (C) in 100% by mass of the nonvolatile content of the curable composition. [Selection Diagram] None

Inventors

• 宇佐 勇貴
• 田中 基貴
• 小林 拓也

Assignees

• ａｒｔｉｅｎｃｅ株式会社

Dates

Publication Date

20260507

Application Date

20241021

Claims (7)

1. The material comprises a tetracarboxylic acid modified product (A), at least one of a silica filler (B) and an insulating thermal conductive filler (C), and a curing agent (D). The tetracarboxylic acid modified product (A) is a reaction product of an aliphatic tetracarboxylic anhydride (a1) and a compound (a2) having one hydroxyl group at its terminal end. A curable composition containing 0.01 to 5% by mass of a tetracarboxylic acid modified product (A) and a total of 40 to 95% by mass of silica filler (B) and insulating thermal conductive filler (C) in 100% by mass of the nonvolatile content of the curable composition.
2. The curable composition according to claim 1, wherein compound (a2), having one hydroxyl group at its terminus, contains at least one of an ether bond and an ester bond in part of its molecular structure, and has a weight-average molecular weight of 500 to 10,000.
3. The curable composition according to claim 1, wherein the curing agent (D) comprises an epoxy-based curing agent.
4. The curable composition according to claim 1, wherein the insulating thermally conductive filler (C) contains alumina.
5. A cured product formed from the curable composition described in any one of claims 1 to 4.
6. A laminate comprising an adhesive layer made of the cured product described in claim 5, and a substrate.
7. The material comprises a tetracarboxylic acid modified product (A), at least one of a silica filler (B) and an insulating thermal conductive filler (C), and a curing agent (D). The tetracarboxylic acid modified product (A) is a reaction product of an aliphatic tetracarboxylic anhydride (a1) and a compound (a2) having one hydroxyl group at its terminal end. A method for producing a cured product comprising the steps of forming a curable composition by thermal melting and then thermally curing it, wherein the curable composition contains 0.1 to 5% by mass of a tetracarboxylic acid modified product (A), and a total of 40 to 95% by mass of silica filler (B) and insulating thermal conductive filler (C) in 100% by mass of the nonvolatile content of the curable composition.

Description

This invention relates to a curing agent composition, a cured product of the curable composition, a laminate, and a method for producing the cured product. Integrated circuits (ICs) are essential components of electronic devices, such as microprocessors, transistors, and memory, and are incorporated into various electronic devices like computers, smartphones, and flat-panel displays. Insulating resins such as encapsulants, adhesives, underfills, and potting materials are used in the packages containing ICs or on the circuit boards on which they are mounted. Patent Document 1 discloses a resin composition for use as a mold underfill material for WL-CS (wafer-level chip-size packages), comprising a polymer resin having a number-average molecular weight within a specific range and one or more structures selected from polybutadiene, polyisoprene, polycarbonate, (meth)acrylate, and polysiloxane structures, an inorganic filler, an epoxy resin, and a curing accelerator. Furthermore, Patent Document 2 proposes a sealing film containing one or more elastomers selected from the group consisting of butadiene-based rubber and silicone-based rubber, an epoxy resin, a curing agent, and an inorganic filler, wherein the elastomer component is present in a specific amount. Furthermore, Patent Document 3 discloses a radically polymerizable polyamide, which is a reaction product of a polyamide having a dimer structure composed of a dimer acid or dimer amine, and a phenolic hydroxyl group unit, and a hydroxyl group in the side chain, with a radically polymerizable epoxy. Also disclosed is a resin composition containing this radically polymerizable polyamide, a photopolymerization initiator, an epoxy resin, a phenolic resin, a silica filler, a solvent, etc. Furthermore, Patent Document 4 discloses a thermosetting resin composition containing a polyamide (A) having a dimer structure formed by polymerizing a polybasic acid monomer and a polyamine monomer, and having phenolic hydroxyl groups in its side chains, and a trifunctional or more compound (B) that can react with the phenolic hydroxyl groups. Japanese Patent Publication No. 2017-057313International Publication No. 2016/136741Japanese Patent Publication No. 2019-119886International Publication No. 2016/001949 The present invention will now be described in detail. It goes without saying that other embodiments are also included within the scope of the present invention, as long as they are consistent with the spirit of the invention. Furthermore, numerical ranges specified using "~" in this specification include the numerical values before and after "~" as the lower and upper limits. Also, in this specification, "film" and "sheet" are not distinguished by thickness. In other words, "sheet" in this specification includes thin film-like materials, and "film" in this specification includes thick sheet-like materials. Furthermore, unless otherwise noted, the various components mentioned in this specification may be used individually or in combination of two or more. In this specification, "Mw" and "Mn" are the weight-average molecular weight and number-average molecular weight, respectively, determined by gel permeation chromatography (GPC) measurement. These can be measured by the method described in the [Examples] section. [Tetracarboxylic acid modified product (A)] Tetracarboxylic acid modified product (A) is a reaction product of an aliphatic tetracarboxylic anhydride (a1) and a compound (a2) having one hydroxyl group at its terminus. Since tetracarboxylic acid modified product (A) is a bulky polymer, the carboxylic acid residues widen the spacing between fillers, and the interaction with resin components such as the curing agent (D) improves dispersibility, resulting in improved kneadability, gas barrier properties, and adhesive strength. The content of the tetracarboxylic acid modified product (A) is 0.01 to 5% by mass, preferably 0.5 to 3% by mass, based on 100% by mass of the non-volatile content of the curable composition. This ratio allows for a good balance between gas barrier properties and adhesive strength at 25°C. <Aliphatic tetracarboxylic anhydride (a1)> The aliphatic tetracarboxylic anhydride (a1) may be a compound having a linear hydrocarbon structure or a compound having an alicyclic hydrocarbon structure. The "linear hydrocarbon structure" is a linear hydrocarbon structure and/or a branched hydrocarbon structure that may have unsaturated bonds. The "alicyclic hydrocarbon structure" is an alicyclic hydrocarbon that may have unsaturated bonds and may be monocyclic or polycyclic. These may contain substituents. Furthermore, the portion not adjacent to the acid anhydride may contain an aromatic group. Examples of aliphatic tetracarboxylic anhydrides (a1) include tetracarboxylic dianhydrides having a chain-like hydrocarbon structure, such as 1,2,3,4-butanetetracarboxylic acid, 1,2,3,4-pentanetetracarboxylic acid, 1,2,4,5-pentanetetracarboxylic acid, 1,2,3,4-hexane